# US 10,501,628 B2 · Resin composition, and electronic component and electronic device using same

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- Number: US 10,501,628 B2
- Document ID: US10501628B2
- Status: Granted
- Kind: B2
- Application number: 15/922,841
- Filed: 2018-03-15
- Published: 2018-10-25
- Granted: 2019-12-10
- Earliest claimed: 2017-04-19
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Honami Nishino; Hirohisa Hino
- Web page: https://patentgrep.com/patent/US10501628B2

## CPC

- C08L 83/04: Polysiloxanes
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08K 3/14: Carbides
- C08K 3/22: of metals
- C08K 3/36: Silica
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- C08K 2003/2217: {of magnesium}
- C08K 2003/2227: {of aluminium}
- C08K 2201/003: Additives being defined by their diameter
- C08K 2201/005: Additives being defined by their particle size in general
- C08K 2201/006: Additives being defined by their surface area
- C08K 2201/011: Nanostructured additives
- C08L 2203/20: use in electrical or conductive gadgets
- H05K 1/03: Use of materials for the substrate
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

## Claims

### Claim 1

A resin composition comprising a silicone resin, an inorganic filler, and an inorganic pigment particle,
the inorganic filler including a first filler having thermal emissivity, and a second filler having thermal conductivity, wherein the second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler,
the inorganic filler being contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to a combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle,
wherein the first filler is an oxide having an average particle size of 7.8 μm or more and 18 μm or less, and containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon,
wherein the second filler is a SiC having an average particle size of 9.5 μm or more and 25 μm or less, and a purity of 92% or more, and
wherein the inorganic pigment particle has an average particle size of 28 nm or more and 39.5 nm or less, and a specific surface area of 84 m2/g or more and 800 m2/g or less.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the inorganic pigment particle is contained in a proportion of 0.1 parts by mass or more and 2.0 parts by mass or less with respect to 100 parts by mass of the silicone resin.

### Claim 3 (depends on 1)

An electronic component comprising the resin composition of claim 1.

### Claim 4 (depends on 3)

An electronic device comprising the electronic component of claim 3.

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the silicone resin is contained in the resin composition in a proportion of 23.2 volume % or more and 52.1 volume % or less with respect to a total volume of the resin composition.

### Claim 6 (depends on 1)

The resin composition according to claim 1, wherein the first filler has a far infrared emissivity of 0.8 or more in a wavelength region of 5 to 20 μm.

### Claim 7 (depends on 1)

The resin composition according to claim 1, wherein the first filler has a thermal conductivity of 3.0 W/mK or more.

### Claim 8 (depends on 1)

The resin composition according to claim 1, wherein the thermal conductivity of the second filler is 200 W/mK or more.

### Claim 9 (depends on 3)

The resin composition according to claim 3, wherein the second filler has a far infrared emissivity of 0.8 or more in a wavelength region that contributes to a heat transfer of the electronic component.

### Claim 10 (depends on 1)

The resin composition according to claim 1, wherein the inorganic pigment has a far infrared emissivity of 0.7 or more.