# US 10,485,092 B2 · Multilayer bus board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,485,092 B2 - Document ID: US10485092B2 - Status: Granted - Kind: B2 - Application number: 15/552,116 - Filed: 2016-02-16 - Published: 2018-02-15 - Granted: 2019-11-19 - Earliest claimed: 2015-02-18 - Assignees: Interplex Industries, Inc. - Applicants: Richard Schneider; Joseph J. Lynch; Interplex Industries, Inc. - Inventors: Richard Schneider; Joseph J. Lynch - Web page: https://patentgrep.com/patent/US10485092B2 ## CPC - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H01R 12/526: {the printed circuits being on the same board (with plated through holes H05K3/42)} - H02G 5/005: {Laminated bus-bars} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 3/4679: {Aligning added circuit layers or via connections relative to previous circuit layers} - H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)} - H05K 2201/01: Dielectrics - H05K 2201/0323: Carbon - H05K 2201/10242: Metallic cylinders - H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors - H05K 2201/10303: Pin-in-hole mounted pins - H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES ## Abstract A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation. ## Claims ### Claim 1 A multilayer bus board comprising: a multilayer stacked assembly having a plurality of layers including a pair of electrically conductive layers and a dielectric layer disposed between and adjoining each of the conductive layers; and a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer and the conductive layers to maintain the conductive layers and the dielectric layer in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layers is exposed. ### Claim 2 (depends on 1) The multilayer bus board of claim 1, wherein the layers are mechanically held together by the frame and are not secured to each other by adhesive, lamination or other type of bonding. ### Claim 3 (depends on 1) The multilayer bus board of claim 1, wherein electricity flows through each of the conductive layers, and wherein each of the conductive layers has a width and thickness, and wherein the thickness ranges from 0.25 mm to 0.6 mm and the ratio of width to thickness is greater than 200:1. ### Claim 4 (depends on 1) The multilayer bus board of claim 1, wherein electricity flows through the conductive layers in opposite directions and wherein the conductive layers are positioned less than 0.3 mm apart from each other. ### Claim 5 (depends on 1) The multilayer bus board of claim 1, wherein the multilayer stack assembly periphery comprises nonlinear undulations, wherein said frame covers at least a portion of the nonlinear undulations. ### Claim 6 (depends on 1) The multilayer bus board of claim 1, wherein the outer one of the layers is one of the conductive layers, and wherein the outer one of the layers has an internal surface adjoining the dielectric layer. ### Claim 7 (depends on 6) The multilayer bus board of claim 6, wherein the external surface of the outer one of the layers is surface treated to increase heat dissipation. ### Claim 8 (depends on 1) The multilayer bus board of claim 1, wherein the outer one of the layers is a first one of the conductive layers, wherein a second one of the conductive layers is bent to form an exposed portion, and wherein the multilayer bus board further comprises an electrical component having first and second leads, the first lead being electrically connected to the first one of the conductive layers and the second lead being electrically connected to the exposed portion of the second one of the conductive layers. ### Claim 9 (depends on 8) The multilayer bus board of claim 8, wherein the first one of the conductive layers is bent to form a first contact portion extending outwardly from the multilayer stacked assembly, wherein the exposed portion of the second one of the conductive layers is a second contact portion extending outwardly from the multilayer stacked assembly, and wherein the first lead of the electrical component is electrically connected to the first contact portion of the first one of the conductive layers and the second lead of the electrical component is electrically connected to the second contact portion of the second one of the conductive layers. ### Claim 10 (depends on 8) The multilayer bus board of claim 8, wherein the exposed portion of the second one of the conductive layers is coplanar with the first one of the conductive layers, and wherein the first lead of the electrical component physically contacts the external surface of the outer one of the layers. ### Claim 11 (depends on 1) The multilayer bus board of claim 1, wherein a plurality of aligned holes extend through a plurality of the layers, and wherein the frame includes a dielectric insulator disposed within at least a first one of the aligned holes. ### Claim 12 (depends on 11) The multilayer bus board of claim 11, wherein the first one of the aligned holes extends through a first one of the conductive layers and a second one of the aligned holes extends through a second one of the conductive layers, and wherein the dielectric insulator is a dielectric sleeve having an opening extending therethrough. ### Claim 13 (depends on 12) The multilayer bus board of claim 12, wherein the dielectric sleeve is joined to the peripheral portion of the frame by one or more legs. ### Claim 14 (depends on 12) The multilayer bus board of claim 12, wherein the multilayer bus board further comprises an electrical component mounted to the multilayer stacked assembly, wherein the electrical component is insulated by the dielectric sleeve from the first one of the conductive layers. ### Claim 15 (depends on 14) The multilayer bus board of claim 14, wherein the dielectric sleeve is also disposed within the second one of the aligned holes, and wherein the electrical component is disposed inside the dielectric sleeve so as to be insulated by the dielectric insulator from both the first and second ones of the conductive layers. ### Claim 16 (depends on 14) The multilayer bus board of claim 14, wherein the electrical component is electrically connected to the second one of the conductive layers. ### Claim 17 (depends on 16) The multilayer bus board of claim 16, wherein the electrical component is a conductive contact that extends through the dielectric sleeve and is disposed in the second one of the aligned holes so as to be in electrical mating interconnection with the second one of the conductive layers. ### Claim 18 (depends on 11) The multilayer bus board of claim 11, wherein the multilayer bus board further comprises an electrical component mounted to the multilayer stacked assembly, the electrical component comprising two contact leads, one of the contact leads being electrically connected to the first one of the conductive layers and being insulated by the dielectric insulator from the second one of the conductive layers, while the other one of the contact leads being electrically connected to the second one of the conductive layers and being insulated by the dielectric insulator from the first one of the conductive layers. ### Claim 19 (depends on 18) The multilayer bus board of claim 18, wherein said electrical component is selected from a group comprising: an ammeter shunt, thermistor, diode, sensor, current sensor, resistor, capacitor and combinations thereof. ### Claim 20 (depends on 1) An electrical assembly comprising the multi-layer bus board of claim 1, wherein the peripheral portion of the frame of the multilayer bus board has a plurality of mounting holes, and wherein the electrical assembly further comprises: bushings disposed in the mounting holes, respectively, the bushings having flanges, respectively; and a circuit board mounted to the multilayer bus board by fasteners extending through the bushings, the circuit board being spaced from the outer one of the layers of the multilayer stacked assembly by the flanges of the bushings.