# US 10,485,098 B2 · Electronic component device

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- Number: US 10,485,098 B2
- Document ID: US10485098B2
- Status: Granted
- Kind: B2
- Application number: 15/184,380
- Filed: 2016-06-16
- Published: 2016-12-22
- Granted: 2019-11-19
- Earliest claimed: 2015-06-19
- Assignees: Shinko Electric Industries Co., Ltd.
- Applicants: Shinko Electric Industries Co., Ltd.
- Inventors: Shota Miki
- Web page: https://patentgrep.com/patent/US10485098B2

## CPC

- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/4614: {the electrical connections between the circuit boards being made during lamination}
- H10P 72/74: {using temporarily an auxiliary support}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 2201/10674: Flip chip
- H05K 2201/10977: Encapsulated connections
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/01235: {by plating, e.g. electroless plating or electroplating}
- H10W 72/01238: {in gaseous form, e.g. by CVD or PVD}
- H10W 72/01255: {by using masks}
- H10W 72/01323: {in liquid form, e.g. by dispensing droplets or by screen printing}
- H10W 72/01325: {in solid form}
- H10W 72/019: {of bond pads}
- H10W 72/01931: {using blanket deposition}
- H10W 72/01953: {by etching}
- H10W 72/0198: {batch processes}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/354: {comprising polymers}
- H10W 72/90: Bond pads, in general
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An electronic component device includes: a wiring board including an insulating layer, and a plurality of pads exposed from the insulating layer; an electronic component module including: an insulating base material; an electronic component embedded in the insulating base material; and a plurality of connection terminals each connected to a corresponding one of the pads; and a sealing resin provided between the whole of a lower surface of the electronic component module id the wiring board. A content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material.

## Claims

### Claim 1

An electronic component device comprising:
a wiring board comprising:
a core substrate having a first surface and a second surface;
a first multilayer wiring layer disposed on the first surface of the core substrate, the first multilayer wiring layer comprising an insulating layer and a plurality of pads exposed from the insulating layer;
a second multilayer wiring layer disposed on the second surface of the core substrate;
an electronic component module comprising:
an insulating base material comprising a first insulating base material layer and a second insulating base material layer, wherein the second insulating base material layer is disposed on a first surface of the first insulating base material layer with a second surface of the second insulating base material layer facing the first surface of the first insulating base material layer, a first surface of the second insulating base material layer is opposite to the second surface of the second insulating base material layer, and a second surface of the first insulating base material layer is opposite to the first surface of the first insulating base material layer and defines a surface of the electronic component module;
an electronic component embedded in the first insulating base material layer of the insulating base material, wherein an electrode of the electronic component is exposed from the second surface of the first insulating base material layer, and the first insulating base material layer has an opening portion which is formed in a region outside the electronic component;
a wiring layer comprising a wiring portion formed on the first surface of the first insulating base material layer and a second wiring layer disposed on the first surface of the second insulating base material layer;
a columnar conductor which is connected to the wiring portion and embedded in the opening portion;
a plurality of connection terminals each connected to a corresponding one of the pads, wherein at least one of the plurality of connection terminals is electrically connected to the electrode of the electronic component, and at least one of the plurality of connection terminals is electrically connected to the columnar conductor;
a solder resist layer formed on the first surface of the second insulating base material layer, the solder resist layer having a solder resist layer opening portion defined therethrough, the solder resist layer opening portion exposing a portion of the second wiring layer from the solder resist layer; and
a sealing resin provided between the insulating base material of the electronic component module and the wiring board such that an entirety of the insulating base material of the electronic component module is spaced from the insulating layer of the wiring board with the sealing resin disposed therebetween,
wherein a content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material wherein a content rate of electrically nonconductive filler contained in the sealing resin is higher than that of electrically nonconductive filler contained in the insulating layer and that of electrically nonconductive tiller contained in the insulating base material; and
wherein the content rate of electrically nonconductive filler contained in the insulating layer and the content rate of electrically nonconductive filler contained in the insulating base material are greater than zero.

### Claim 2 (depends on 1)

The electronic component device according to claim 1, wherein the electrically nonconductive content rate of the filler contained in the insulating base material is higher than that of the electrically nonconductive filler contained in the insulating layer.

### Claim 3 (depends on 1)

The electronic component device according to claim 1, wherein
the insulating base material is made of a non-photosensitive resin, and
the insulating layer is made of a photosensitive resin.

### Claim 4 (depends on 1)

The electronic component device according to claim 1, wherein the sealing resin directly contacts both the insulating layer and the insulating layer base material, and the insulating layer and the insulating layer base material do not contact each other.