# US 10,485,093 B2 · Flexible printed board and method for manufacturing flexible printed board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,485,093 B2 - Document ID: US10485093B2 - Status: Granted - Kind: B2 - Application number: 16/307,111 - Filed: 2017-06-21 - Published: 2019-03-21 - Granted: 2019-11-19 - Earliest claimed: 2016-09-06 - Assignees: Nippon Mektron, Ltd. - Applicants: Nippon Mektron, Ltd. - Inventors: Satoshi Ebihara; Takahisa Kato; Nobuto Sasaki; Kazuyuki Azuma; Tomohiro Shimokawaji; Takeo Wakabayashi - Web page: https://patentgrep.com/patent/US10485093B2 ## CPC - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/181: associated with surface mounted components - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - F21Y 2107/70: on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)} - H05K 2201/0154: Polyimide - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H05K 2201/10106: Light emitting diode [LED] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract Provided are both a flexible printed board, in which heat dissipation performance can be improved in without using an aluminum heal dissipating material, which is light in weight, has good processability and can be reduced in cost, and a method for manufacturing such a flexible printed board. The flexible printed board is a flexible printed board 10 on which a power consuming load is mounted, including: a front surface heat dissipation layer 30 made of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layer 20 having the front surface heat dissipation layer 30 laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more; and a rear surface heat dissipation layer made of a copper foil, laminated to a rear surface side of the thermally conductive resin layer 20, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer 30. ## Claims ### Claim 1 A flexible printed board on which a power consuming load is mounted, comprising: a front surface heat dissipation layer made of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layer having the front surface heat dissipation layer laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more, the front surface heat dissipation layer being arranged between the power consuming load and the thermally conductive resin layer with respect to a thickness direction, the front surface heat dissipation layer being directly contact with a front surface side of the thermally conductive resin layer; and a rear surface heat dissipation layer made of a copper foil, laminated to and in direct contact with a rear surface side of the thermally conductive resin layer, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer. ### Claim 2 (depends on 1) The flexible printed board according to claim 1, wherein the thermally conductive resin layer contains an epoxy resin, a curing agent, a curing accelerator, a flexibility component, and a thermally conductive filler, and a blending amount of the thermally conductive filler in the thermally conductive resin layer is 30 vol % or more. ### Claim 3 (depends on 2) The flexible printed board according to claim 2, wherein the thermally conductive filler contains one or more components selected from zinc oxide, titanium oxide, boron nitride, aluminum oxide, aluminum nitride, silicon carbide, hexagonal boron nitride and magnesium carbonate. ### Claim 4 (depends on 2) The flexible printed board according to claim 2, wherein the rear surface heat dissipation layer is further provided with a cover coat layer on a rear surface side thereof, and the cover coat layer in a portion in which the rear surface heat dissipation layer is etched has a film thickness of 15 μm or less and a thermal emissivity of 0.68 or more. ### Claim 5 (depends on 4) The flexible printed board according to claim 4, wherein the rear surface heat dissipation layer is further provided with an etched recess. ### Claim 6 (depends on 5) The flexible printed board according to claim 5, wherein an elongation percentage of a portion having the cover coat layer laminated to the thermally conductive resin layer in a portion from which the front surface heat dissipation layer is removed on a front surface side of the recess is 19.5% or more. ### Claim 7 (depends on 5) The flexible printed board according to claim 5, wherein the front surface heat dissipation layer is further provided with a wiring portion connected to the circuit portion, and a slit portion corresponding to the recess partially etched for bending or curving is provided on a rear surface side of the wiring portion. ### Claim 8 (depends on 7) The flexible printed board according to claim 7, further comprising: a mounting area including the circuit portion on which the load is mounted; and a cable portion including the wiring portion and located between mounting areas adjacent to each other and connecting the mounting areas, wherein the recess is formed on an end portion side of the rear surface heat dissipation layer in the cable portion so as to overlap an end portion side of the front surface heat dissipation layer in a plan view. ### Claim 9 (depends on 7) The flexible printed board according to claim 7, further comprising: a mounting area including the circuit portion on which the load is mounted; and a cable portion including the wiring portion and located between mounting areas adjacent to each other and connecting the mounting areas, wherein a bent portion bent in the thickness direction is connected to an end portion side in a width direction intersecting a longitudinal direction of a portion to which the cable portion is connected in the mounting area, and at least the rear surface heat dissipation layer is provided in the bent portion. ### Claim 10 (depends on 1) The flexible printed board according to claim 1, wherein the rear surface heat dissipation layer is a first surface heat dissipation layer, the flexible printed circuit board further comprising a second rear surface heat dissipation layer, wherein the first and the second rear surface heat dissipation layers are bonded to each other. ### Claim 11 A method for manufacturing a flexible printed board on which a power consuming load is mounted, comprising: a first step of forming an uncured thermally conductive resin layer which is a thermally conductive resin layer having a thermal conductivity of 0.49 W/mK or more in a cured state on a copper foil as a front surface heat dissipation layer; a second step of bonding another copper foil having a thickness of 100 to 400% with respect to the front surface heat dissipation layer to the uncured thermally conductive resin layer, as a rear surface heat dissipation layer after the first step; and a third step of etching the copper foil to be the front surface heat dissipation layer and the other copper foil to be the rear surface heat dissipation layer to form the front surface heat dissipation layer and the rear surface heat dissipation layer. ### Claim 12 (depends on 7) The flexible printed board according to claim 7, wherein the rear surface heat dissipation layer is a first surface heat dissipation layer, the flexible printed circuit board further comprising a second rear surface heat dissipation layer, and wherein the first and the second rear surface heat dissipation layers are bonded to each other, the first rear surface heat dissipation layer being a circuit side rear surface heat dissipation layer opposed to the circuit portion via the thermally conductive resin layer, and the second rear surface heat dissipation layer being a cable side rear surface heat dissipation layer opposed to the wiring portion via the thermally conductive resin layer.