# US 10,485,138 B2 · Heat sink assemblies for transient cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,485,138 B2 - Document ID: US10485138B2 - Status: Granted - Kind: B2 - Application number: 15/526,475 - Filed: 2015-11-12 - Published: 2017-10-26 - Granted: 2019-11-19 - Earliest claimed: 2014-11-12 - Assignees: GE Aviation Systems LLC - Applicants: GE Aviation Systems LLC - Inventors: Michel Engelhardt; Paul Otto Stehlik; Judd Everett Swanson - Web page: https://patentgrep.com/patent/US10485138B2 ## CPC - H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures} - H10W 40/735: {by melting or evaporation of solids} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature. ## Claims ### Claim 1 A heat sink assembly for use with at least one heat-emitting component, comprising: a first frame holding a first phase change material that changes phase at a first temperature where the first frame has at least a portion conductively coupled to the at least one heat-emitting component; a second frame holding a second phase change material that changes phase at a second temperature, which is greater than the first temperature; and a conductive element defining a structural barrier between the first phase change material and the second phase change material and conductively coupling the first phase change material and the second phase change material; wherein at least one of the first phase change material or the second phase change material includes an additive material for high radiation heat transfer emissivity and the first phase change material changes phase in response to a conductive transfer of heat from the heat-emitting component and the second phase change material changes phase in response to a conductive transfer of heat from the first phase change material. ### Claim 2 A heat sink assembly for use with at least one heat-emitting component, comprising: a first frame holding a first phase change material that changes phase at a first temperature where the first frame has at least a portion conductively coupled to the at least one heat-emitting component; a second frame holding a second phase change material that changes phase at a second temperature, which is greater than the first temperature; and a conductive element defining a structural barrier between the first phase change material and the second phase change material and conductively coupling the first phase change material and the second phase change material; wherein the first frame and the second frame are configured as honeycombs and the first phase change material changes phase in response to a conductive transfer of heat from the heat-emitting component and the second phase change material changes phase in response to a conductive transfer of heat from the first phase change material. ### Claim 3 (depends on 2) The heat sink assembly of claim 2 wherein the conductive element further comprises a plurality of fins extending into the first phase change material or the second phase change material. ### Claim 4 (depends on 2) The heat sink assembly of claim 2 wherein the conductive element further comprises a plurality of fins extending into the first phase change material and the second phase change material. ### Claim 5 (depends on 2) The heat sink assembly of claim 2 wherein the first phase change material is a paraffin wax and the second phase change material is a different paraffin wax. ### Claim 6 (depends on 2) The heat sink assembly of claim 2 wherein the second frame has at least a portion including at least one of aluminium, copper, steel, nickel, or copper tungsten. ### Claim 7 (depends on 2) The heat sink assembly of claim 2 wherein the second frame further comprises fins. ### Claim 8 (depends on 1) The heat sink assembly of claim 1 wherein the conductive element further comprises a plurality of fins extending into the first phase change material or the second phase change material. ### Claim 9 (depends on 1) The heat sink assembly of claim 1 wherein the conductive element further comprises a plurality of fins extending into the first phase change material and the second phase change material. ### Claim 10 (depends on 1) The heat sink assembly of claim 1 wherein the first phase change material is a paraffin wax and the second phase change material is a different paraffin wax. ### Claim 11 (depends on 1) The heat sink assembly of claim 1 wherein the second frame has at least a portion including at least one of aluminum, copper, steel, nickel, or copper tungsten. ### Claim 12 (depends on 1) The heat sink assembly of claim 1 wherein the first frame and the second frame are configured as honeycombs. ### Claim 13 (depends on 1) The heat sink assembly of claim 1 wherein the second frame further comprises fins.