# US 10,485,130 B2 · Surface mount type device and manufacturing method for the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,485,130 B2
- Document ID: US10485130B2
- Status: Granted
- Kind: B2
- Application number: 15/919,229
- Filed: 2018-03-13
- Published: 2018-09-20
- Granted: 2019-11-19
- Earliest claimed: 2017-03-17
- Assignees: Nihon Dempa Kogyo Co., Ltd.
- Applicants: Nihon Dempa Kogyo Co., Ltd.
- Inventors: Masato Ogawa
- Web page: https://patentgrep.com/patent/US10485130B2

## CPC

- H05K 7/1417: {having securing means for mounting boards, plates or wiring boards (H05K7/1461 takes precedence)}
- H05K 5/006: {characterized by features for holding the PCB within the housing}
- H05K 5/0091: {Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H10W99/00)}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A surface mount type device includes: an electronic component, a main substrate on which the electronic component is mounted, a pedestal on which the main substrate is mounted, a lower substrate on which the pedestal is mounted, and a cover mounted on the lower substrate so as to cover the pedestal. The soldering pattern is soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate. The pedestal includes a cut-out portion in a side surface portion so as to form a space above the soldering pattern. The cover is secured to the soldering pattern by a solder formed in the space.

## Claims

### Claim 1

A surface mount type device, comprising:
an electronic component;
a main substrate on which the electronic component is mounted;
a pedestal on which the main substrate is mounted, wherein the pedestal has an outer frame portion and a beam portion which connects two long sides of the outer frame portion;
a lower substrate on which the pedestal is mounted;
a cover mounted on the lower substrate so as to cover the pedestal, wherein
a soldering pattern soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate; and
the pedestal includes a cut-out portion disposed in a side surface portion of the outer frame portion so as to form a space above the soldering pattern, the cut-out portion is configured not to penetrate the side surface portion of the outer frame portion, and the soldering pattern extends from a region outside of the pedestal to the space formed by the cut-out portion, and
the cover is secured to the soldering pattern by a solder formed in the space.

### Claim 2 (depends on 1)

The surface mount type device according to claim 1, wherein
the cut-out portion has a concave shape where the side surface portion is partially cut out from an outer side surface to a bottom portion of the side surface portion.

### Claim 3 (depends on 1)

The surface mount type device according to claim 1, wherein
the pedestal includes a plurality of pins that electrically connect the lower substrate to the main substrate, and
the plurality of pins are secured to electrodes formed on the lower substrate by solder.

### Claim 4 (depends on 1)

A method for manufacturing the surface mount type device according to claim 1 by mounting the pedestal and the cover onto the lower substrate, comprising:
mounting the main substrate where the electronic component is mounted onto the pedestal that includes the cut-out portion on the side surface portion and a plurality of pins;
applying a solder to electrodes formed on the lower substrate and to the soldering pattern formed from the region where the cover is mounted to the inside of the lower substrate;
mounting the pedestal such that the solder on the soldering pattern is positioned inside the space formed by the cut-out portion;
mounting the cover onto the soldering pattern; and
securing the electrodes to the pins, and securing the soldering pattern to the cover simultaneously by reflowing the solder.