Back to results
US 10,493,528 B2Granted
Porous copper body, porous copper composite part, method for manufacturing porous copper body, and method for manufacturing porous copper composite part
AssigneeMitsubishi Materials Corporation
InventorsKoichi Kita, Jun Kato, Toshihiko Saiwai
Life of this patent
Estimating the term…
Abstract
A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
Claims9
A porous copper body, comprising:
- a skeleton having a three-dimensional network structure,
- wherein an oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton,
- an oxygen concentration of an entirety of the skeleton is set to be 0.025 mass % or less, and
- a relative electrical conductivity is in a range of 17.4% to 45.2%.
1 more element
Dependencies are inferred from the claim text.