# US 10,483,635 B2 · Multi-frequency communications antenna and base station > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,635 B2 - Document ID: US10483635B2 - Status: Granted - Kind: B2 - Application number: 15/993,587 - Filed: 2018-05-30 - Published: 2018-12-06 - Granted: 2019-11-19 - Earliest claimed: 2015-12-03 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Yanmin Yu; Jian Song; Dingjiu Daojian; Peng Liu - Web page: https://patentgrep.com/patent/US10483635B2 ## CPC - H01Q 1/521: {reducing the coupling between adjacent antennas} - H01Q 19/108: {Combination of a dipole with a plane reflecting surface (H01Q19/106 takes precedence; strip line H01Q9/065)} - H01Q 1/246: {specially adapted for base stations} - H01Q 5/314: using frequency dependent circuits or components, e.g. trap circuits or capacitors - H01Q 5/328: between a radiating element and ground - H01Q 5/48: Combinations of two or more dipole type antennas - H01Q 15/14: Reflecting surfaces; Equivalent structures {(electromagnetic shields H01Q1/526)} - H01Q 21/0031: {Parallel-plate fed arrays; Lens-fed arrays (multibeam arrays H01Q25/008)} - H01Q 21/24: Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction {(circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001)} - H01Q 21/26: Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H01Q 21/293: {one unit or more being an array of identical aerial elements (adaptive arrays H01Q3/2605)} - H01Q 21/30: Combinations of separate antenna units operating in different wavebands and connected to a common feeder system - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Embodiments of the present invention provide a multi-frequency communications antenna and a base station. The multi-frequency communications antenna includes at least one low-frequency array, at least one high-frequency array, at least one circuit board disposed corresponding to the high-frequency array, and a reflection panel, where a filtering component configured to decouple filtering is disposed on the circuit board, a first end of the filtering component is electrically connected to the high-frequency array, and a second end of the filtering component is electrically connected to a signal ground layer of the circuit board. The filtering component configured to decouple filtering that is shown in this embodiment is disposed on the circuit board, which causes a small damage to an array radiation environment. ## Claims ### Claim 1 A multi-frequency communications antenna, comprising: at least one low-frequency array; at least one high-frequency array; at least one circuit board disposed corresponding to the high-frequency array, wherein the circuit board is configured to feed power to the high-frequency array; a reflection panel to fasten the low-frequency array and the high-frequency array, wherein a side surface of the circuit board opposite to the reflection panel includes a signal ground layer, and the signal ground layer of the circuit board is coupled to the reflection panel; and a filtering component to decouple filtering is disposed on the circuit board, wherein a first end of the filtering component is electrically connected to the high-frequency array, and a second end of the filtering component is electrically connected to the signal ground layer of the circuit board. ### Claim 2 (depends on 1) The antenna according to claim 1, wherein the high-frequency array comprises a radiating element and a power feeding balun, wherein a first end of the power feeding balun is electrically connected to the radiating element, a second end of the power feeding balun is electrically connected to the signal ground layer of the circuit board, and the second end of the power feeding balun is further electrically connected to the first end of the filtering component. ### Claim 3 (depends on 2) The antenna according to claim 2, wherein at least one first ground point and at least one second ground point are disposed at the second end of the power feeding balun; and the first ground point and the second ground point are disposed passing through the circuit board, and the first ground point and the second ground point are soldered to the side surface of the circuit board opposite to the reflection panel, wherein the first ground point is electrically connected to the signal ground layer of the circuit board and the second ground point is electrically connected to the first end of the filtering component. ### Claim 4 (depends on 3) The antenna according to claim 3, wherein the filtering component comprises a first sub-component disposed on a signal line layer of the circuit board, and a second sub-component disposed on the signal ground layer of the circuit board, wherein the first sub-component is electrically connected to the signal ground layer of the circuit board, and the second sub-component is electrically connected to the radiating element. ### Claim 5 (depends on 4) The antenna according to claim 4, wherein a first metalized through hole and a second metalized through hole are disposed passing through the circuit board, and a distance between the first metalized through hole and the power feeding balun is less than a distance between the second metalized through hole and the power feeding balun; and a first end of the second sub-component is electrically connected to the second ground point of the power feeding balun, a second end of the second sub-component is electrically connected to a first end of the first sub-component using the first metalized through hole, and a second end of the first sub-component is electrically connected to the signal ground layer using the second metalized through hole. ### Claim 6 (depends on 4) The antenna according to claim 4, wherein a structure of the first sub-component comprises any one of the following: an equal-width strip, an unequal-width strip, an interdigital-coupling line, a ground coupling line, a compact microstrip resonant cell, or a mushroom-shaped grounding coupled diaphragm. ### Claim 7 (depends on 1) The antenna according to claim 1, wherein the signal ground layer of the circuit board comprises at least one metal layer. ### Claim 8 (depends on 7) The antenna according to claim 7, wherein the signal ground layer of the circuit board comprises a first metal layer and a second metal layer that are mutually insulated; and the high-frequency array is electrically connected to the first metal layer, and the second end of the filtering component is electrically connected to the second metal layer. ### Claim 9 (depends on 1) The antenna according to claim 1, wherein a ratio of a center frequency of the high-frequency array to a center frequency of the low-frequency array is greater than or equal to 1.5 and less than or equal to 4. ### Claim 10 Abase station, comprising: a multi-frequency communications antenna, wherein the multi-frequency communications antenna comprises at least one low-frequency array, at least one high-frequency array, at least one circuit board disposed corresponding to the high-frequency array, wherein the circuit board is configured to feed power to the high-frequency array, a reflection panel to fasten the low-frequency array and the high-frequency array, wherein a side surface of the circuit board opposite to the reflection panel includes a signal ground layer, and the signal ground layer of the circuit board is coupled to the reflection panel; and a filtering component to decouple filtering is disposed on the circuit board, wherein a first end of the filtering component is electrically connected to the high-frequency array, and a second end of the filtering component is electrically connected to the signal ground layer of the circuit board. ### Claim 11 (depends on 10) The base station according to claim 10, wherein the high-frequency array comprises a radiating element and a power feeding balun, wherein a first end of the power feeding balun is electrically connected to the radiating element, a second end of the power feeding balun is electrically connected to the signal ground layer of the circuit board, and the second end of the power feeding balun is further electrically connected to the first end of the filtering component. ### Claim 12 (depends on 11) The base station according to claim 11, wherein at least one first ground point and at least one second ground point are disposed at the second end of the power feeding balun; and the first ground point and the second ground point are disposed passing through the circuit board, and the first ground point and the second ground point are soldered to the side surface of the circuit board opposite to the reflection panel, wherein the first ground point is electrically connected to the signal ground layer of the circuit board, and the second ground point is electrically connected to the first end of the filtering component. ### Claim 13 (depends on 12) The base station according to claim 12, wherein the filtering component comprises a first sub-component disposed on a signal line layer of the circuit board, and a second sub-component disposed on the signal ground layer of the circuit board, wherein the first sub-component is electrically connected to the signal ground layer of the circuit board, and the second sub-component is electrically connected to the radiating element. ### Claim 14 (depends on 13) The base station according to claim 13, wherein a first metalized through hole and a second metalized through hole are disposed passing through the circuit board, and a distance between the first metalized through hole and the power feeding balun is less than a distance between the second metalized through hole and the power feeding balun; and a first end of the second sub-component is electrically connected to the second ground point of the power feeding balun, a second end of the second sub-component is electrically connected to a first end of the first sub-component using the first metalized through hole, and a second end of the first sub-component is electrically connected to the signal ground layer using the second metalized through hole. ### Claim 15 (depends on 13) The base station according to claim 13, wherein a structure of the first sub-component comprises any one of the following: an equal-width strip, an unequal-width strip, an interdigital-coupling line, a ground coupling line, a compact microstrip resonant cell, or a mushroom-shaped grounding coupled diaphragm. ### Claim 16 (depends on 10) The base station according to claim 10, wherein the signal ground layer of the circuit board comprises at least one metal layer. ### Claim 17 (depends on 16) The base station according to claim 16, wherein the signal ground layer of the circuit board comprises a first metal layer and a second metal layer that are mutually insulated; and wherein the high-frequency array is electrically connected to the first metal layer, and the second end of the filtering component is electrically connected to the second metal layer. ### Claim 18 (depends on 10) The multi-frequency communications antenna according to claim 10, wherein a ratio of a center frequency of the high-frequency array to a center frequency of the low-frequency array is greater than or equal to 1.5 and less than or equal to 4.