# US 10,485,094 B1 · Multilayer structure with embedded sensing functionalities and related method of manufacture > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,485,094 B1 - Document ID: US10485094B1 - Status: Granted - Kind: B1 - Application number: 16/113,198 - Filed: 2018-08-27 - Granted: 2019-11-19 - Earliest claimed: 2018-08-27 - Assignees: Tactotek Oy - Applicants: TactoTek Oy - Inventors: Anne Isohätälä; Hasse Sinivaara; Heikki Tuovinen; Ville Wallenius; Vinski Bräysy; Tomi Simula; Mikko Heikkinen; Minna Pirkonen; Tuukka Junkkari; Jarmo Sääski; Janne Asikkala; Antti Keränen - Web page: https://patentgrep.com/patent/US10485094B1 ## CPC - G06F 3/0443: {using a single layer of sensing electrodes} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - G01R 27/2605: {Measuring capacitance (capacitive sensors G01D5/24)} - G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - G06F 3/044: by capacitive means - G06F 3/046: by electromagnetic means - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04104: Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger - G06F 2203/04107: Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds - H05K 1/0259: {Electrostatic discharge [ESD] protection} - H05K 1/0266: {Marks, test patterns or identification means} - H05K 1/162: {incorporating printed capacitors} - H05K 1/165: {incorporating printed inductors} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)} - H05K 2201/0133: Elastomeric or compliant polymer - H05K 2201/0317: Thin film conductor layer; Thin film passive component - H05K 2201/10151: Sensor - H05K 2201/10287: Metal wires as connectors or conductors - H05K 2203/1327: Moulding over PCB locally or completely - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer. ## Claims ### Claim 1 An integrated multilayer structure suitable for use in sensing applications, the multilayer structure comprising: at least one plastic layer having a first side and a second side opposite the first side; at least one film layer provided on both of the first and second sides of the at least one plastic layer; the at least one film layer on the first side of the at least one plastic layer comprising electronics incorporating reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the sensing electronics comprising at least one electrode and a galvanic connection element configured to connect the electrode to an associated control circuitry driving the at least one electrode; and the at least one film layer on the second side of the at least one plastic layer comprising one or more features including at least one conductive feature, the one or more features being configured to shape an electromagnetic field to adapt a sensitivity or a directionality of a sensing response of the sensing electronics on the first side of the at least one plastic layer. ### Claim 2 (depends on 1) The multilayer structure of claim 1, wherein the at least one film layer on the first side of the at least one plastic layer comprises electrically insulating material, provided with conductive coating. ### Claim 3 (depends on 1) The multilayer structure of claim 1, wherein the sensing electronics comprises one or more electronic components disposed on the at least one film layer on the first side of the at least one plastic layer. ### Claim 4 (depends on 1) The multilayer structure of claim 1, wherein the at least one electrode of the sensing electronics defines at least one electrode pattern the elements of which being provided in one or more layers on one or opposing two sides of the at least one film layer on the first side of the at least one plastic layer. ### Claim 5 (depends on 4) The multilayer structure of claim 4, wherein the pattern comprises a mutual capacitance sensing pattern of a plurality of transmitter and receiver electrodes, or a self-capacitance sensing pattern of a plurality of sensing electrodes. ### Claim 6 (depends on 1) The multilayer structure of claim 1, wherein the at least one film layer on the first side comprises a first film and the at least one film layer on the second side comprises a second film. ### Claim 7 (depends on 1) The multilayer structure of claim 1, wherein the one or more features comprise at least one electrically conductive or insulating functional element locally defined by the material of a film of the at least one film layer on the second side of the at least one plastic layer. ### Claim 8 (depends on 1) The multilayer structure of claim 1, wherein the one or more features comprise conductive material constituting at least portion of a film of the at least one film layer on the second side of the at least one plastic layer. ### Claim 9 (depends on 1) The multilayer structure of claim 1, wherein the one or more features comprise at least one electrically or thermally conductive or insulating element defined by, additional conductive or insulating material provided on a film of the at least one film layer on the second side of the at least one plastic layer. ### Claim 10 (depends on 9) The multilayer structure of claim 9, wherein the element extends locally on the film. ### Claim 11 (depends on 9) The multilayer structure of claim 9, wherein the element extends over a major portion of or substantially whole surface of the film on at least one side thereof. ### Claim 12 (depends on 1) The multilayer structure of claim 1, wherein at least one of the one or more features comprises colored, conductive material on a film of the at least one film layer on the second side of the at least one molded plastic layer. ### Claim 13 (depends on 1) The multilayer structure of claim 1, wherein at least one of the one or more features is positioned adjacent a predefined sensing area or sensing volume established by at least one electrode and a further electrode or reference pattern provided in the structure, or positioned at least partially superimposed over a conductive trace of the sensing electronics, the at least one feature defining at least one functional element selected from the group consisting of: an electromagnetic shield for shielding, the sensing area, sensing volume, or said trace from external or internal electromagnetic disturbances or interference; and electromagnetic or electric field adjuster for adjusting sensitivity of the sensing volume. ### Claim 14 (depends on 1) The multilayer structure of claim 1, wherein the sensing electronics and the one or more features define one or more sensing areas or volumes on both sides of the at least one plastic layer and the structure further comprises an intermediate film within the at least one plastic layer, said intermediate film being at least partially made of or provided with conductive material defining an electromagnetic shield or a grounding layer to reduce mutual electromagnetic interference between the sensing functions of both sides. ### Claim 15 (depends on 1) The multilayer structure of claim 1, wherein the one or more features define at least one element selected from the group consisting of: electrode or electrode pattern configured to establish a mutual capacitance sensing arrangement with the at least one electrode of the sensing electronics, electrode or electrode pattern on a side of a film of said at least one film layer on the second side of the at least one plastic layer that faces the at least one plastic layer and configured to establish a mutual capacitance sensing arrangement with the at least one electrode of the sensing electronics, touch or contactless sensing region, Non-Conductive Vacuum Metallization (NCVM) coating, electroless plating based coating, Physical Vapor Deposition (PVD) coating, capacitively coupled electromagnetic or electric field adjuster, parasitic coupling based sensing feature, reference electrode, actively or passively coupled reference plate, ground electrode, and floating ground, earthed, or circuit ground connected ground electrode. ### Claim 16 (depends on 1) The multilayer structure of claim 1, wherein the at least one plastic layer comprises a volume of elastic material provided locally upon the at least one electrode of the sensing electronics or below a predefined sensing region on the at least one film layer on the second side of the at least one plastic layer, the volume being configured to compress responsive to an external three subjected thereto through said at least one film layer of the first side of the at least one plastic layer. ### Claim 17 (depends on 1) The multilayer structure of claim 1, comprising a galvanic connection element between the sensing electronics and the one or more features. ### Claim 18 (depends on 1) The multilayer structure of claim 1, further comprising at least one protective or decorative overlay layer upon the at least one film layer on the second side of the at least one plastic layer, wherein the overlay layer comprises at least one material selected from the group consisting of: veneer, wood, textile, fabric, biological natural material, molded material, injection molded material, and plastics. ### Claim 19 An integrated multilayer structure suitable for use in sensing applications, the multilayer structure comprising: at least one plastic layer having a first side and a second side opposite the first side; at least one film layer provided on both of the first and second sides of the at least one plastic layer; the at least one film layer on the first side of the at least one plastic layer comprising electronics incorporating reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the sensing electronics comprising at least one electrode and a galvanic connection element configured to connect the electrode to an associated control circuitry driving the at least one electrode; and the at least one film layer on the second side of the at least one plastic layer comprising one or more features including at least one conductive feature, the one or more features being configured to shape an electromagnetic field to adapt a sensitivity or a directionality of a sensing response of the sensing electronics on the first side of the at least one plastic layer; and a film, first section of which defines at least portion of the at least one film layer on the first side of the at least one plastic layer and second section of which defines at least portion of the at least one film layer on the second side of the at least one plastic layer, wherein the first and second sections are connected by a third section extending between the first and second sections. ### Claim 20 A method for manufacturing an integrated multilayer structure for sensing applications, comprising: obtaining a film; arranging the film with reactance sensing electronics for sensing of one or more selected target quantities or qualities on a surface of the film, and conversion thereof into representative electrical signals, the sensing electronics comprising at least one electrode and a galvanic connection element connecting the at least one electrode to an associated control circuitry driving the at least one electrode; arranging the film with one or more features including a conductive feature on the surface of the film, the one or more features being configured to shape an electromagnetic field to adapt a sensitivity or a directionality of the sensing response of the sensing, electronics; and arranging and configuring at least one plastic layer relative to the film so that the at least one plastic layer defines an integrated, intermediate layer between the sensing electronics and the one or more features hosted by the film.