# US 10,501,656 B2 · Solvent-free wire enamel composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,501,656 B2 - Document ID: US10501656B2 - Status: Granted - Kind: B2 - Application number: 14/237,499 - Filed: 2012-08-06 - Published: 2014-07-24 - Granted: 2019-12-10 - Earliest claimed: 2011-08-09 - Assignees: Elantas GmbH - Applicants: Ronnie Halfar; Sascha Toedter-Koenig; Klaus-W. Lienert; Simon Rost; Stefan Hartkopp; Hans-Ulrich Moritz - Inventors: Ronnie Halfar; Sascha Toedter-Koenig; Klaus-W. Lienert; Simon Rost; Stefan Hartkopp; Hans-Ulrich Moritz - Web page: https://patentgrep.com/patent/US10501656B2 ## CPC - C09D 179/085: {Unsaturated polyimide precursors} - C08G 73/16: Polyester-imides - C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors - H01B 3/306: {Polyimides or polyesterimides} - H01B 13/065: {Insulating conductors with lacquers or enamels} - H01B 13/148: {Selection of the insulating material therefor} - H01B 3/308: {Wires with resins} - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion. ## Claims ### Claim 1 A method of applying an enamel composition to a wire, wherein the method comprises melting the enamel composition in an extruder, applying the melted composition to the wire and subjecting the applied composition to post-crosslinking, the enamel composition being a solvent-free wire enamel composition comprising an extrudable, polyesterimide-containing binder prepared from (i) polyols, (ii) polycarboxylic acids, (iii) imide-forming components, and (iv) structural elements which are crosslinkable after extrusion, and wherein components (iii) are catenary imide-forming components and structural elements (iv) are unsaturated carboxylic acids and the composition comprises 30-60 wt % of catenary imide-forming components and 2-20 wt % of unsaturated carboxylic acids. ### Claim 2 (depends on 1) The method of claim 1, wherein the binder comprises 35-55 wt % of catenary, imide-forming components and 5-15 wt % of unsaturated carboxylic acids. ### Claim 3 (depends on 1) The method of claim 1, wherein the binder comprises 40-50 wt % of catenary, imide-forming components and 7-11 wt % of unsaturated carboxylic acids. ### Claim 4 (depends on 1) The method of claim 1, wherein structural elements (iv) are designed such that thermal post-crosslinking is made possible and/or is achieved by incorporating peroxidic crosslinkers in the composition. ### Claim 5 (depends on 4) The method of claim 4, wherein 0.5-6 wt % of peroxidic crosslinkers is present. ### Claim 6 (depends on 1) The method of claim 1, wherein structural elements (iv) are designed such that photochemical post-crosslinking is made possible. ### Claim 7 (depends on 1) The method of claim 1, wherein the composition further comprises a peroxide. ### Claim 8 A method of producing a coated wire, wherein the method comprises melting a wire enamel composition in an extruder, applying the melted composition to the wire and subjecting the applied composition to post-crosslinking, the enamel composition being a solvent-free wire enamel composition comprising an extrudable, polyesterimide-containing binder prepared from (i) polyols, (ii) polycarboxylic acids, (iii) imide-forming components, and (iv) structural elements which are crosslinkable after extrusion, and wherein components (iii) are catenary imide-forming components and structural elements (iv) are unsaturated carboxylic acids and the composition comprises 30-60 wt % of catenary imide-forming components and 2-20 wt % of unsaturated carboxylic acids. ### Claim 9 (depends on 8) The method of claim 8, wherein the binder comprises 35-55 wt % of catenary, imide-forming components and 5-15 wt % of unsaturated carboxylic acids. ### Claim 10 (depends on 8) The method of claim 8, wherein the binder comprises 40-50 wt % of catenary, imide-forming components and 7-11 wt % of unsaturated carboxylic acids. ### Claim 11 (depends on 8) The method of claim 8, wherein structural elements (iv) are designed such that thermal post-crosslinking is made possible and/or is achieved by incorporating peroxide crosslinkers in the binder. ### Claim 12 (depends on 11) The method of claim 11, wherein 0.5-6 wt % of peroxide crosslinkers is present. ### Claim 13 (depends on 11) The method of claim 11, wherein structural elements (iv) are incorporated in a main chain of corresponding polymers. ### Claim 14 (depends on 11) The method of claim 11, wherein structural elements (iv) are present as an end groups of corresponding polymers. ### Claim 15 (depends on 8) The method of claim 8, wherein structural elements (iv) are designed such that photochemical post-crosslinking is made possible. ### Claim 16 (depends on 1) The method of claim 1, wherein structural elements (iv) comprise one or more of maleic acid, fumaric acid, tetrahydrophthalic acid, endomethylenetetrahydro-phthalic acid, itaconic acid, esters, anhydrides, and acyl chlorides of these acids; acrylic acid, methacrylic acid, dicyclopentene structures prepared by addition reaction of maleic acid or succinic acid with dicyclopentadiene; reaction products of tetrahydrophthalic anhydride with ethanolamine, propanolamine, and butanolamine. ### Claim 17 (depends on 8) The method of claim 8, wherein structural elements (iv) comprise one or more of maleic acid, fumaric acid, tetrahydrophthalic acid, endomethylenetetrahydro-phthalic acid, itaconic acid, esters, anhydrides, and acyl chlorides of these acids; acrylic acid, methacrylic acid, dicyclopentene structures prepared by addition reaction of maleic acid or succinic acid with dicyclopentadiene; reaction products of tetrahydrophthalic anhydride with ethanolamine, propanolamine, and butanolamine. ### Claim 18 (depends on 8) The method of claim 8, wherein structural elements (iv) are incorporated in a main chain and/or are present as end groups of corresponding polymers. ### Claim 19 (depends on 8) The method of claim 8, wherein structural elements (iv) are incorporated in a main chain of corresponding polymers. ### Claim 20 (depends on 8) The method of claim 8, wherein structural elements (iv) are present as an end groups of corresponding polymers.