# US 10,500,770 B2 · LED packaging with integrated optics and methods of manufacturing the same

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- Number: US 10,500,770 B2
- Document ID: US10500770B2
- Status: Granted
- Kind: B2
- Application number: 13/038,257
- Filed: 2011-03-01
- Published: 2011-09-08
- Granted: 2019-12-10
- Earliest claimed: 2010-03-02
- Assignees: So-Semi Technologies, LLC
- Applicants: Steven D. Oliver
- Inventors: Steven D. Oliver
- Web page: https://patentgrep.com/patent/US10500770B2

## CPC

- B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)}
- B29C 33/424: {Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372)}
- B29C 2043/181: {encapsulated}
- B29L 2031/747: {Lightning equipment}
- H10H 20/0362: {of encapsulations}
- H10H 20/8506: {Containers}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 72/0198: {batch processes}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/10: characterised by their shape or disposition
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.

## Claims

### Claim 1

A method for simultaneously integrating optical elements on a plurality of light-emitting diodes (LEDs), the LEDs having a front side comprising:
mounting a plurality of LEDs on a packaging substrate;
after mounting, dispensing an encapsulation material onto the plurality of LEDs on the packaging substrate, the dispensed encapsulation material having a rear surface facing the LEDs and a front surface opposite the rear surface;
simultaneously shaping the front surface of the encapsulation material over the plurality of LEDs;
curing the encapsulation material to form encapsulations in front of the LEDs; and
integrally attaching a molded mirror reflector array to the substrate to integrate the LEDs with the molded mirror reflector array prior to dispensing the encapsulation material.

### Claim 2 (depends on 1)

The method of claim 1, wherein shaping comprises stamping the encapsulation material with a patterned stamping tool and releasing the stamping tool from the encapsulation material.

### Claim 3 (depends on 2)

The method of claim 2, wherein shaping comprises forming a lens profile in front of each of the LEDs.

### Claim 4 (depends on 3)

The method of claim 3, wherein the lens profiles of some of the LEDs are different from the lens profiles of the others of the LEDs.

### Claim 5 (depends on 3)

The method of claim 3, wherein the lens profiles are shaped to concentrate light from the LEDs in a front direction.

### Claim 6 (depends on 1)

The method of claim 1, further comprising dicing the substrate to form individual encapsulated LEDs.

### Claim 7 (depends on 1)

The method of claim 1, further comprising dicing the substrate to form a smaller array of multiple encapsulated LEDs.

### Claim 8 (depends on 1)

The method of claim 1, wherein integrating the LEDs with the molded mirror reflector array comprises surrounding each of the plurality of LEDs with a micro-mirror reflector of the molded mirror reflector array.

### Claim 9 (depends on 8)

The method of claim 8, further comprising forming the molded mirror reflector array by stamping a molding material with a stamping tool and curing the molding material prior to integrating the LEDs with the molded mirror reflector array.

### Claim 10 (depends on 9)

The method of claim 9, further comprising metalizing the molded mirror reflector array.

### Claim 11 (depends on 1)

The method of claim 1, wherein the encapsulation material comprises one of PMMA, cyclo olefin polymer resin, composite filled ceramic polymer, and composite ceramic polymers.

### Claim 12 (depends on 1)

The method of claim 1, further comprising fabricating the plurality of LEDs and singulating the LEDs prior to mounting the LEDs on the packaging substrate.

### Claim 13 (depends on 1)

The method of claim 1, wherein the packaging substrate comprises one or more of Si, BeO, AlN, a thermally conductive ceramic, or a thermally conductive polymer filled with micro particles for thermal properties.

### Claim 14 (depends on 1)

The method of claim 1, further comprising:
forming the packaging substrate by stamping a molding material with a stamping tool and curing the molding material prior to mounting the plurality of LEDs on the packaging substrate.

### Claim 15 (depends on 14)

The method of claim 14, wherein forming the packaging substrate comprises forming back-side vias in the packaging substrate.

### Claim 16 (depends on 14)

The method of claim 14, further comprising plating or sputtering the packaging substrate with reflective metal and patterning the metal.

### Claim 17 (depends on 1)

The method of claim 1, further comprising plating or sputtering the packaging substrate with metal and patterning the metal.

### Claim 18

A method of forming an array of LED dies on a packaging substrate, the method comprising:
providing the packaging substrate, wherein the packaging substrate is formed from a material selected from the group consisting of one or more of Si, BeO, AlN, a thermally conductive ceramic and a thermally conductive polymer filled with micro particles for thermal properties, and the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being electrically connected to leads formed on one of a front side and a back side of the packaging substrate;
mounting a plurality of pre-fabricated and singulated LED dies on the packaging substrate,
disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the packaging substrate;
shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies, wherein shaping comprises stamping the encapsulation material with a patterned stamping tool; and
electrically connecting the LED dies with the metal contacts.

### Claim 19 (depends on 18)

The method of claim 18, further comprising:
forming the packaging substrate by stamping a molding material with a stamping tool and curing the molding material prior to mounting the plurality of LEDs on the packaging substrate.

### Claim 20 (depends on 19)

The method of claim 19, wherein forming the packaging substrate includes forming wells and coating surfaces of the wells with a reflective coating, wherein mounting the LED dies comprises placing the LED dies within the wells.

### Claim 21 (depends on 20)

The method of claim 20, wherein the wells have curved sidewall surfaces.

### Claim 22 (depends on 18)

The method of claim 18, wherein a pitch of the LED dies on the packaging substrate is between about 100 μm and 1 mm.

### Claim 23 (depends on 18)

The method of claim 18, wherein disposing the encapsulation material comprising lens profiles comprises dispensing the encapsulation material onto the array of LED dies and curing the encapsulation material to form encapsulations in front of the LED dies.

### Claim 24 (depends on 23)

The method of claim 23, wherein a single encapsulation is formed in front of more than one of the LED dies.

### Claim 25

A method of wafer-level packaging including forming an array of LED dies on a packaging substrate, the method comprising:
providing the packaging substrate as part of a wafer, wherein the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being in electrical communication with control logic formed in the wafer;
mounting a plurality of pre-fabricated and singulated LED dies on the wafer,
disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the wafer;
shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies; and
electrically connecting the LED dies with the metal contacts, wherein electrically connecting comprises connecting with a conductive bonding material.

### Claim 26 (depends on 25)

The method of claim 25, wherein the conductive bonding material comprises one of solder and/or conductive epoxy.

### Claim 27

A method of wafer-level packaging including forming an array of LED dies on a packaging substrate, the method comprising:
providing the packaging substrate as part of a wafer, wherein the packaging substrate comprises an array of patterned metal contacts on a front side, the metal contacts being in electrical communication with control logic formed in the wafer;
mounting a plurality of pre-fabricated and singulated LED dies on the wafer,
disposing an encapsulation material onto the LED dies to encapsulate the LED dies on the wafer;
shaping the encapsulation material to simultaneously form a plurality of shaped lens profiles in front of the LED dies; and
electrically connecting the LED dies with the metal contacts, wherein electrically contacting comprises wirebonding.