# US 10,500,857 B2 · Nozzle substrate, ink-jet print head, and method for producing nozzle substrate

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- Number: US 10,500,857 B2
- Document ID: US10500857B2
- Status: Granted
- Kind: B2
- Application number: 15/800,904
- Filed: 2017-11-01
- Published: 2018-05-03
- Granted: 2019-12-10
- Earliest claimed: 2016-11-02
- Assignees: Rohm Co., Ltd.
- Applicants: ROHM Co., LTD.
- Inventors: Nobufumi Matsuo
- Web page: https://patentgrep.com/patent/US10500857B2

## CPC

- B41J 2/1433: {Structure of nozzle plates}
- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/162: {Manufacturing of the nozzle plates}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1626: {etching}
- B41J 2/1628: {dry etching}
- B41J 2/1631: {photolithography}
- B41J 2/1632: {machining}
- B41J 2/1635: {dividing the wafer into individual chips}
- B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]}
- B81B 1/004: {Through-holes, i.e. extending from one face to the other face of the wafer}
- B81C 1/00087: {Holes}
- B81C 3/001: {Bonding of two components}
- B41J 2002/14491: {Electrical connection}
- B81B 2201/032: Bimorph and unimorph actuators, e.g. piezo and thermo
- B81B 2201/052: Ink-jet print cartridges
- B81C 2203/032: Gluing
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

There is provided a nozzle substrate including a nozzle hole penetrating in a thickness direction. The nozzle substrate includes a main substrate including a first surface and a second surface, an oxidation film formed on the second surface of the main substrate, and a water repellent film formed on a surface at an opposite side to the main substrate side of the oxidation film. The nozzle hole includes a first through hole penetrating the main substrate in a thickness direction, a second through hole penetrating the oxidation film and being connected to the first through hole, and a third through hole penetrating the water repellent film and being connected to the second through hole. An inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.

## Claims

### Claim 1

A nozzle substrate, comprising:
a main substrate including a first surface and a second surface;
an oxidation film formed on the second surface of the main substrate; and
a water repellent film formed on a surface of the oxidation film, wherein
the surface of the oxidation film is at an opposite side to a main substrate side of the oxidation film,
the nozzle substrate includes a nozzle hole that penetrates in a thickness direction of the nozzle substrate,
the nozzle hole includes a first through hole that penetrates the main substrate in the thickness direction, a second through hole that penetrates the oxidation film and being connected to the first through hole, and a third through hole that penetrates the water repellent film and being connected to the second through hole,
the first through hole includes a recessed part formed on the first surface of the main substrate and a hole penetrating a bottom wall of the recessed part of the main substrate,
the recessed part has a truncated cone shape whose transverse section is gradually reduced from the first surface of the main substrate to an oxidation film side of the main substrate,
the nozzle hole includes an ink ejecting path,
the ink ejecting path includes the hole, the second through hole, and the third through hole,
the ink ejecting path has a solid cylindrical shape, and
an inner circumference surface of the second through hole and an inner circumference surface of the third through hole are approximately flush.

### Claim 2 (depends on 1)

The nozzle substrate according to claim 1, wherein
each of a transverse section of the second through hole and a transverse section of the third through hole is circular, and
percentage of a ratio (D2−D1)/D1 of a value, in which a diameter D1 of the second through hole is subtracted from a diameter D2 of the third through hole, relative to the diameter D1 of the second through hole is equal to or less than 11.5%.

### Claim 3 (depends on 1)

The nozzle substrate according to claim 1, wherein
the main substrate is a silicon substrate,
the oxidation film is a silicon oxide film, and
the water repellent film is made of fluorine-based polymer.