# US 10,485,149 B2 · Composite formulation and composite article

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- Number: US 10,485,149 B2
- Document ID: US10485149B2
- Status: Granted
- Kind: B2
- Application number: 15/275,100
- Filed: 2016-09-23
- Published: 2018-03-29
- Granted: 2019-11-19
- Earliest claimed: 2016-09-23
- Assignees: Te Connectivity Corporation
- Applicants: Tyco Electronics Corporation
- Inventors: Megan Hoarfrost Beers; Jialing Wang; Jaydip Das; Richard B. Lloyd; James Toth; Ting Gao
- Web page: https://patentgrep.com/patent/US10485149B2

## CPC

- H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/34: comprising polyamides
- C08K 3/08: Metals
- C08K 7/00: Use of ingredients characterised by shape
- C08K 9/10: Encapsulated ingredients
- H01B 1/22: the conductive material comprising metals or alloys
- H05K 9/0083: {comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K9/0086 takes precedence)}
- H05K 9/009: {comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked}
- B32B 2264/105: Metal
- B32B 2307/212: Electromagnetic interference shielding
- C08K 2003/085: {Copper}
- C08K 2201/001: Conductive additives
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.

## Claims

### Claim 1

A composite article, comprising
at least two layers of a composite formulation, the composite formulation of each layer including a thermoplastic polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles including a concentration of, by volume, between 20% and 50% of the composite formulation; wherein the conductive particles comprise tin-coated copper particles having a copper/tin volume ratio of between 3/1 and 3/2;
wherein the conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake; and
wherein the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers.

### Claim 2 (depends on 1)

The composite article of claim 1, wherein the composite formulation provides an electromagnetic shielding effectiveness of at least 40 dB over a frequency range of from 0.01 GHz to 25 GHz.

### Claim 3 (depends on 1)

The composite article of claim 1, wherein the thermoplastic polymer matrix is selected from the group consisting of a polyamide (PA), a polyvinylidene fluoride (PVDF), and a combination thereof.

### Claim 4 (depends on 1)

The composite article of claim 1, wherein the concentration of the conductive particles consists of, by volume, between 30% and 45%.

### Claim 5 (depends on 1)

The composite article of claim 1, wherein the composite formulation is electrically conductive, having a resistivity of between 10−1 Ω-cm and 10−5 Ω-cm.

### Claim 6 (depends on 1)

The composite article of claim 1, wherein the composite formulation is extrudable.

### Claim 7 (depends on 1)

The composite article of claim 1, wherein the composite formulation is moldable.

### Claim 8 (depends on 1)

The composite article of claim 1, wherein a combined thickness of the at least two layers is equal to or less than 0.75 mm.

### Claim 9 (depends on 1)

The composite article of claim 1, further comprising a component, the at least two layers of the composite formulation being positioned on a surface of the component.