# US 10,502,463 B2 · Thermoelectric cooler controller and angled mounting thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,502,463 B2 - Document ID: US10502463B2 - Status: Granted - Kind: B2 - Application number: 16/128,375 - Filed: 2018-09-11 - Published: 2019-01-24 - Granted: 2019-12-10 - Earliest claimed: 2014-11-26 - Assignees: Hoffman Enclosures, Inc. - Applicants: Hoffman Enclosures, Inc. - Inventors: Shawn Thao; Jason Dickmann; Victor Divine; Michael Rasmussen - Web page: https://patentgrep.com/patent/US10502463B2 ## CPC - F25B 21/04: reversible - F25B 21/02: using Peltier effect; using Nernst-Ettinghausen effect - H05K 7/20009: {using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - F25B 2321/021: Control thereof - F25B 2321/023: Mounting details thereof - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/28: comprising Peltier coolers - H10W 40/43: by flowing gases, e.g. forced air cooling - F25B: REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosure, rather than requiring its own separate secure enclosure. The controller can further be installed within a housing of the thermoelectric cooling unit, which housing does not increase the footprint of the cooling unit. The housing can include a cover that separates the space within the housing into two compartments, with the controller mounted at an angle that allows the controller to fit within one of the compartments and under the cover. ## Claims ### Claim 1 A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a cooling unit comprising: a frame that mounts the cooling unit to the enclosure such that the cooling unit cools a first interior space of the enclosure; a housing mounted on the frame and extending into the first interior space of the enclosure when the cooling unit is mounted on the enclosure; and one or more fans supported at least partially by the frame and cooperating to circulate air that cools the first interior space; and a controller in electrical communication with the cooling unit and configured to operate one or more components of the cooling unit, the controller comprising: a circuit board mounted at an acute angle, with respect to vertical when the cooling unit is mounted on the enclosure, within the housing, the acute angle selected to allow the controller to be disposed entirely within the housing; an input quick connector disposed on the circuit board and configured to receive a first cable connector for providing power to the circuit board; and at least a first output quick connector disposed on the circuit board in electrical communication with the input quick connector, and configured to receive a second cable connector for supplying one or more signals from at least the input quick connector to the one or more components of the cooling unit. ### Claim 2 (depends on 1) The thermal management system of claim 1, wherein the housing comprises: a plurality of walls; and a cover attachable to one or more of the plurality of walls and, when attached, cooperating with the plurality of walls to enclose a portion of the housing, the controller being disposed within the portion of the housing enclosed by the cover. ### Claim 3 (depends on 2) The thermal management system of claim 2, wherein a first fan of the one or more fans is disposed within the housing outside of the portion of the housing enclosed by the cover. ### Claim 4 (depends on 3) The thermal management system of claim 3, wherein the one or more fans include the first fan and a second fan mounted on an external side of the frame and pulling air into the cooling unit. ### Claim 5 (depends on 1) The thermal management system of claim 1, wherein the cooling unit further comprises an internal heat sink attached to the frame on an internal side of the frame that faces into the first interior space when the cooling unit is installed on the enclosure, the internal heat sink being disposed between the frame and the housing. ### Claim 6 A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit mounted on the enclosure such that the cooling unit cools an interior space of the enclosure, the cooling unit comprising a frame and a first fan mounted on the frame for circulating air within the interior space; a housing mounted on the cooling unit, the housing being disposed within the enclosure when the cooling unit is mounted on the enclosure; and a controller in electrical communication with the cooling unit and configured to operate one or more components of the cooling unit, the controller being located within the housing and including: a circuit board; an input quick connector disposed on the circuit board and configured to receive a first cable connector for providing power to the circuit board; and a first output quick connector disposed on the circuit board and electrically connected to the cooling unit to control the first fan. ### Claim 7 (depends on 6) The thermal management system of claim 6, wherein the housing comprises: a wall dividing the housing into a first compartment and a second compartment, the first compartment containing all or a part of the first fan, and the second compartment containing the controller; and a cover enclosing the second compartment, the controller mounted at an angle that allows the controller to fit within the second compartment and under the cover. ### Claim 8 (depends on 6) The thermal management system of claim 6, wherein the controller is mounted within the housing at an acute angle with respect to vertical. ### Claim 9 (depends on 6) The thermal management system of claim 6, wherein the first output quick connector comprises a first device header electrically connected to the input quick connector and supplies from the controller to the first fan a positive first fan voltage, a negative first fan voltage, and a first pulse-width modulated speed signal, and receives from the first fan a first fan speed signal. ### Claim 10 (depends on 9) The thermal management system of claim 9, wherein: the cooling unit further comprises a second fan mounted on the frame for pulling air into the enclosure; and the controller further comprises a second device header mounted on the circuit board and electrically connected to the cooling unit to control the second fan, the second device header supplying from the controller a positive second fan voltage, a negative second fan voltage, and a second pulse-width modulated speed signal, and receiving from the second fan a second fan speed signal. ### Claim 11 (depends on 6) The thermal management system of claim 6, wherein the first output quick connector supplies, from the controller, a negative H-bridge signal and a positive H-bridge signal, the negative H-bridge signal controlling a cooling operation of the cooling unit, and the positive H-bridge signal controlling a heating operation of the cooling unit. ### Claim 12 (depends on 11) The thermal management system of claim 11, wherein the first output quick connector is a four-pin connector electrically connected to the input quick connector and further supplies, from the controller, a positive fan voltage and a negative fan voltage. ### Claim 13 (depends on 6) The thermal management system of claim 6, wherein the housing comprises: a plurality of walls; and a cover attachable to one or more of the plurality of walls and, when attached, cooperating with the plurality of walls to enclose a portion of the housing, the controller being disposed within the portion of the housing enclosed by the cover. ### Claim 14 (depends on 13) The thermal management system of claim 13, wherein the cover comprises a first member forming within the housing a first compartment and a second compartment, and a second member integral with the first member and attached to a first wall of the plurality of walls, the second member cooperating with the first member and one or more of the plurality of walls to enclose the second compartment, the controller being mounted within the second compartment. ### Claim 15 (depends on 13) The thermal management system of claim 13, wherein the cover comprises an aperture for connecting a thermistor to the controller from external the housing. ### Claim 16 (depends on 6) The thermal management system of claim 6, wherein the cooling unit further comprises a heat sink attached to the frame and a sleeve attached to the frame and disposed over the heat sink, the housing being mounted on the frame via attachment of the housing to the sleeve. ### Claim 17 A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit mounted on the enclosure such that the cooling unit cools an interior space of the enclosure, the cooling unit comprising a frame and a first fan mounted on the frame for circulating air within the interior space; a housing mounted on the cooling unit, the housing being disposed within the enclosure when the cooling unit is mounted on the enclosure; and a controller in electrical communication with the cooling unit and configured to operate one or more components of the cooling unit, the controller being located within the housing and including a first output quick connector disposed on a circuit board and electrically connected to the cooling unit to control the first fan. ### Claim 18 (depends on 17) The thermal management system of claim 17, wherein the controller is mounted within the housing at an acute angle with respect to vertical. ### Claim 19 (depends on 18) The thermal management system of claim 18, wherein the first output quick connector comprises a first device header electrically connected to an input quick connector and supplies from the controller to the first fan a positive first fan voltage, a negative first fan voltage, and a first pulse-width modulated speed signal, and receives from the first fan a first fan speed signal. ### Claim 20 (depends on 19) The thermal management system of claim 19, wherein: the cooling unit further comprises a second fan mounted on the frame for pulling air into the enclosure; and the controller further comprises a second device header mounted on the circuit board and electrically connected to the cooling unit to control the second fan, the second device header supplying from the controller a positive second fan voltage, a negative second fan voltage, and a second pulse-width modulated speed signal, and receiving from the second fan a second fan speed signal.