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US 10,494,551 B2Granted
Adhesive compostions with wide service temperature window and use thereof
AssigneeHenkel IP & Holding GmbH
InventorsChuiwah Alice Cheung, Stephane Belmudes
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Abstract
The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.
Claims12
A hot melt adhesive composition consisting of:
- (A) about 10 to about 60 wt % of an ethylene vinyl acetate polymer, wherein the vinyl acetate content is less than 25 wt %;
- (B) about 2 to about 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer having a viscosity range of 10,000 to 20,000 cP at 350° F., wherein the functionalized metallocene catalyzed polyethylene copolymer is grafted with a functional group selected from fumaric acid, acrylic acid, acetate, sulfonate, citaconic anhydride or maleic anhydride;
- (C) a wax;
- (D) about 20 to about 60 wt % of a tackifier;
- and
- (E) a stabilizer, plasticizer, oil, antioxidant, crosslinking agent, filler, nucleating agent, adhesion promoter, elastomer, colorant, rheology modifier or mixtures thereof,
- wherein the total wt % of the components is equal to 100 wt % of the adhesive;
- wherein the adhesive has a clear, miscible state at the molten temperature;
- and
- wherein the adhesive is characterized as having higher low temperature flexibility and higher heat resistance over an adhesive without the functionalized metallocene catalyzed polyethylene copolymer.
7 more elements
Dependencies are inferred from the claim text.