# US 10,501,664 B1 · Resin compositon, removable adhesive layer, IC substrate, and IC packaging process > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,501,664 B1 - Document ID: US10501664B1 - Status: Granted - Kind: B1 - Application number: 16/128,628 - Filed: 2018-09-12 - Published: 2019-11-21 - Granted: 2019-12-10 - Earliest claimed: 2018-05-15 - Assignees: Qi Ding Technology Qinhuangdao Co., Ltd. - Applicants: Qi Ding Technology Qinhuangdao Co., Ltd. - Inventors: Kuo-Sheng Liang; Mei-Ju Pan; Mao-Feng Hsu; Yu-Cheng Huang - Web page: https://patentgrep.com/patent/US10501664B1 ## CPC - C08L 53/02: of vinyl-aromatic monomers and conjugated dienes - C09J 153/02: Vinyl aromatic monomers and conjugated dienes - C08K 3/22: of metals - C08K 5/07: Aldehydes; Ketones - C08K 7/16: Solid spheres - C08K 9/10: Encapsulated ingredients - H10P 72/74: {using temporarily an auxiliary support} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - C08K 2003/2224: {Magnesium hydroxide} - C08K 2003/2227: {of aluminium} - C08K 2201/003: Additives being defined by their diameter - C08K 2201/007: Fragrance additive - H10W 70/688: {Flexible insulating substrates} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided. ## Claims ### Claim 1 A resin composition comprising: a styrene-butadiene-styrene block copolymer; and a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer wherein the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. ### Claim 2 (depends on 1) The resin composition of claim 1, wherein the resin composition comprises 100 parts by weight of the styrene-butadiene-styrene block copolymer, at least one of 1 parts by weight to 50 parts by weight of the plurality of hydrated inorganic substances and 5 parts by weight to 50 parts by weight of the plurality of microcapsule particles. ### Claim 3 (depends on 1) The resin composition of claim 1, wherein the styrene-butadiene-styrene block copolymer has a chemical structural formula of a degree of polymerization x is about 30 to about 90, a degree of polymerization y is about 10 to about 70, a degree of polymerization m and a degree of polymerization n each is a natural number greater than 1. ### Claim 4 (depends on 1) The resin composition of claim 1, wherein the plurality of hydrated inorganic substances is selected from at least one of aluminum hydroxide and magnesium hydroxide. ### Claim 5 (depends on 1) The resin composition of claim 1, wherein the embedded object is cis-Jasmone. ### Claim 6 (depends on 1) The resin composition of claim 1, wherein each of the plurality of microcapsule particles has a grain diameter of about 3 μm to about 12 μm. ### Claim 7 A removable adhesive layer formed by curing a resin composition, the resin composition comprising: a styrene-butadiene-styrene block copolymer; and a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer; wherein the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. ### Claim 8 (depends on 7) The removable adhesive layer of claim 7, wherein the resin composition comprises 100 parts by weight of the styrene-butadiene-styrene block copolymer, at least one of 1 parts by weight to 50 parts by weight of the plurality of hydrated inorganic substances and 5 parts by weight to 50 parts by weight of the plurality of microcapsule particles. ### Claim 9 (depends on 7) The removable adhesive layer of claim 7, wherein the styrene-butadiene-styrene block copolymer has a chemical structural formula of a degree of polymerization x is about 30 to about 90, a degree of polymerization y is about 10 to about 70, a degree of polymerization m and a degree of polymerization n each is a natural number greater than 1. ### Claim 10 (depends on 7) The removable adhesive layer of claim 7, wherein the plurality of hydrated inorganic substances is selected from at least one of aluminum hydroxide and magnesium hydroxide. ### Claim 11 (depends on 7) The removable adhesive layer of claim 7, wherein the embedded object is cis-Jasmone. ### Claim 12 (depends on 7) The removable adhesive layer of claim 7, wherein each of the plurality of microcapsule particles has a grain diameter of about 3 μm to about 12 μm. ### Claim 13 An IC packaging process comprising: providing an IC substrate comprising: a carrier; a circuit structure; and a removable adhesive layer attached between the carrier and the circuit structure a styrene-butadiene-styrene block copolymer, the removable adhesive layer formed by curing a resin composition; wherein the resin composition comprises a styrene-butadiene-styrene block copolymer, and the resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer, the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius; mounting an integrated circuit on a side of the circuit structure 13 facing away from the carrier by a surface mount technology, the surface mount technology applying in a mounting temperature, wherein each of the dehydration temperature and the escaping temperature is greater than the mounting temperature; encapsulating the integrated circuit on the IC substrate by a packaging structure to form an intermediate structure; and heating the intermediate structure at a heating temperature greater than or equal to the dehydration temperature and/or the escaping temperature, to cause gas to be produced by the hydrated inorganic substances or the microcapsule particles and release from the removable adhesive layer; peeling off the removable adhesive layer from the circuit structure. ### Claim 14 (depends on 13) The IC packaging process of claim 13, wherein the resin composition comprises 100 parts by weight of the styrene-butadiene-styrene block copolymer, at least one of 1 parts by weight to 50 parts by weight of the plurality of hydrated inorganic substances and 5 parts by weight to 50 parts by weight of the plurality of microcapsule particles. ### Claim 15 (depends on 13) The IC packaging process of claim 13, wherein the styrene-butadiene-styrene block copolymer has a chemical structural formula of a degree of polymerization x is about 30 to about 90, a degree of polymerization y is about 10 to about 70, a degree of polymerization m and a degree of polymerization n each is a natural number greater than 1. ### Claim 16 (depends on 13) The IC packaging process of claim 13, wherein the plurality of hydrated inorganic substances is selected from at least one of aluminum hydroxide and magnesium hydroxide. ### Claim 17 (depends on 13) The IC packaging process of claim 13, wherein the embedded object is cis-Jasmone. ### Claim 18 (depends on 13) The IC packaging process of claim 13, wherein each of the plurality of microcapsule particles has a grain diameter of about 3 μm to about 12 μm. ### Claim 19 An IC substrate comprising: a carrier; a circuit structure; and a removable adhesive layer attached between the carrier and the circuit structure a styrene-butadiene-styrene block copolymer, the removable adhesive layer formed by curing a resin composition; wherein the resin composition comprises a styrene-butadiene-styrene block copolymer, and the resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer, the plurality of hydrated inorganic substances dehydrate to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius, each of the plurality of microcapsule particle comprises a housing and an embedded object encapsulated therein, the embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. ### Claim 20 (depends on 19) The IC substrate of claim 19, wherein the resin composition comprises 100 parts by weight of the styrene-butadiene-styrene block copolymer, at least one of 1 parts by weight to 50 parts by weight of the plurality of hydrated inorganic substances and 5 parts by weight to 50 parts by weight of the plurality of microcapsule particles.