# US 10,484,581 B2 · Image pickup apparatus for endoscope

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- Number: US 10,484,581 B2
- Document ID: US10484581B2
- Status: Granted
- Kind: B2
- Application number: 15/817,941
- Filed: 2017-11-20
- Published: 2018-03-15
- Granted: 2019-11-19
- Earliest claimed: 2015-06-22
- Assignees: Olympus Corporation
- Applicants: Olympus Corporation
- Inventors: Jumpei Yoneyama
- Web page: https://patentgrep.com/patent/US10484581B2

## CPC

- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- A61B 1/00045: {Display arrangement}
- A61B 1/0011: {Manufacturing of endoscope parts}
- A61B 1/044: {for absorption imaging}
- A61B 1/051: {Details of CCD assembly}
- G02B 23/2484: {Arrangements in relation to a camera or imaging device (processing or control of video signals generated by an endoscope H04N23/60, H04N23/70)}
- H04N 23/555: {for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes}
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An image pickup apparatus for an endoscope includes: an image pickup device including a row of external electrodes provided on an end portion of a light receiving surface; and a wiring board including end portion electrodes ultrasonically bonded to the external electrodes, in which a plurality of grooves are formed in a back face of the image pickup device, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during the ultrasonic bonding.

## Claims

### Claim 1

An image pickup apparatus for an endoscope, the image pickup apparatus comprising:
an image pickup device including a row of external electrodes provided on an end portion of an image sensor; and
a wiring board including end portion electrodes ultrasonically bonded to the external electrodes,
wherein a plurality of grooves are formed in a back face of the image pickup device, the back face opposing a surface on which the image sensor is disposed, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during ultrasonic bonding.

### Claim 2 (depends on 1)

The image pickup apparatus for an endoscope according to claim 1, wherein the vibration direction is a direction of the row of the external electrodes.

### Claim 3 (depends on 2)

The image pickup apparatus for an endoscope according to claim 2, wherein the plurality of grooves are saw marks resulting from grinding.

### Claim 4 (depends on 3)

The image pickup apparatus for an endoscope according to claim 3, wherein the plurality of grooves are inclined at an angle exceeding 45 degrees relative to the vibration direction.

### Claim 5 (depends on 4)

The image pickup apparatus for an endoscope according to claim 4, wherein a surface roughness Rz, in a direction orthogonal to the vibration direction, of the back surface of the image pickup sensor is no less than 0.5 μm and no more than 10 μm.

### Claim 6

An image pickup apparatus for an endoscope, the image pickup apparatus comprising:
an image pickup device including a row of external electrodes provided on an end portion of an image sensor, the image pickup device having a bottom area of no less than 0.25 mm2 and no more than 4 mm2; and
a wiring board including end portion electrodes ultrasonically bonded to the external electrodes,
wherein a saw mark is formed by grinding in a back face of the image pickup device, the back face opposing a surface on which the image sensor is disposed, the saw mark is inclined at an angle of no less than 80 degrees and no more than 100 degrees relative to a direction of the row of the external electrodes in the entire back face, and a surface roughness Rz, in a direction orthogonal to the direction of the row of the external electrodes, of the back face is no less than 0.5 μm and no more than 10 μm.

### Claim 7

A method for manufacturing an image pickup apparatus for an endoscope, the image pickup apparatus including an image pickup device including a row of external electrodes provided on an end portion of an image sensor, and a wiring board including end portion electrodes ultrasonically bonded to the respective external electrodes, the method comprising:
forming a plurality of image sensors on a first principal surface of a semiconductor substrate;
cutting the semiconductor substrate to produce a plurality of image pickup devices;
re-arranging the plurality of image pickup devices in a grinding machine in such a manner that a direction of saw marks to be formed is inclined relative to a short axis direction of the image pickup device;
grinding back faces of the plurality of image pickup devices, the back faces opposing the respective surfaces upon which the image sensors are disposed, to form saw marks inclined relative to a vibration direction of ultrasonic vibration during ultrasonic bonding; and
ultrasonically bonding the external electrodes of the image pickup devices, mounted on an anvil of an ultrasonic bonding apparatus, and the end portion electrodes of the wiring board to each other.

### Claim 8 (depends on 7)

The method for manufacturing an image pickup apparatus for an endoscope according to claim 7, wherein:
a plurality of grooves are formed in a surface of the anvil; and
a surface roughness of the surface of the anvil and a surface roughness of the back face of the image pickup device are same.