# US 10,501,278 B2 · Attaching device for conductive adhesive tape and a manufacturing method of display panel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,501,278 B2 - Document ID: US10501278B2 - Status: Granted - Kind: B2 - Application number: 15/697,796 - Filed: 2017-09-07 - Published: 2018-03-15 - Granted: 2019-12-10 - Earliest claimed: 2016-09-09 - Assignees: Boe Technology Group Co., Ltd. - Applicants: Boe Technology Group Co., Ltd. - Inventors: Pengxia Liang - Web page: https://patentgrep.com/patent/US10501278B2 ## CPC - B65H 35/0033: {and affixing it to a surface (B65H35/004 takes precedence)} - B65H 37/002: {Web delivery apparatus, the web serving as support for articles, material or another web} - B65H 37/02: for applying adhesive (and securing together B65H37/04) - B65H 37/04: for securing together articles or webs, e.g. by adhesive, stitching or stapling (adhering replacement to expiring web during change of web roll B65H19/18) - C09J 9/02: Electrically-conducting adhesives - H10F 39/80: {Constructional details of image sensors} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)} - Y10T 156/1348: Work traversing type - Y10T 156/1788: Work traversing type and/or means applying work to wall or static structure - B65H: HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The disclosure provides an attaching device for conductive adhesive tape and a manufacturing method of display panel. The attaching device disclosed herein comprises an adhesive tape attaching unit and a frame. An upper portion of the frame is provided with a first guide rail and a pair of second guide rails in parallel. The first guide rail is arranged to be perpendicular to the pair of second guide rails and movably connected between the pair of second guide rails. The adhesive tape attaching unit is movably mounted on the first guide rail. The attaching device for conductive adhesive tape and the manufacturing method of display panel according to the disclosure can attach the adhesive tape to a motherboard. The motherboard with the adhesive tape attached to can be cut to form a plurality of display panels. Therefore, it is possible to improve attaching efficiency and reduce cost of manufacturing. ## Claims ### Claim 1 An attaching device for conductive adhesive tape, comprising an adhesive tape attaching unit and a frame, wherein an upper portion of the frame is provided with a first guide rail and a pair of second guide rails in parallel, the first guide rail is arranged to be substantially perpendicular to the pair of second guide rails and movably connected between the pair of second guide rails, and the adhesive tape attaching unit is movably mounted on the first guide rail and comprises an adhesive tape supply module, configured to supply the conductive adhesive tape including a conductive adhesive film and a liner tape attached to the conductive adhesive film; the adhesive tape attaching unit comprises a shearing module, configured to shear the conductive adhesive film on the conductive adhesive tape supplied from the adhesive tape supply module in accordance with a size of an attachment area of a to-be-attached object, and including a fourth drive unit having two ends and a shear, wherein one end of the fourth drive unit is movably connected to the first guide rail and the other end of the fourth drive unit is connected to the shear. ### Claim 2 (depends on 1) The attaching device for conductive adhesive tape according to claim 1, wherein sliding blocks are provided at both ends of the first guide rail, respectively, and the sliding blocks are configured to move along the pair of the second guide rails. ### Claim 3 (depends on 2) The attaching device for conductive adhesive tape according to claim 2, wherein the adhesive tape attaching unit is driven to move along the first guide rail by a first drive unit, and the sliding blocks are driven to move long the pair of second guide rails in parallel by a second drive unit, such that the first guide rail and the adhesive tape attaching unit are moved together with the sliding blocks. ### Claim 4 (depends on 3) The attaching device for conductive adhesive tape according to claim 3, wherein the first drive unit and the second drive unit are an air cylinder or a hydraulic cylinder. ### Claim 5 (depends on 1) The attaching device for conductive adhesive tape according to claim 1, wherein the frame of the attaching device for conductive adhesive tape further comprises a bearing platform that is positioned under the frame to support a to-be-attached object. ### Claim 6 (depends on 1) The attaching device for conductive adhesive tape according to claim 1, wherein the adhesive tape attaching unit comprises: a pressurization module, configured to press a sheared conductive adhesive film onto the attachment area of the to-be-attached object; and a liner tape recycling module, configured to recycle the liner tape of the conductive adhesive tape peeled off the conductive adhesive film after the conductive adhesive film is pressed onto the attachment area of the to-be-attached object. ### Claim 7 (depends on 6) The attaching device for conductive adhesive tape according to claim 6, wherein the adhesive tape supply module comprises an adhesive tape supply reel and a first motor, the conductive adhesive tape is wound around the adhesive tape supply reel, and the first motor controls the adhesive tape supply reel to output the conductive adhesive tape. ### Claim 8 (depends on 6) The attaching device for conductive adhesive tape according to claim 6, wherein the pressurization module comprises: a third drive unit having two ends and a pressurization head, wherein one end of the third drive unit is movably connected to the first guide rail and the other end of the third drive unit is connected to the pressurization head. ### Claim 9 (depends on 8) The attaching device for conductive adhesive tape according to claim 8, wherein the pressurization head is a roller-type pressurization head. ### Claim 10 (depends on 8) The attaching device for conductive adhesive tape according to claim 8, wherein the third drive unit is a hydraulic rod, and the hydraulic rod comprises a liquid supply conduit, a conduit joint thread, a hydraulic transmission shaft and a hydraulic rod shell. ### Claim 11 (depends on 8) The attaching device for conductive adhesive tape according to claim 8, wherein the adhesive tape attaching unit further comprises a beam, a first stop block and a second stop block; the first stop block and the second stop block have the same structure and each comprise a stop block body and a through-hole; the adhesive tape supply module and the liner tape recycling module are connected to opposing ends of the beam, respectively; the beam passes through the through-holes of the first stop block and the second stop block, such that the first stop block and the second stop block are movable along the beam; the third drive unit is connected to the first stop block; the fourth drive unit is connected to the second stop block; and the first stop block and the second stop block are able to locate the shearing module and the pressurization module. ### Claim 12 (depends on 1) A manufacturing method of a display panel, comprising steps of: attaching a conductive adhesive tape onto each of display panels on a display motherboard by using the attaching device for conductive adhesive tape according to claim 1; and cutting the display motherboard with the conductive adhesive tape attached along cutting lines to form individual display panels. ### Claim 13 (depends on 12) The method according to claim 12, wherein sliding blocks are provided at both ends of the first guide rail, respectively, and the method further comprises: moving the sliding blocks along the pair of the second guide rails. ### Claim 14 (depends on 13) The method according to claim 13, wherein the adhesive tape attaching unit is driven to move along the first guide rail by a first drive unit, and the sliding blocks are driven to move long the pair of second guide rails in parallel by a second drive unit, such that the first guide rail and the adhesive tape attaching unit are moved together with the sliding blocks. ### Claim 15 (depends on 14) The method according to claim 14, wherein the step of attaching a conductive adhesive tape onto each of display panels on a display motherboard by using the attaching device for conductive adhesive tape comprises: supplying the conductive adhesive tape including a conductive adhesive film and a liner tape attached to the conductive adhesive film by the adhesive tape supply module; shearing the conductive adhesive film on the conductive adhesive tape supplied from the adhesive tape supply module in accordance with a size of an attachment area of the to-be-attached object by a shearing module; pressing a sheared conductive adhesive film onto the attachment area of the to-be-attached object by a pressurization module; and recycling the liner tape of the conductive adhesive tape peeled off the conductive adhesive film after the conductive adhesive film is pressed onto the attachment area of the to-be-attached object by a liner tape recycling module. ### Claim 16 (depends on 15) The method according to claim 15, wherein the pressurization module comprises: a third drive unit having two ends and a pressurization head, wherein one end of the third drive unit is movably connected to the first guide rail and the other end of the third drive unit is connected to the pressurization head. ### Claim 17 (depends on 12) The method according to claim 12, wherein the step of attaching a conductive adhesive tape onto each of display panels on a display motherboard further comprises: Step a), moving the adhesive tape attaching unit to an initial position by a first drive unit and a second drive unit; Step b), pressing a pressurization head onto the to-be-attached object under an urge of a third drive unit; Step c), moving the adhesive tape attaching unit along the first guide rail by the first drive unit, while the pressurization head is attaching the conductive adhesive tape against an attachment area of the to-be-attached object in a movement direction of the adhesive tape attaching unit; Step d), after the conductive adhesive tape is attached to a first line of the attachment area, raising the pressurization head by the third drive unit; Step e), moving the first guide rail along the second guide rails by the second drive unit so as to move the adhesive tape attaching unit to a next line of the attachment area; and Step f), repeating the steps b)-e), until the attachment of the conductive adhesive tape on a whole attachment area is completed.