# US 10,502,499 B2 · Heat storage molded body, heat storage laminate, and heat storage molded body production method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,502,499 B2
- Document ID: US10502499B2
- Status: Granted
- Kind: B2
- Application number: 15/831,602
- Filed: 2017-12-05
- Published: 2018-04-05
- Granted: 2019-12-10
- Earliest claimed: 2015-06-23
- Assignees: DIC Corporation
- Applicants: DIC Corporation
- Inventors: Kenichi Fujisaki; Yuko Koseki
- Web page: https://patentgrep.com/patent/US10502499B2

## CPC

- F28D 20/023: {the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure}
- B32B 5/16: characterised by features of a layer formed of particles, e.g. chips, powder {or granules (layer formed of natural mineral particles B32B19/00; layer being formed of wood fibres, chips or particles B32B21/02)}
- B32B 5/18: characterised by features of a layer {of} foamed material
- B32B 5/30: one layer {being formed of particles, e.g. chips,} granules, powder
- B32B 9/007: {comprising carbon, e.g. graphite, composite carbon}
- B32B 9/045: {of synthetic resin}
- B32B 9/048: {made of particles}
- B32B 15/08: of synthetic resin
- B32B 15/082: comprising vinyl resins; comprising acrylic resins
- B32B 15/085: comprising polyolefins
- B32B 15/088: comprising polyamides
- B32B 15/09: comprising polyesters
- B32B 15/095: comprising polyurethanes
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/065: {of foam}
- B32B 27/08: of synthetic resin
- B32B 27/10: of paper or cardboard
- B32B 27/14: next to a particulate layer
- B32B 27/18: characterised by the use of special additives
- B32B 27/22: using plasticisers
- B32B 27/281: {comprising polyimides}
- B32B 27/286: {comprising polysulphones; polysulfides}
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/306: {comprising vinyl acetate or vinyl alcohol (co)polymers}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- B32B 27/40: comprising polyurethanes
- C08K 5/0016: {Plasticisers}
- C08K 9/10: Encapsulated ingredients
- C08L 101/00: Compositions of unspecified macromolecular compounds
- C09K 5/063: {Materials absorbing or liberating heat during crystallisation; Heat storage materials}
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/205: Metallic coating
- B32B 2255/26: Polymeric coating
- B32B 2260/028: Paper layer
- B32B 2260/04: Impregnation, embedding, or binder material
- B32B 2264/025: Acrylic resin particles, e.g. polymethyl methacrylate or ethylene-acrylate copolymers
- B32B 2264/101: Glass
- B32B 2264/102: Oxide or hydroxide
- B32B 2266/0228: Aromatic vinyl resin, e.g. styrenic (co)polymers
- B32B 2266/025: Polyolefin
- B32B 2266/0278: Polyurethane
- B32B 2266/0285: Condensation resins of aldehydes, e.g. with phenols, ureas, melamines
- B32B 2307/302: Conductive
- B32B 2307/304: Insulating
- B32B 2307/306: Resistant to heat
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- B32B 2307/54: Yield strength; Tensile strength
- B32B 2307/546: Flexural strength; Flexion stiffness
- B32B 2307/58: Cuttability
- B32B 2307/732: Dimensional properties
- B32B 2419/00: Buildings or parts thereof
- B32B 2457/00: Electrical equipment
- B32B 2457/10: Batteries
- B32B 2509/10: Refrigerators or refrigerating equipment
- B32B 2605/003: Interior finishings
- B32B 2605/10: Trains
- B32B 2605/18: Aircraft
- B32B 2607/02: Wall papers, wall coverings
- F28D 20/02: using latent heat
- F28D 20/021: {the latent heat storage material and the heat-exchanging means being enclosed in one container (F28D20/023 - F28D20/028 take precedence)}
- Y02E 60/14: Thermal energy storage
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.

## Claims

### Claim 1

A heat storage molded body comprising
a heat storage medium dispersed in a resin matrix, wherein the heat storage medium is heat storage particles containing a latent heat storage material encapsulated therein and the latent heat storage material shows a solid/liquid phase transition in a temperature range of −20° C. to 120° C.,
wherein the resin matrix comprises a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and
wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.

### Claim 2 (depends on 1)

The heat storage molded body according to claim 1, wherein the HSP distance between the non-phthalate plasticizer and the thermoplastic resin is 15 or less.

### Claim 3 (depends on 1)

The heat storage molded body according to claim 1, wherein the non-phthalate plasticizer has a gelation end point temperature of 150° C. or less.

### Claim 4 (depends on 1)

The heat storage molded body according to claim 1, wherein the heat storage molded body is molded at 150° C. or less.

### Claim 5 (depends on 1)

The heat storage molded body according to claim 1, wherein the content of the non-phthalate plasticizer in the resin composition is from 30 to 150 parts by mass per 100 parts by mass of the thermoplastic resin.

### Claim 6 (depends on 1)

The heat storage molded body according to claim 1, wherein the content of the heat storage medium in the heat storage molded body is from 10 to 80 mass %.

### Claim 7 (depends on 1)

The heat storage molded body according to claim 1, wherein the heat storage molded body has a sheet shape.

### Claim 8 (depends on 1)

A heat storage laminate comprising at least one of a heat diffusion layer and a heat insulation layer laminated on the heat storage molded body according to claim 1.

### Claim 9 (depends on 1)

A heat storage laminate comprising a nonflammable layer laminated on the heat storage molded body according to claim 1.