# US 10,500,816 B2 · Substrate structure, method for attaching flexible substrate and method for peeling off flexible substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,500,816 B2 - Document ID: US10500816B2 - Status: Granted - Kind: B2 - Application number: 15/539,854 - Filed: 2016-11-11 - Published: 2018-01-18 - Granted: 2019-12-10 - Earliest claimed: 2016-01-04 - Assignees: Boe Technology Group Co., Ltd.; Beijing Boe Display Technology Co., Ltd. - Applicants: Boe Technology Group Co., Ltd.; Beijing Boe Display Technology Co., Ltd. - Inventors: Jianguo Xing; Hetao Wang; Bin Yan - Web page: https://patentgrep.com/patent/US10500816B2 ## CPC - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 37/12: characterised by using adhesives - B32B 38/10: Removing layers, or parts of layers, mechanically or chemically - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10W 10/011: {of isolation regions comprising dielectric materials} - H10W 10/10: Isolation regions comprising dielectric materials - B32B 2037/148: {whereby layers material is selected in order to facilitate recycling of the laminate} - B32B 2307/204: Di-electric - B32B 2457/20: Displays, e.g. liquid crystal displays, plasma displays - H10K 71/80: using temporary substrates - H10K 77/111: {Flexible substrates} - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate. ## Claims ### Claim 1 A substrate structure, comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein each of the more than one bonding layer comprises an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate. ### Claim 2 (depends on 1) The substrate structure according to claim 1, wherein each of the more than one bonding layer further comprises a base and an adhesive, the base interposed between the electroviscosity layer and the adhesive, and the adhesive disposed on a contact surface between the bonding layer and the carrier substrate. ### Claim 3 (depends on 1) The substrate structure according to claim 1, wherein the electroviscosity layer comprises solid particles and insulating liquid, dielectric constant of the solid particles is greater than that of the insulating liquid. ### Claim 4 (depends on 1) A method for bonding the flexible substrate of the substrate structure according to claim 1, comprising: attaching the bonding layer onto the carrier substrate, the boding layer comprising an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer disposed away from the carrier substrate; attaching the flexible substrate to the electroviscosity layer; and fixing the flexible substrate to the carrier substrate through the bonding layer by applying an electric field to the boding layer. ### Claim 5 (depends on 4) The method according to claim 4, wherein attaching the bonding layer to the carrier substrate comprises attaching the bonding layer to the carrier substrate though the adhesive of the bonding layer. ### Claim 6 (depends on 5) The method according to claim 5, wherein the adhesive is the electroviscosity layer. ### Claim 7 (depends on 4) The method according to claim 4, wherein an electric field is applied to the electroviscosity layer, and the electroviscosity layer is converted from liquid state into solid state, viscous strength of the electroviscosity layer in solid state is greater than viscous strength of the electroviscosity layer in liquid state. ### Claim 8 (depends on 1) A method for peeling the flexible substrate off the substrate structure according to claim 1, comprising: after fixing the flexible substrate to the carrier substrate through a bonding layer, stopping applying the electric field to the bonding layer; and peeling the flexible substrate from the electroviscosity layer of the bonding layer after stopping applying the electric field. ### Claim 9 (depends on 8) The method according to claim 8, further comprising: peeling the carrier substrate off from the adhesive of the bonding layer. ### Claim 10 (depends on 9) The method according to claim 9, wherein the adhesive is the electroviscosity layer. ### Claim 11 (depends on 8) The method according to claim 8, wherein after stopping applying the electric field, the electroviscosity layer is converted to liquid state from solid state, the electroviscosity layer has a greater viscous strength in solid state than in liquid state. ### Claim 12 A substrate structure comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein each of the more than one bonding layer comprises an electroviscosity layer having a viscous strength which changes under effect of an electric field; the electroviscosity layer is disposed on a side of the bonding layer in con tact with the carrier substrate. ### Claim 13 A substrate structure, comprising a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further comprising a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layer parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer or each of the more than one bonding layer comprises an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate, wherein the bonding layer or each, of the more than one bonding layer further comprises a base and an adhesive, the base interposed between the electroviscosity layer and the adhesive, and the adhesive disposed on a contact surface between the bonding layer and the carrier substrate, and wherein the adhesive is another electroviscosity layer. ### Claim 14 (depends on 13) The substrate structure according to claim 13, wherein the electroviscosity layer is converted from liquid state into solid state under effect of electric field, viscous strength of the electroviscosity layer in solid state is greater than viscous strength of the electroviscosity layer in liquid state. ### Claim 15 (depends on 14) The substrate structure according to claim 14, wherein the greater the intensity of the electric field is, the greater the viscous strength of the electroviscosity layer in solid state. ### Claim 16 (depends on 13) The substrate structure according to claim 13, wherein the electroviscosity layer comprises solid particles and insulating liquid, dielectric constant of the solid particles is greater than that of the insulating liquid. ### Claim 17 (depends on 16) The substrate structure according to claim 16, wherein material for the solid particles comprises at least one of silica gel, aluminosilicate, composite metal oxide, composite metal hydroxide, and polymeric semiconductor. ### Claim 18 (depends on 16) The substrate structure according to claim 16, wherein the insulating liquid is at least one of silicone oil, edible oil, and mineral oil. ### Claim 19 (depends on 13) The substrate structure according to claim 13, wherein the base is made of polyvinyl chloride, acrylic, glass or polyester.