# US 10,502,369 B2 · Circuit board and image forming apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,502,369 B2 - Document ID: US10502369B2 - Status: Granted - Kind: B2 - Application number: 15/631,234 - Filed: 2017-06-23 - Published: 2018-01-11 - Granted: 2019-12-10 - Earliest claimed: 2016-07-11 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Jun Hirabayashi - Web page: https://patentgrep.com/patent/US10502369B2 ## CPC - F21K 9/238: Arrangement or mounting of circuit elements integrated in the light source - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/181: associated with surface mounted components - H05K 3/0064: {onto a polymeric substrate} - H10H 20/8506: {Containers} - H10H 20/856: Reflecting means - H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - H05K 2201/10106: Light emitting diode [LED] - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced. ## Claims ### Claim 1 A circuit board having a surface on which a light emitting element is mounted, wherein the surface of the circuit board comes into contact with a supporting member including a first support portion and a second support portion to be positioned with regard to the supporting member, the circuit board, comprising: a first electro conductive pattern configured to contact the first support portion of the supporting member on the surface of the circuit board, the first electro conductive pattern electrically connected with the light emitting element; and a second electro conductive pattern configured to contact the second support portion of the supporting member on the surface of the circuit board, the second electro conductive pattern not being electrically connected with the light emitting element, wherein the light emitting element is positioned between the first electro conductive pattern and the second electro conductive pattern. ### Claim 2 (depends on 1) A circuit board according to claim 1, wherein the supporting member includes a first protruding portion projected to a circuit board side farther than the first support portion and a second protruding portion projected to the circuit board side farther than the second support portion, wherein the circuit board has a first opening, which is formed near the first electro conductive pattern and through which the first protruding portion passes, and a second opening, which is formed near the second electro conductive pattern and through which the second protruding portion passes, and wherein the first protruding portion passes through the first opening and the second protruding portion passes through the second opening, respectively, so that the first electro conductive pattern contacts the first support portion and the second electro conductive pattern contacts the second support portion. ### Claim 3 (depends on 1) A circuit board according to claim 1, wherein each of the first electro conductive pattern and the second electro conductive pattern comprises a copper foil layer formed on a base material of the circuit board by copper foil. ### Claim 4 (depends on 3) A circuit board according to claim 3, further comprising a resist layer formed on the copper foil layer. ### Claim 5 (depends on 4) A circuit board according to claim 4, wherein the resist layer comprises one of a transparent resist layer and a translucent resist layer. ### Claim 6 (depends on 4) A circuit board according to claim 4, further comprising an identification mark drawn on the circuit board, which is formed by removing the resist layer along a shape of the identification mark so that the copper foil layer is exposed. ### Claim 7 (depends on 6) A circuit board according to claim 6, wherein the identification mark formed in a region in which a bearing surface is brought into contact with the circuit board has an area smaller than an area of the region. ### Claim 8 (depends on 3) A circuit board according to claim 3, wherein the copper foil layer comprises at least one solid pattern. ### Claim 9 (depends on 8) A circuit board according to claim 8, wherein adjacent solid patterns of the at least one solid pattern are arranged away from each other by a predetermined distance. ### Claim 10 (depends on 3) A circuit board according to claim 3, further comprising a solid pattern of the copper foil, which is arranged around the light emitting element of the circuit board. ### Claim 11 (depends on 1) A circuit board according to claim 1, wherein the light emitting element comprises a light emitting diode surface-mounted on the circuit board. ### Claim 12 (depends on 11) A circuit board according to claim 11, wherein the light emitting element has a directivity half value angle of ±15° or less. ### Claim 13 (depends on 1) A circuit board according to claim 1, wherein the light emitted from the light emitting element comes into a light guide provided on a side opposed to a side on which the light emitting element is provided with regard to an opening of the supporting member. ### Claim 14 (depends on 1) An image forming apparatus comprising: a circuit board according to claim 1; an image bearing member on which an image is formed; and a supporting member configured to contact the circuit board to position the circuit board with regard to the supporting member, wherein a light emitted from the light emitting element is emitted onto the image bearing member. ### Claim 15 A circuit board having a first opening and a second opening, wherein the circuit board on which a light emitting element is mounted is supported by a supporting member having a first protruding portion and a second protruding portion, the circuit board comprising: a first electro conductive pattern arranged around a circumference of the first opening; and a second electro conductive pattern arranged around a circumference of the second opening, wherein the first protruding portion passes through the first opening and the second protruding portion passes through the second opening, and the supporting member contacts the first electro conductive pattern and the supporting member contacts the second electro conductive pattern so as to fix the circuit board with regard to the supporting member. ### Claim 16 (depends on 15) A circuit board according to claim 15, wherein the first electro conductive pattern is connected to the light emitting element and the second electro conductive pattern is not connected to the light emitting element. ### Claim 17 (depends on 15) A circuit board according to claim 15, wherein the light emitting element is arranged between the first opening and the second opening. ### Claim 18 (depends on 15) A circuit board according to claim 15, wherein the supporting member comprises another opening, and wherein in a condition where the supporting member contacts the first electro conductive pattern, the light emitting element is arranged at a portion where the light emitting element opposes to the another opening. ### Claim 19 (depends on 15) A circuit board according to claim 15, wherein each of the first electro conductive pattern and the second electro conductive pattern comprises a copper foil layer formed on a base material of the circuit board by copper foil. ### Claim 20 (depends on 19) A circuit board according to claim 19, further comprising a resist layer formed on the copper foil layer. ### Claim 21 (depends on 19) A circuit board according to claim 19, wherein the copper foil layer comprises at least one solid pattern. ### Claim 22 (depends on 21) A circuit board according to claim 21, wherein adjacent solid patterns of the at least one solid pattern are arranged away from each other by a predetermined distance. ### Claim 23 (depends on 19) A circuit board according to claim 19, further comprising a solid pattern of the copper foil, which is arranged around the light emitting element of the circuit board. ### Claim 24 (depends on 15) A circuit board according to claim 15, wherein the light emitting element comprises a light emitting diode surface-mounted on the circuit board. ### Claim 25 (depends on 15) A circuit board according to claim 15, wherein the light emitting element has a directivity half value angle of ±15° or less. ### Claim 26 (depends on 15) A circuit board according to claim 15, wherein the light emitted from the light emitting element comes into a light guide provided on a side opposed to a side on which the light emitting element is provided with regard to an opening of the supporting member. ### Claim 27 (depends on 15) An image forming apparatus comprising: a circuit board according to claim 15; an image bearing member on which an image is formed; and a supporting member configured to contact the circuit board to position the circuit board with regard to the supporting member, wherein a light emitted from the light emitting element is emitted onto the image bearing member.