# US 10,502,406 B2 · LED filament lamp using infrared radiation heat dissipation and LED lighting bar thereof

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- Number: US 10,502,406 B2
- Document ID: US10502406B2
- Status: Granted
- Kind: B2
- Application number: 16/236,351
- Filed: 2018-12-29
- Published: 2019-07-04
- Granted: 2019-12-10
- Earliest claimed: 2017-12-29
- Assignees: Shenzhen Fenggong Culture Communication Co., Ltd.
- Applicants: Shenzhen Fenggong Culture Communication Co., Ltd.
- Inventors: Siding He
- Web page: https://patentgrep.com/patent/US10502406B2

## CPC

- F21V 29/503: of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858)
- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F21K 9/238: Arrangement or mounting of circuit elements integrated in the light source
- F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
- F21K 9/66: Details of globes or covers forming part of the light source
- F21V 7/22: characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V 23/002: {Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm}
- F21V 23/003: {the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array}
- F21V 29/508: of electrical circuits
- F21V 19/0015: {Fastening arrangements intended to retain light sources}
- F21Y 2103/10: comprising a linear array of point-like light-generating elements
- F21Y 2115/10: Light-emitting diodes [LED]
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

Disclosed is an LED filament lamp using infrared radiation heat dissipation and an LED lighting bar thereof. The LED filament lamp includes a bulb shell, a core base with an exhaust pipe, a driver, a lamp cap, and at least one LED lighting bar with 2π light-emitting LED chip. The bulb shell and the core base are in vacuum sealing to form a vacuum sealed cavity filled with high heat conductivity gas; the LED lighting bar is located in the vacuum sealed cavity; one side of which is provided with a light-emitting layer of the LED chip, and the other side is provided with an infrared radiation converting layer; both ends of the LED lighting bar are fixed to the core base through a metal wire and connected to the driver; and the driver and the lamp cap are connected in series through an outer electrode leading-out wire.

## Claims

### Claim 1

An LED filament lamp using infrared radiation heat dissipation, comprising:
a bulb shell with an infrared transmittance larger than 0.8;
a core base with an exhaust pipe;
a driver;
a lamp cap;
at least one LED lighting bar with 2π light-emitting LED chip;
the bulb shell and the core base are in vacuum sealing to form a vacuum sealed cavity and the vacuum sealed cavity is filled with high heat conductivity gas;
the LED lighting bar is located in the vacuum sealed cavity, one side of the LED lighting bar being provided with a light-emitting layer of the LED chip, and the other side being provided with an infrared radiation converting layer;
both ends of the LED lighting bar are fixed to the core base through a metal wire respectively, and are connected to the driver which is fixed below the core base;
and the driver and the lamp cap are connected in series through an outer electrode leading-out wire.

### Claim 2 (depends on 1)

The LED filament lamp using infrared radiation heat dissipation according to claim 1, wherein the infrared radiation converting layer comprises a bonding material and a radiation cooling material, the bonding material being selected from one or more of silica gel, epoxy resin, plastic, transparent glue, transparent paint and polymer; and the radiation cooling material being made from a mixture of a radiation material with an infrared emissivity larger than 0.8 and a high heat conductivity material.

### Claim 3 (depends on 2)

The LED filament lamp using infrared radiation heat dissipation according to claim 2, wherein the radiation material with an infrared emissivity larger than 0.8 is selected from any one of mica powder, aluminium oxide, mullite, silicon oxide, and silicon carbide.

### Claim 4 (depends on 2)

The LED filament lamp using infrared radiation heat dissipation according to claim 2, wherein the high heat conductivity material is selected from one or more of graphite, carbon black, graphene, carbon nanotube, boron nitride, aluminum oxide, aluminum nitride, silicon nitride, magnesium oxide, and heat conducting ceramic powder.

### Claim 5 (depends on 1)

The LED filament lamp using infrared radiation heat dissipation according to claim 1, wherein the LED lighting bar is in an inverted V shape, an inverted U shape, an arc shape, a trapezoid shape or a right-angled U shape as a whole.

### Claim 6 (depends on 5)

The LED filament lamp using infrared radiation heat dissipation according to claim 5, wherein there are at least two LED lighting bars, connected in parallel with each other, and the middle parts of the lighting bars being connected by an insulating layer and in crossed arrangement.

### Claim 7 (depends on 6)

The LED filament lamp using infrared radiation heat dissipation according to claim 6, wherein the middle part of the LED lighting bar is provided with a through hole, and the insulating layer is provided with, at the corresponding position, a lug boss matched with the through hole.

### Claim 8 (depends on 4)

The LED filament lamp using infrared radiation heat dissipation according to claim 4, wherein the driver is coated with an insulating heat conducting mud which is connected to the lamp cap, and the insulating heat conducting mud is made from a mixture of the bonding material and the high heat conductivity material.

### Claim 9 (depends on 1)

The LED filament lamp using infrared radiation heat dissipation according to claim 1, wherein the bulb shell with an infrared transmittance larger than 0.8 is a silicate-based glass bulb shell.

### Claim 10 (depends on 9)

The LED filament lamp using infrared radiation heat dissipation according to claim 9, wherein the bulb shell uses an A-type bulb shell, a G-type bulb shell, a PAR-type bulb shell, a T-type bulb shell, a candle-type bulb shell, a P-type bulb shell, a PS-type bulb shell, a BR-type bulb shell, an ER-type bulb shell or a BRL-type bulb shell; and the lamp cap uses E12 type, E14 type, E27 type, E26 type, E40 type, GU type, BX type, BA type, EP type, EX type, GY type, GX type, GR type, GZ type or G type.

### Claim 11

An LED lighting bar using infrared radiation heat dissipation, comprising: a metal substrate, at least one string of 2π light-emitting LED chips located on the metal substrate and connected in series in the same PN junction direction; the back of the metal substrate is provided with an infrared radiation converting layer, which comprises a bonding material and a radiation cooling material, the bonding material is selected from one or more of silica gel, epoxy resin, plastic, transparent glue, transparent paint and polymer, and the radiation cooling material is made from a mixture of a radiation material with an infrared emissivity larger than 0.8 and a high heat conductivity material.

### Claim 12 (depends on 11)

The LED lighting bar using infrared radiation heat dissipation according to claim 11, wherein the radiation material with an infrared emissivity larger than 0.8 comprises any one of mica powder, aluminium oxide, mullite, silicon oxide, and silicon carbide, and the high heat conductivity material being selected from one or more of graphite, carbon black, graphene, carbon nanotube, boron nitride, aluminum oxide, aluminum nitride, silicon nitride, magnesium oxide, and heat conducting ceramic powder.

### Claim 13 (depends on 11)

The LED lighting bar using infrared radiation heat dissipation according to claim 11, wherein the metal substrate is in an inverted V shape, an inverted U shape, an arc shape, a trapezoid shape or a right-angled U shape as a whole.

### Claim 14 (depends on 11)

The LED lighting bar using infrared radiation heat dissipation according to claim 11, wherein the LED chip is one of a blue LED chip, a red LED chip, a green LED chip, a yellow LED chip, a violet LED chip, or any combination thereof.

### Claim 15 (depends on 11)

The LED lighting bar using infrared radiation heat dissipation according to claim 11, wherein a surface of the metal substrate with the LED chip is provided with a phosphor layer, the phosphor layer comprising a phosphor and a transparent medium, the transparent medium comprising one or more of silica gel, epoxy resin, plastic, transparent glue, transparent paint and polymer.

### Claim 16 (depends on 15)

The LED lighting bar using infrared radiation heat dissipation according to claim 15, wherein the phosphor is any combination of YAG-series yellow powder, YAG-series yellow green powder, or silicate-series yellow powder, silicate-series yellow green powder, silicate-series orange powder, or nitride-series red powder, nitrogen oxide-series red powder, or YAG-series phosphors, silicate-series phosphors, nitride-series phosphors, and nitrogen oxide-series phosphors.

### Claim 17 (depends on 16)

The LED lighting bar using infrared radiation heat dissipation according to claim 16, wherein the infrared radiation converting layer is further doped with reflective powder, and the reflective powder has a color similar to that of the phosphor layer.