# US 10,483,745 B2 · Methods of making moisture-resistant downhole electrical feedthroughs

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- Number: US 10,483,745 B2
- Document ID: US10483745B2
- Status: Granted
- Kind: B2
- Application number: 16/373,825
- Filed: 2019-04-03
- Published: 2019-07-25
- Granted: 2019-11-19
- Earliest claimed: 2017-05-11
- Assignees: Pa&E, Hermetic Solutions Group, LLC
- Applicants: PA&E, Hermetic Solutions Group, LLC
- Inventors: Hua Xia; Nelson Settles; Tucker Havekost; Don Larson
- Web page: https://patentgrep.com/patent/US10483745B2

## CPC

- H02G 15/013: Sealing means for cable inlets (inlets for cables filled with, or surrounded by, gas or oil H02G15/32)
- H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES

## Abstract

A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

## Claims

### Claim 1

A method of forming a downhole electrical feedthrough package, the method comprising:
combining at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO to form a glass mixture;
heating the glass mixture to approximately 650 to 1400 degrees Celsius;
quenching the heated glass mixture in de-ionized water bath to form glass frits;
sintering the glass frits with hollow cylinder shape and fitted into a conduit of a metal shell to form an electrical feedthrough assembly;
firing the electrical feedthrough assembly at first temperature (T1) for a first time period to form a dielectric seal and to provide a first thermal energy to the dielectric seal;
heating the electrical feedthrough assembly at second temperature (T2) for a second time period to provide a second thermal energy to the dielectric seal;
cooling the dielectric seal of the electrical feedthrough assembly to ambient temperature for a third time period; and
integrating two isolators into the conduit so that the dielectric seal is in contact with at least one of the isolators.

### Claim 2 (depends on 1)

The method of claim 1, wherein B2O3 is between 0 mol % to 40 mol %.

### Claim 3 (depends on 1)

The method of claim 1, wherein MO is selected from the group consisting of ZnO, BaO, TiO2, Fe2O3, and their glass making pre-cursors.

### Claim 4 (depends on 1)

The method of claim 1, wherein MO is between 0 mol % to 35 mol %.

### Claim 5 (depends on 1)

The method of claim 1, wherein Bi2O3 is combined with B2O3 and MO to form the glass mixture, and wherein Bi2O3 is between 20 to 60 mol %.

### Claim 6 (depends on 4)

The method of claim 4, wherein a REO is combined with B2O3 and MO to form the glass mixture.

### Claim 7 (depends on 5)

The method of claim 5, wherein REO is selected from the group consisting of CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides.

### Claim 8 (depends on 5)

The method of claim 5, wherein REO is between 0 mol % to 15 mol %.

### Claim 9 (depends on 1)

The method of claim 1, wherein the first temperature (T1) is approximately 300 to 400 degrees Celsius and the first time period is approximately 30 to 45 minutes, and wherein the second temperature (T2) is approximately 480 to 650 degrees Celsius and the second time period is approximately from 20 to 45 minutes.

### Claim 10 (depends on 1)

The method of claim 1, wherein cooling the dielectric seal in the metal shell is cooled with a quenching process to produce a hydrophobic multi-phase (δ-phase and α-phase) mixed dielectric sealing material.

### Claim 11 (depends on 1)

The method of claim 1, wherein cooling the dielectric seal in the metal shell is heated approximately 480 to 550 degrees Celsius and cooled for approximately 5 to 12 hours to produce a high dielectric and hydrophobic α-phase dominated dielectric sealing material.