# US 10,501,619 B2 · Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,501,619 B2 - Document ID: US10501619B2 - Status: Granted - Kind: B2 - Application number: 15/534,028 - Filed: 2015-12-02 - Published: 2018-11-22 - Granted: 2019-12-10 - Earliest claimed: 2014-12-15 - Assignees: Zephyros, Inc. - Applicants: Zephyros, Inc. - Inventors: Vincent Duclos - Web page: https://patentgrep.com/patent/US10501619B2 ## CPC - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08G 69/40: Polyamides containing oxygen in the form of ether groups (C08G69/12, C08G69/32 take precedence) - C08K 3/22: of metals - C08L 71/00: Compositions of polyethers obtained by reactions forming an ether link in the main chain (of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06); Compositions of derivatives of such polymers - C08L 71/12: Polyphenylene oxides - C08L 77/00: Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers - C08L 77/02: Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) - C08L 77/10: Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids - C08L 87/005: {Block or graft polymers not provided for in groups C08L1/00 - C08L85/04} - C09J 5/06: involving heating of the applied adhesive - C09J 5/08: using foamed adhesives - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08L 2203/14: used for foams - C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure - C08L 2205/035: containing four or more polymers in a blend - C09J 2400/24: Presence of a foam - C09J 2463/00: Presence of epoxy resin - C09J 2471/00: Presence of polyether - C09J 2477/00: Presence of polyamide - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition. ## Claims ### Claim 1 A composition comprising: a) from about 17 to about 70 parts by weight of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks; b) from about 30 to about 83 parts by weight of one or more co-polyamides; and c) a curable composition containing one or more epoxy functional materials; wherein the total parts by weight of components a) and b) are present in a molar ratio of about 2:1 to 1:6. ### Claim 2 (depends on 1) A composition according to claim 1, wherein the melting point of the one or more co-polyamides is about 140° C. or less. ### Claim 3 (depends on 1) A composition according to claim 1 wherein the one or more block co-polymers haying one or more polyamide blocks and one or more polyether blocks comprise polyether blocks of polyalkylene oxides. ### Claim 4 (depends on 1) A composition according to claim 1 wherein the one or more co-polyamides comprise random copolymers containing at least two different amide units. ### Claim 5 (depends on 1) A composition according to claim 1, wherein from about 5 to about 30 parts by weight of a copolymer comprising one or more copolyamide sections and one or more polyether blocks or a mixture of from about 3 to about 12 parts by weight of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks; and from about 5 to about 15 parts by weight of one or more co-polyamides are added to the arable composition containing one or more epoxy functional materials. ### Claim 6 (depends on 1) The composition according to claim 1, including an elastomers-containing adduct. ### Claim 7 (depends on 6) The composition of claim 6, wherein the adduct is present in an amount of 5 parts by weight or greater. ### Claim 8 (depends on 1) The composition of claim 1, wherein the composition includes from about 10 parts by weight to about 30 parts by weight of a phenoxy resin component. ### Claim 9 (depends on 1) The composition of claim 1, wherein the composition includes from about 10 parts by weight to about 20 parts by weight of a core-shell component. ### Claim 10 (depends on 9) The composition of claim 9, wherein the core-shell component is an acrylate-based core-shell material. ### Claim 11 (depends on 1) The composition of claim 1, wherein the composition is foamable upon exposure to elevated temperatures. ### Claim 12 (depends on 11) The composition of claim 11, wherein the expansion percentage upon foaming is from about 50% to about 200%. ### Claim 13 (depends on 11) The composition of claim 11, wherein the composition does not foam upon exposure to elevated temperatures. ### Claim 14 (depends on 1) The composition of claim 1, wherein the Tg of the composition is at least about 80° C. and less than about 120° C. ### Claim 15 (depends on 1) A method comprising; applying a composition according to claim 1 to a first substrate; contacting a second substrate with the first substrate with the applied composition disposed between the substrates; and exposing the contacted substrates to temperatures at which the applied composition cures and the substrates are bonded together. ### Claim 16 (depends on 15) A method according to claim 15 including curing the formed composition. ### Claim 17 (depends on 16) A method according to claim 16 wherein the cured formed composition exhibits a modulus of about 1000 MPa or greater and an elongation of about 10 percent or greater when measured according to ISO 527. ### Claim 18 (depends on 15) The method of claim 15, wherein the composition is applied as a film or foamable structure. ### Claim 19 (depends on 15) The method of claim 15, wherein the cured composition exhibits a modulus of about 1000 MPa or greater and an elongation of about 10 percent or greater when measured according to ISO 527.