# US 10,500,087 B2 · Cooling devices for providing cooling therapy to the body

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- Number: US 10,500,087 B2
- Document ID: US10500087B2
- Status: Granted
- Kind: B2
- Application number: 15/947,124
- Filed: 2018-04-06
- Published: 2018-10-11
- Granted: 2019-12-10
- Earliest claimed: 2017-04-10
- Assignees: Relief Technologies, Inc.
- Applicants: Relief Technologies, Inc.
- Inventors: Jonathan Moulton Thomas; Brian James Krieger; Richard Thomas Caligaris; Elizabeth Ann Miracle; Grace Hina Lee
- Web page: https://patentgrep.com/patent/US10500087B2

## CPC

- A61F 7/007: {characterised by electric heating}
- A61B 34/25: {User interfaces for surgical systems}
- A61F 7/02: Compresses or poultices for effecting heating or cooling
- A61F 7/10: Cooling bags, e.g. ice-bags
- H10N 10/17: characterised by the structure or configuration of the cell or thermocouple forming the device
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/28: comprising Peltier coolers
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- A61F 2007/0001: {Body part}
- A61F 2007/0027: {Lower part of back}
- A61F 2007/003: {Shoulder}
- A61F 2007/005: {female}
- A61F 2007/0075: {using a Peltier element, e.g. near the spot to be heated or cooled}
- A61F 2007/0078: {with a battery}
- A61F 2007/0086: {with a thermostat}
- A61F 2007/0093: {programmed}
- A61F 2007/0095: {with a temperature indicator}
- A61F 2007/0225: {connected to the body or a part thereof}
- A61F 2007/0228: {with belt or strap, e.g. with buckle}
- A61F 2007/0292: {using latent heat produced or absorbed during phase change of materials, e.g. of super-cooled solutions}
- A61F 2007/0295: {for heating or cooling or use at more than one temperature}
- A61F 2007/108: {Cold packs, i.e. devices to be cooled or frozen in refrigerator or freezing compartment}
- A61F: FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS (dental prosthetics A61C)
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.

## Claims

### Claim 1

A cooling device comprising:
a package substrate;
a plurality of cooling units configured to cool a user's body, each cooling unit comprising a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate, wherein each of the cooling units is connected to the package substrate; and
device electronics coupled to the cooling units, the device electronics configured to:
store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time;
deliver power to the cooling units according to the first cooling device profile;
wirelessly receive a second cooling device profile from an external computing device; and
deliver power to the cooling units according to the second cooling device profile.

### Claim 2 (depends on 1)

The cooling device of claim 1, wherein the package substrate is flexible.

### Claim 3 (depends on 1)

The cooling device of claim 1, wherein each first cooling unit substrate and each second cooling unit substrate of the plurality of cooling units is flexible.

### Claim 4 (depends on 1)

The cooling device of claim 1, further comprising a user input device configured to receive user input, wherein the user input device communicates with the device electronics, and wherein the device electronics are configured to modify the delivery of power to the cooling units in response to user input received by the user input device.

### Claim 5 (depends on 1)

The cooling device of claim 1, wherein the device electronics are configured to:
wirelessly receive user-input instructions from the external computing device indicating how to modify the delivery of power to the cooling units; and
modify the delivery of power to the cooling units in response to the received user-input instructions.

### Claim 6 (depends on 1)

The cooling device of claim 1, further comprising a temperature sensor that generates a temperature signal indicating the temperature in proximity to the temperature sensor, wherein the device electronics are configured to deliver power to the cooling units based on the temperature signal.

### Claim 7 (depends on 1)

The cooling device of claim 1, further comprising a thermal reservoir material in contact with one or more of the cooling units.

### Claim 8 (depends on 7)

The cooling device of claim 7, wherein the thermal reservoir material includes a phase change material.

### Claim 9 (depends on 7)

The cooling device of claim 7, wherein the thermal reservoir material includes one or more metal strips.

### Claim 10 (depends on 7)

The cooling device of claim 7, wherein the thermal reservoir material includes a liquid.

### Claim 11

A cooling device comprising:
a plurality of cooling units configured to cool a user's body, each cooling unit comprising a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate;
device electronics coupled to the cooling units, the device electronics configured to deliver power to each of the cooling units to cool the user's body, wherein the delivery of power to the cooling units causes the transfer of heat from the first cooling unit substrates to the second cooling unit substrates; and
a thermal reservoir material in contact with the second cooling unit substrates.

### Claim 12 (depends on 11)

The cooling device of claim 11, wherein the thermal reservoir material includes a phase change material.

### Claim 13 (depends on 11)

The cooling device of claim 11, wherein the thermal reservoir material includes one or more metal strips.

### Claim 14 (depends on 11)

The cooling device of claim 11, wherein the thermal reservoir material includes a liquid.

### Claim 15 (depends on 11)

The cooling device of claim 11, further comprising a flexible package substrate, wherein each of the cooling units is connected to the flexible package substrate.

### Claim 16 (depends on 11)

The cooling device of claim 11, wherein the first cooling unit substrates and the second cooling unit substrates are flexible.

### Claim 17 (depends on 11)

The cooling device of claim 11, further comprising a user input device configured to receive user input, wherein the user input device communicates with the device electronics, and wherein the device electronics are configured to modify the delivery of power to the cooling units in response to user input received by the user input device.

### Claim 18 (depends on 11)

The cooling device of claim 11, wherein the device electronics are configured to:
wirelessly receive user-input instructions from an external computing device indicating how to modify the delivery of power to the cooling units; and
modify the delivery of power to the cooling units in response to the received user-input instructions.

### Claim 19 (depends on 11)

The cooling device of claim 11, further comprising a temperature sensor that generates a temperature signal indicating the temperature in proximity to the temperature sensor, wherein the device electronics are configured to deliver power to the cooling units based on the temperature signal.

### Claim 20 (depends on 11)

The cooling device of claim 11, wherein the device electronics are configured to:
store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time;
deliver power to the cooling units according to the first cooling device profile;
wirelessly receive a second cooling device profile from an external computing device; and
deliver power to the cooling units according to the second cooling device profile.