# US 10,483,667 B2 · Electronic device and radar device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,667 B2 - Document ID: US10483667B2 - Status: Granted - Kind: B2 - Application number: 15/091,258 - Filed: 2016-04-05 - Published: 2016-12-22 - Granted: 2019-11-19 - Earliest claimed: 2015-06-17 - Assignees: Wistron Neweb Corp. - Applicants: Wistron NeWeb Corp. - Inventors: Hsin-Lung Hsiao; Chien-Chung Tseng; Min-Jung Wu - Web page: https://patentgrep.com/patent/US10483667B2 ## CPC - H01R 12/712: {co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit (H01R12/72 takes precedence)} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 12/721: {cooperating directly with the edge of the rigid printed circuits} - H01R 12/73: connecting to other rigid printed circuits or like structures - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 2201/2036: Permanent spacer or stand-off in a printed circuit or printed circuit assembly - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device is provided, which includes a circuit board and a bridge-shaped circuit board structure. The circuit board includes a first circuit board edge, a second circuit board edge, a first coupling unit, and a second coupling portion. The first coupling unit is located on the first circuit board edge. The second coupling unit is located on the second circuit board edge. The bridge-shaped circuit board structure includes a first supporting portion, a second supporting portion, a planar portion, a third coupling unit and a fourth coupling portion. The first supporting portion is disposed on the first planar portion edge. The second supporting portion is disposed on the second planar portion edge. A receiving space is formed between the planar portion and the circuit board. ## Claims ### Claim 1 An electronic device, comprising: an RF transceiver; an antenna, coupled to the RF transceiver; an operational amplifier, coupled to the RF transceiver; a digital signal processor, coupled to the operational amplifier; a power converter; a circuit board, comprising a first circuit board edge, a second circuit board edge, a first coupling unit, and a second coupling portion, wherein the first circuit board edge is parallel to the second circuit board edge, the first coupling unit is located on the first circuit board edge, and the second coupling unit is located on the second circuit board edge, wherein the first coupling unit comprises a plurality of first contacts, and the second coupling unit comprises a plurality of second contacts; and a U-shaped circuit board structure, comprising a first supporting portion, a second supporting portion, a planar portion, a third coupling unit, and a fourth coupling portion, wherein the planar portion comprises a first planar portion edge and a second planar portion edge, the first planar portion edge is parallel to the second planar portion edge, the first supporting portion is disposed on the first planar portion edge, the second supporting portion is disposed on the second planar portion edge, the third coupling unit is disposed on the first supporting portion, the fourth coupling unit is disposed on the second supporting portion, the third coupling unit is electrically connected to the first coupling unit, the fourth coupling unit is electrically connected to the second coupling unit, the planar portion is parallel to the circuit board, and a receiving space is formed between the planar portion and the circuit board, wherein the power converter is disposed on the U-shaped circuit board structure, such that the U-shaped circuit board structure is interposed between the power converter and the digital signal processor; wherein the third coupling unit comprises a plurality of first leads, the fourth coupling unit comprises a plurality of second leads, the first leads extend on a first lateral surface of the first supporting portion to a first end surface of the first supporting portion to be connected to the first contacts, and the second leads extend on the second lateral surface of the second supporting portion to a second end surface of the second supporting portion to be connected to the second contacts, wherein the power converter is disposed on the U-shaped circuit board structure, and the antenna, the RF transceiver, the digital signal processor and the operational amplifier are disposed on the circuit board. ### Claim 2 (depends on 1) The electronic device as claimed in claim 1, wherein the first supporting portion, the second supporting portion and the planar portion jointly define a slot. ### Claim 3 (depends on 2) The electronic device as claimed in claim 2, wherein the U-shaped circuit board structure comprises a first substrate, a prepreg layer and a second substrate, wherein the slot passes through the second substrate and extends into the prepreg layer. ### Claim 4 (depends on 3) The electronic device as claimed in claim 3, wherein the U-shaped circuit board structure further comprises a first wiring layer and a second wiring layer, the first substrate comprises a first substrate surface and a second substrate surface, the first wiring layer is located on the first substrate surface, and the second wiring layer is located between the second substrate surface and the first substrate. ### Claim 5 (depends on 4) The electronic device as claimed in claim 4, wherein the second wiring layer is covered by the prepreg layer in the slot. ### Claim 6 (depends on 4) The electronic device as claimed in claim 4, wherein the first leads extend from the first wiring layer to the first end surface of the first supporting portion to be electrically connected to the first coupling unit, and the second leads extend from the first wiring layer to the second end surface of the second supporting portion to be electrically connected to the second coupling unit. ### Claim 7 A radar device, comprising: an RF transceiver; an antenna, coupled to the RF transceiver; an operational amplifier, coupled to the RF transceiver; a digital signal processor, coupled to the operational amplifier; a power converter; a circuit board, comprising a first circuit board edge, a second circuit board edge, a first coupling unit and a second coupling portion, wherein the first circuit board edge is parallel to the second circuit board edge, the first coupling unit is located on the first circuit board edge, and the second coupling unit is located on the second circuit board edge, wherein the first coupling unit comprises a plurality of first contacts, and the second coupling unit comprises a plurality of second contacts; and a U-shaped circuit board structure, comprising a first supporting portion, a second supporting portion, a planar portion, a third coupling unit and a fourth coupling portion, wherein the planar portion comprises a first planar portion edge and a second planar portion edge, the first supporting portion is disposed on the first planar portion edge, the second supporting portion is disposed on the second planar portion edge, the third coupling unit is disposed on the first supporting portion, the fourth coupling unit is disposed on the second supporting portion, the first supporting portion is disposed on the first coupling unit, the third coupling unit is electrically connected to the first coupling unit, the second supporting portion is disposed on the second coupling unit, the fourth coupling unit is electrically connected to the second coupling unit, the planar portion is parallel to the circuit board, and a receiving space is formed between the planar portion and the circuit board, wherein the power converter is disposed on the U-shaped circuit board structure, such that the U-shaped circuit board structure is interposed between the power converter and the digital signal processor; wherein the third coupling unit comprises a plurality of first leads, the fourth coupling unit comprises a plurality of second leads, the first leads extend on a first lateral surface of the first supporting portion to a first end surface of the first supporting portion to be connected to the first contacts, and the second leads extend on the second lateral surface of the second supporting portion to a second end surface of the second supporting portion to be connected to the second contacts, wherein the power converter is disposed on the U-shaped circuit board structure, and the antenna, the RF transceiver, the digital signal processor and the operational amplifier are disposed on the circuit board. ### Claim 8 (depends on 7) The radar device as claimed in claim 7, wherein the first supporting portion, the second supporting portion and the planar portion jointly define a slot. ### Claim 9 (depends on 8) The radar device as claimed in claim 8, wherein the U-shaped circuit board structure comprises a first substrate, a prepreg layer and a second substrate, wherein the slot passes through the second substrate and extends into the prepreg layer. ### Claim 10 (depends on 9) The radar device as claimed in claim 9, wherein the U-shaped circuit board structure further comprises a first wiring layer and a second wiring layer, the first substrate comprises a first substrate surface and a second substrate surface, the first wiring layer is located on the first substrate surface, the second wiring layer is located between the second substrate surface and the first substrate. ### Claim 11 (depends on 10) The radar device as claimed in claim 10, wherein the first leads extend from the first wiring layer to the first end surface of the first supporting portion to be electrically connected to the first coupling unit, and the second leads extend from the first wiring layer to the second end surface of the second supporting portion to be electrically connected to the second coupling unit. ### Claim 12 (depends on 1) The electronic device as claimed in claim 1, wherein the circuit board is a multi-layer board, with at least one layer being a high band low-loss material. ### Claim 13 (depends on 7) The electronic device as claimed in claim 7, wherein the circuit board is a multi-layer board, with at least one layer being a high-band low-loss material.