# US 10,501,661 B2 · Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,501,661 B2 - Document ID: US10501661B2 - Status: Granted - Kind: B2 - Application number: 15/729,162 - Filed: 2017-10-10 - Published: 2018-02-15 - Granted: 2019-12-10 - Earliest claimed: 2013-07-29 - Assignees: Dexerials Corporation - Applicants: Dexerials Corporation - Inventors: Seiichiro Shinohara - Web page: https://patentgrep.com/patent/US10501661B2 ## CPC - C09J 9/02: Electrically-conducting adhesives - C09J 7/10: without carriers - C09J 11/04: inorganic - H01R 4/04: using electrically conductive adhesives - H01R 43/007: {for elastomeric connecting elements} - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - C08K 3/04: Carbon - C08K 3/08: Metals - C08K 2201/001: Conductive additives - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2301/314: the adhesive layer and/or the carrier being conductive - C09J 2301/408: additives as essential feature of the adhesive layer - H01R 12/62: connecting to rigid printed circuits or like structures - H05K 2201/0224: Conductive particles having an insulating coating - H05K 2203/0139: Blade or squeegee, e.g. for screen printing or filling of holes - H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer. ## Claims ### Claim 1 An electrically conductive adhesive film comprising: a base film; a binder resin that is laminated on the base film; and electrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern, wherein, among the electrically conductive particles, electrically conductive particles having a mark on a surface are within 30% of the total number of particles. ### Claim 2 (depends on 1) The electrically conductive adhesive film according to claim 1, wherein the electrically conductive particles is subjected to further insulation treatment. ### Claim 3 An electrically conductive adhesive film comprising: a base film; a binder resin that is laminated on the base film; and electrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined pattern, wherein the electrically conductive particles have a metal surface, and wherein the electrically conductive particles include electrically conductive particles in which a portion of the metal surface is peeled off. ### Claim 4 (depends on 3) The electrically conductive adhesive film according to claim 3, wherein the electrically conductive particles are coated on a surface with a metal. ### Claim 5 (depends on 4) The electrically conductive adhesive film according to claim 4, wherein the electrically conductive particles coated on a surface with a metal are plated particles. ### Claim 6 (depends on 3) The electrically conductive adhesive film according to claim 3, wherein the metal surface of the electrically conductive particles is subjected to further insulation treatment. ### Claim 7 (depends on 4) The electrically conductive adhesive film according to claim 4, wherein the metal surface of the electrically conductive particles is subjected to further insulation treatment. ### Claim 8 An electrically conductive adhesive film comprising: a base film; a binder resin that is laminated on the base film; and electrically conductive particles that are regularly dispersed and disposed on the binder resin in a predetermined array pattern, wherein the electrically conductive particles that are regularly dispersed and disposed include an aggregate in which a plurality of the electrically conductive particles are linked, and wherein the aggregate is within 20% of the total number of electrically conductive particles that are regularly dispersed and disposed. ### Claim 9 (depends on 8) The electrically conductive adhesive film according to claim 8, wherein the size of the aggregate is 8 times or less than a particle size of the electrically conductive particles. ### Claim 10 (depends on 1) A connection body obtained by connecting a plurality of terminals arranged in parallel to one another by an anisotropic conductive film on which electrically conductive particles are arranged, wherein the electrically conductive adhesive film according to claim 1 is used. ### Claim 11 (depends on 1) A method for manufacturing a connection body obtained by connecting a plurality of terminals arranged in parallel to one another by an anisotropic conductive film on which electrically conductive particles are arranged, wherein the electrically conductive adhesive film according to claim 1 is used. ### Claim 12 A method for manufacturing an electrically conductive adhesive film comprising: aligning electrically conductive particles in a predetermined array pattern on a substrate, which is prevented from being charged, by moving a squeegee; and transferring the electrically conductive particles with a film having a binder resin layer, wherein marks are generated on the electrically conductive particles as the squeegee moves on the substrate. ### Claim 13 (depends on 12) The method for manufacturing an electrically conductive adhesive film according to claim 12, wherein the electrically conductive particles are charged. ### Claim 14 (depends on 12) The method for manufacturing an electrically conductive adhesive film according to claim 12, wherein the squeegee is prevented from being charged.