Element substrate, manufacturing method thereof, printhead, and printing apparatus

A manufacturing method of an element substrate having a multilayered structure comprising:

• forming a first interlayer insulation film configured to cover a wiring layer with respect to a base with the wiring layer being formed on a side of a front surface of the base;
• forming a first via hole configured to reach the wiring layer in the first interlayer insulation film;
• forming a first electrical connecting member by filling the first via hole with a metal material and smoothing a surface of the first interlayer insulation film;
• forming a temperature detection element in a region on the surface of the first interlayer insulation film including the first electrical connecting member;
• forming a second interlayer insulation film on the surface of the first interlayer insulation film and a surface of the temperature detection element;
• and
• forming an electrothermal transducer on a surface of the second interlayer insulation film.

A printhead that uses an element substrate having a multilayered structure, uses an electrothermal transducer as a print element, and discharges ink by applying thermal energy to ink by the print element, comprising:

• an orifice provided near the print element and configured to discharge ink;
• a supply port configured to supply ink to the print element;
• and
• a pressure chamber configured to communicate with the supply port and the orifice, in which ink bubbles due to heat generation of the print element,
• wherein the element substrate comprises:
• a base;
• a wiring layer formed on a side of a front surface of the base;
• a first interlayer insulation film configured to cover the wiring layer;
• a temperature detection element formed on a surface of the first interlayer insulation film;
• a first electrical connecting member configured to penetrate through the first interlayer insulation film, and electrically connect the temperature detection element and a wiring for the temperature detection element of the wiring layer;
• a second interlayer insulation film formed on a surface of the temperature detection element and the surface of the first interlayer insulation film;
• an electrothermal transducer arranged at a position where at least a part of the electrothermal transducer overlaps the temperature detection element when viewed from a direction perpendicular to the front surface of the base, and formed on a surface of the second interlayer insulation film;
• and
• a second electrical connecting member configured to penetrate through at least the second interlayer insulation film, and electrically connect the electrothermal transducer and a wiring for the electrothermal transducer of the wiring layer.

A printing apparatus which prints an image by discharging ink to a print medium by using a printhead that uses an element substrate having a multilayered structure, uses an electrothermal transducer as a print element, and discharges ink by applying thermal energy to ink by the print element,

• wherein the printhead comprises:
• an orifice provided near the print element and configured to discharge ink;
• a supply port configured to supply ink to the print element;
• and
• a pressure chamber configured to communicate with the supply port and the orifice, in which ink bubbles due to heat generation of the print element,
• wherein the element substrate comprises:
• base;
• a wiring layer formed on a side of a front surface of the base;
• a first interlayer insulation film configured to cover the wiring layer;
• a temperature detection element formed on a surface of the first interlayer insulation film;
• a first electrical connecting member configured to penetrate through the first interlayer insulation film, and electrically connect the temperature detection element and a wiring for the temperature detection element of the wiring layer;
• a second interlayer insulation film formed on a surface of the temperature detection element and the surface of the first interlayer insulation film;
• an electrothermal transducer arranged at a position where at least a part of the electrothermal transducer overlaps the temperature detection element when viewed from a direction perpendicular to the front surface of the base, and formed on a surface of the second interlayer insulation film;
• and
• a second electrical connecting member configured to penetrate through at least the second interlayer insulation film, and electrically connect the electrothermal transducer and a wiring for the electrothermal transducer of the wiring layer.

An element substrate having a multilayered structure comprising:

• a base;
• a wiring layer formed on a side of a front surface of the base;
• a first interlayer insulation film configured to cover the wiring layer;
• a temperature detection element formed on a surface of the first interlayer insulation film;
• a first electrical connecting member configured to penetrate through the first interlayer insulation film, and electrically connect the temperature detection element and a wiring for the temperature detection element of the wiring layer;
• a second interlayer insulation film which is formed on a surface of the temperature detection element and the surface of the first interlayer insulation film, and is thinner than the first interlayer insulation film;
• an electrothermal transducer formed on a surface of the second interlayer insulation film;
• and
• a second electrical connecting member configured to penetrate through at least the second interlayer insulation film, and electrically connect the electrothermal transducer and a wiring for the electrothermal transducer of the wiring layer.