# US 10,484,773 B2 · Speaker bearing array sound-conducting structure and headphone using same

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- Number: US 10,484,773 B2
- Document ID: US10484773B2
- Status: Granted
- Kind: B2
- Application number: 16/010,146
- Filed: 2018-06-15
- Published: 2018-12-20
- Granted: 2019-11-19
- Earliest claimed: 2017-06-16
- Assignees: Bamdas Technology Limited
- Applicants: Bamdas Technology Limited
- Inventors: Hang Tat Ma
- Web page: https://patentgrep.com/patent/US10484773B2

## CPC

- H04R 1/1008: {Earpieces of the supra-aural or circum-aural type}
- H04R 1/1075: {Mountings of transducers in earphones or headphones}
- H04R 1/403: {loud-speakers}
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)

## Abstract

Disclosed is a speaker bearing array sound-conducting structure, disposed in a headphone. The structure comprises: a plurality of speaker units provided in a front cavity of the headphone; a bearing disposed in the center of the plurality of speaker units, such that the plurality of speaker units are uniformly distributed around the bearing centered about the bearing on the same layer, so as to generate a middle channel that produces sound; a sound output opening disposed in the front cavity, so as to fix the plurality of speaker units, and to concentrate the sound in the bearing and then conduct the sound outward; and a baffle disposed behind the bearing, so as to control a conducting direction of the sound. Also disclosed is a headphone made from the speaker bearing array sound-conducting structure. Because the speaker bearing array sound-conducting structure of the present invention uses a special bearing array arrangement approach, the transmission channels of speaker units are created and controlled, so as to achieve the highest sound transmission efficiency and the best sound synchronization performance.

## Claims

### Claim 1

A speaker bearing array sound-conducting structure, disposed in a headphone, wherein the speaker bearing array sound-conducting structure comprises:
a plurality of speaker units, disposed in a front cavity of the headphone;
a bearing, disposed in a center of the plurality of speaker units, such that the plurality of speaker units are uniformly distributed around the bearing centered about the bearing on the same layer, so as to generate a middle channel that produces sound;
a sound output opening, disposed in the front cavity, so as to fix the plurality of speaker units, and to concentrate the sound in the bearing and then conduct the sound outward; and
a baffle, disposed behind the bearing, so as to control a conducting direction of the sound.

### Claim 2 (depends on 1)

The speaker bearing array sound-conducting structure according to claim 1, wherein the baffle is disposed in a total-enclosed type or semi-enclosed type.

### Claim 3 (depends on 1)

The speaker bearing array sound-conducting structure according to claim 1, wherein the plurality of speaker units are arranged quadrangularly or circularly.

### Claim 4 (depends on 3)

The speaker bearing array sound-conducting structure according to claim 3, wherein the number of the speaker units is four or eight.

### Claim 5 (depends on 1)

The speaker bearing array sound-conducting structure according to claim 1, wherein the speaker bearing array sound-conducting structure comprises a driver, disposed behind a back plate.

### Claim 6 (depends on 1)

A headphone, comprising a front cavity and a back cavity, wherein the headphone comprises the speaker bearing array sound-conducting structure according to claim 1, so as to obtain sound having a consistent sound effect.