# US 10,484,796 B2 · Speaker device and method for manufacturing speaker device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,484,796 B2 - Document ID: US10484796B2 - Status: Granted - Kind: B2 - Application number: 16/063,943 - Filed: 2016-12-16 - Published: 2019-08-29 - Granted: 2019-11-19 - Earliest claimed: 2015-12-25 - Assignees: Dai-Ichi Seiko Co., Ltd. - Applicants: Dai-Ichi Seiko Co., Ltd. - Inventors: Kenji Ogata; Shogo Kurogi; Yoshiyuki Watanabe - Web page: https://patentgrep.com/patent/US10484796B2 ## CPC - H04R 1/403: {loud-speakers} - H04R 17/10: Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency - B81B 3/00: Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B5/00 takes precedence) - B81B 7/04: Networks or arrays of similar microstructural devices - B81C 1/00: Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) - H04R 17/00: Piezoelectric transducers; Electrostrictive transducers (piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners {H10N30/00}) - H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} - H10N 30/20: with electrical input and mechanical output, e.g. functioning as actuators or vibrators - H10N 30/2047: {Membrane type} - H04R 1/345: {for loudspeakers} - H04R 2201/003: Mems transducers or their use - H04R 2201/401: 2D or 3D arrays of transducers - H10N 30/076: by vapour phase deposition - H10N 30/082: by etching, e.g. lithography - H10N 30/706: {characterised by the underlying bases, e.g. substrates} - H10N 30/8554: {Lead-zirconium titanate [PZT] based} - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract An array speaker device (1A) includes a vibrator (20) arranged on one face of a substrate having a uniform thickness, the vibrator being formed of a base material layer (11), a first electrode layer (12), a piezoelectric element layer (13), and a second electrode layer (14), each of which has a uniform thickness, and which are layered in the order mentioned on the substrate. A hole through which a sound wave is outputted in the thickness direction of the substrate is provided on the substrate at a position corresponding to the vibrator (20), the sound wave being generated by vibration of the vibrator (20) to which a voltage signal is applied via the first electrode layer (12) and the second electrode layer (14). Scallops (S) made of an indentation and a projection alternating in the thickness direction of the substrate are formed on the inner circumferential wall of the hole. ## Claims ### Claim 1 A speaker device comprising: a substrate having a uniform thickness; a vibrator arranged on one face of the substrate, the vibrator comprising a base material layer, a first electrode layer, a piezoelectric element layer, and a second electrode layer, each of which has a uniform thickness, and which are layered in an order mentioned; and a resonator that resonates with the vibration of the vibrator and makes the sound wave outputted in the thickness direction of the substrate closer to a plane parallel to the substrate, wherein a hole through which a sound wave is outputted in a thickness direction of the substrate is provided on another face of the substrate at a position corresponding to the vibrator, the sound wave being generated by vibration of the vibrator to which a voltage signal is applied via the first electrode layer and the second electrode layer, wherein an attachment portion is provided at a center of the hole, the resonator being attached to the attachment portion, wherein scallops made of an indentation and a projection alternating in the thickness direction of the substrate are formed on an inner circumferential wall of the hole, and wherein scallops facing the scallops formed on the inner circumferential wall of the hole are formed on an outer circumferential wall of the attachment portion. ### Claim 2 (depends on 1) The speaker device according to claim 1, wherein both the hole and the attachment portion are cylindrical, the attachment portion is disposed concentrically with the hole, and the resonator is in a form of a cone tapered toward the vibrator and is disposed concentrically with the hole and the attachment portion. ### Claim 3 (depends on 2) The speaker device according to claim 2, wherein the second electrode layer is in a circular shape and is disposed concentrically with the hole, the attachment portion, and the resonator. ### Claim 4 (depends on 1) The speaker device according to claim 1, comprising: a plurality of the vibrators, wherein the hole is provided at a position corresponding to each of a plurality of the vibrators. ### Claim 5 (depends on 4) The speaker device according to claim 4, wherein the vibrators are arranged at intersections of lines forming a square grid on the substrate. ### Claim 6 (depends on 4) The speaker device according to claim 4, wherein one vibrator is disposed at a center of a circle and surrounding vibrators are equally spaced on a circumference of the circle. ### Claim 7 (depends on 4) The speaker device according to claim 4, wherein the vibrators are arranged so that three vibrators adjacent to one another are positioned at vertices of an equilateral triangle on the substrate. ### Claim 8 (depends on 7) The speaker device according to claim 7, wherein a projection and an indentation are provided on an outer edge of the substrate, which is to abut on an outer edge of another adjacent substrate, so as to be engaged with a projection and an indentation on the outer edge of the other substrate when a plurality of the substrates is tiled, and wherein the vibrator is provided on the projection of the outer edge so that three vibrators adjacent to one another across the substrates are positioned at vertices of a congruent equilateral triangle with the equilateral triangle. ### Claim 9 (depends on 4) The speaker device according to claim 4, wherein the speaker device is fastened to a fastening target through part of the piezoelectric element layer being exposed on one face of the substrate. ### Claim 10 (depends on 9) The speaker device according to claim 9, wherein the speaker device is fastened to the fastening target through a circular or rectangular portion disposed at an intersection of lines forming a two-dimensional grid that is formed to circumvent the second electrode layer. ### Claim 11 (depends on 9) The speaker device according to claim 9, wherein the speaker device is fastened to the fastening target through an entire portion that is formed to circumvent the second electrode layer. ### Claim 12 (depends on 9) The speaker device according to claim 9, wherein the speaker device is fastened to the fastening target through a portion in a form of a two-dimensional grid that is formed to circumvent the second electrode layer. ### Claim 13 (depends on 1) The speaker device according to claim 1, comprising: a first external terminal being an external terminal for the first electrode layer; a wiring pattern formed on the substrate so as to electrically connect the second electrode layers that are included in the vibrators arranged on one face of the substrate; and a second external terminal being an external terminal for the wiring pattern, wherein, when a plurality of the substrates is tiled, the first external terminal is provided at a position opposite to the first external terminal provided on another adjacent substrate, and wherein, when a plurality of the substrates is tiled, the second external terminal is provided at a position opposite to the second external terminal provided on another adjacent substrate. ### Claim 14 (depends on 1) A method for manufacturing a speaker device, the speaker device being a speaker device according to claim 1, the method comprising: depositing the first electrode layer having a uniform thickness on a base material layer having a uniform thickness in a silicon-on-insulator (SOI) substrate having a uniform thickness; depositing the piezoelectric element layer having a uniform thickness on the first electrode layer; depositing the second electrode layer having a uniform thickness on the piezoelectric element layer; forming an array of vibrators that each include the base material layer, the first electrode layer, the piezoelectric element layer, and the second electrode layer on one face of the substrate through etching; and flipping the substrate, forming (i) the hole, through which a sound wave generated by vibration of the piezoelectric layer to which a voltage signal is applied via the first electrode layer and the second electrode layer is outputted in a thickness direction of the substrate, and (ii) the attachment portion which is provided at a center of the hole and to which the resonator is attached that resonates with the vibration of the vibrator and makes the soundwave outputted in the thickness direction of the substrate closer to a plane parallel to the substrate, at a position corresponding to the vibrator through deep etching performed on another face of the substrate, and forming the scallops made of an indentation and a projection alternating in the thickness direction of the substrate on an inner circumferential wall of the hole and an outer circumferential wall of the attachment portion; and attaching the resonator to the attachment portion. ### Claim 15 (depends on 1) The speaker device according to claim 1 prepared by a process including the steps of: depositing the first electrode layer having a uniform thickness on a base material layer having a uniform thickness in a silicon-on-insulator (SOI) substrate having a uniform thickness; depositing the piezoelectric element layer having a uniform thickness on the first electrode layer; depositing the second electrode layer having a uniform thickness on the piezoelectric element layer; forming an array of vibrators that each include the base material layer, the first electrode layer, the piezoelectric element layer, and the second electrode layer on one face of the substrate through etching; and flipping the substrate, forming (i) the hole, through which a sound wave generated by vibration of the piezoelectric layer to which a voltage signal is applied via the first electrode layer and the second electrode layer is outputted in a thickness direction of the substrate, and (ii) the attachment portion which is provided at a center of the hole and to which the resonator is attached that resonates with the vibration of the vibrator and makes the soundwave outputted in the thickness direction of the substrate closer to a plane parallel to the substrate, at a position corresponding to the vibrator through deep etching performed on another face of the substrate, and forming the scallops made of an indentation and a projection alternating in the thickness direction of the substrate on an inner circumferential wall of the hole and an outer circumferential wall of the attachment portion; and attaching the resonator to the attachment portion.