# US 10,500,694 B2 · Chemical mechanical polishing apparatus and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,500,694 B2 - Document ID: US10500694B2 - Status: Granted - Kind: B2 - Application number: 15/635,770 - Filed: 2017-06-28 - Published: 2017-10-19 - Granted: 2019-12-10 - Earliest claimed: 2013-01-11 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Rajeev Bajaj; Thomas H. Osterheld; Hung Chen; Terrance Y. Lee - Web page: https://patentgrep.com/patent/US10500694B2 ## CPC - B24B 37/044: {characterised by the composition of the lapping agent} - B24B 37/11: Lapping tools - B24B 37/30: for single side lapping of plane surfaces - B24B 57/02: for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 52/402: {of semiconductor materials} - H10P 52/403: {of conductive or resistive materials} - H10P 72/0422: {for wet etching} - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects. ## Claims ### Claim 1 A method of polishing a substrate, comprising: providing a substrate in a substrate holder; providing a polishing platform having a moveable polishing pad; dispensing a first slurry component into two or more first zones on the polishing pad; and dispensing a second slurry component into one or more second zones on the polishing pad, wherein the first and second slurry components are different slurry components with one of the first and second slurry components including an abrasive or etchant without an oxidizer and another of the first and second slurry components including an oxidizer without an abrasive and without an etchant. ### Claim 2 (depends on 1) The method of claim 1, wherein the first slurry component includes the abrasive or the etchant. ### Claim 3 (depends on 1) The method of claim 1, further comprising dispensing a rinsing liquid onto the polishing pad. ### Claim 4 (depends on 1) The method of claim 1, further comprising dispensing a rinsing liquid into a zone located between at least one of the two or more first zones and at least one of the one or more second zones. ### Claim 5 (depends on 1) The method of claim 1, wherein dispensing the first slurry component and the second slurry component comprises dispensing the first slurry component and the second slurry component concurrently. ### Claim 6 (depends on 1) The method of claim 1, wherein two or more first zones have widths in a range of 2 mm to 50 mm. ### Claim 7 A method of polishing a substrate, comprising: providing a substrate in a substrate holder; providing a polishing platform having a moveable polishing pad; and dispensing between the polishing pad and the substrate, in a timed sequence, a first slurry component into two or more first zones and a second slurry component into one or more second zones, the first slurry component having a different chemical composition than the second slurry component with one of the first and second slurry components including an abrasive or etchant without a corrosion inhibitor and another of the first and second slurry components including a corrosion inhibitor without an abrasive and without an etchant. ### Claim 8 (depends on 7) The method of claim 7, wherein the first slurry component includes the abrasive or etchant. ### Claim 9 (depends on 7) The method of claim 7, further comprising dispensing a rinsing liquid between the polishing pad and the substrate. ### Claim 10 (depends on 7) The method of claim 7, further comprising dispensing a rinsing liquid into a zone located between at least one of the two or more first zones and at least one of the one or more second zones. ### Claim 11 (depends on 7) The method of claim 7, wherein two or more first zones have widths in a range of 2 mm to 50 mm. ### Claim 12 A method of polishing a substrate, comprising: providing a plurality of individual slurry component supplies including a first slurry component supply configured to supply an oxidizer without an etchant, without an abrasive and without a corrosion inhibitor, a second slurry component supply configured to supply an abrasive or etchant without a oxidizer and without a corrosion inhibitor, and a third slurry component supply configured to supply a corrosion inhibitor without an oxidizer, without an etchant and without an abrasive; dispensing a first slurry component onto two or more first zones of a polishing platform via a distribution system configured to dispense the first slurry component from the plurality of individual slurry component supplies; and dispensing a second slurry component onto one or more second zones of the polishing platform via the distribution system. ### Claim 13 (depends on 12) The method of claim 12 wherein the first slurry component and the second slurry component are provided in the two or more first zones and the one or more second zones concurrently. ### Claim 14 (depends on 12) The method of claim 12, further comprising dispensing a rinsing liquid onto the polishing platform. ### Claim 15 (depends on 12) The method of claim 12, further comprising dispensing a rinsing liquid into a zone located between at least one of the two or more first zones and at least one of the one or more second zones.