# US 10,483,632 B2 · Device for transmitting and/or receiving radiofrequency signals > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,632 B2 - Document ID: US10483632B2 - Status: Granted - Kind: B2 - Application number: 14/910,171 - Filed: 2014-07-31 - Published: 2016-06-16 - Granted: 2019-11-19 - Earliest claimed: 2013-08-05 - Assignees: Insight Sip - Applicants: Insight Sip - Inventors: Chakib El Hassani; Christopher Barratt - Web page: https://patentgrep.com/patent/US10483632B2 ## CPC - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/243: {with built-in antennas} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Apparatus for transmitting and/or receiving radiofrequency signals comprising at least a broadband antenna (310) and a substrate (410); the antenna (310) comprising at least a first radiating surface (318) and being superimposed on the ground plane, the ground plane being located on a first face of the substrate (410), at least a side tongue of power supply (314) and at least a side wall (316) connected to at least the first radiating surface (318), the apparatus being characterized in that the side wall (316) is connected to a coupling trace (416) located on a second face of the substrate (410), opposite to the first face of the substrate (410), and the side wall (316) and the coupling trace (416) being configured to act as a capacitive coupling between at least the first radiating surface (318) and the ground plane. ## Claims ### Claim 1 An apparatus for transmitting and/or receiving radiofrequency signals comprising at least a broadband antenna and a substrate; the antenna comprising at least a first radiating surface and being superimposed on the ground plane, the ground plane being located on a first face of the substrate, at least a side tongue of a power supply and at least a side wall connected to at least the first radiating surface, wherein: the antenna comprises at least a second radiating surface excitable by coupling with the first radiating surface, the side wall is connected to a coupling trace located on a second face of the substrate, the second face opposite to the first face of the substrate, and the side wall and the coupling trace being configured to act as a capacitive coupling between at least the first radiating surface, the second radiating surface and the ground plane, and wherein the coupling trace is configured to form a coupling capacitor whose value is εS/e where ε is the dielectric constant of the dielectric material constituting the substrate. S is the surface of the coupling trace and e is the thickness between the coupling trace located on the second face of the substrate and the ground plane located on the first face of the substrate, and wherein the first face of the substrate is a lower surface of the substrate and the second surface of the substrate is a surface of the substrate above the first face. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the antenna is configured to generate at least a first resonance along a length dimension of the first radiating surface and at least a second resonance along a width dimension of the first radiating surface. ### Claim 3 (depends on 1) The apparatus according to claim 1, wherein the side wall comprises at least a first portion in a plan parallel to the thickness of the substrate and along a width dimension of the first radiating surface. ### Claim 4 (depends on 1) The apparatus according to claim 1, wherein the side wall comprises at least a second portion in a plane parallel to the thickness of the substrate and along a length dimension of the first radiating surface. ### Claim 5 (depends on 3) The apparatus according to claim 3, wherein the first portion and the second portion of the side wall are configured to be in electrical contact and are fixed onto the coupling trace. ### Claim 6 (depends on 1) The apparatus according to claim 1, wherein the antenna is configured to generate a third resonance along a length dimension of the second radiating surface. ### Claim 7 (depends on 6) The apparatus according to claim 6, wherein the first radiating surface has a length dimension larger than the length dimension of the second radiating surface. ### Claim 8 (depends on 1) The apparatus according to claim 1, wherein the first radiating surface and the second radiating surface are of rectangular or polygonal shape. ### Claim 9 (depends on 1) The apparatus according to claim 1, wherein at least the first radiating surface forms an L with a first side of the L extending along the length dimension of the first radiating surface and a second side of the L extending along the width dimension of the first radiating surface. ### Claim 10 (depends on 1) The apparatus according to claim 1, wherein the second radiating surface is a homothety of the first radiating surface of smaller dimension. ### Claim 11 (depends on 1) The apparatus according to claim 1, wherein the side tongue of power supply is configured to be in contact with a power supply trace located on the second face of the substrate. ### Claim 12 (depends on 11) The apparatus according to claim 11, wherein the antenna forms a cavity for accommodating at least a chip between at least the first radiating surface and the second face of the substrate. ### Claim 13 (depends on 12) The apparatus according to claim 12, wherein the power supply trace is connected to a connection of the chip. ### Claim 14 (depends on 1) The apparatus of claim 1, wherein the antenna comprises a folded metal plate. ### Claim 15 (depends on 1) The apparatus of claim 1, further comprising an overmolding configured to coat at least the antenna. ### Claim 16 (depends on 15) The apparatus of claim 15, comprising at least one chip located on the second face of the substrate, wherein said at least on chip is overmolded. ### Claim 17 (depends on 1) The apparatus of claim 1, wherein the first face of the substrate is a first surface of the substrate and the second face of the substrate is a second surface of the substrate. ### Claim 18 An apparatus for transmitting and/or receiving radiofrequency signals comprising at least a broadband antenna and a substrate; the antenna comprising at least a first radiating surface and being superimposed on the ground plane, the ground plane being located on a first face of the substrate, at least a side tongue of a power supply and at least a side wall connected to at least the first radiating surface, wherein: the antenna comprises at least a second radiating surface excitable by coupling with the first radiating surface, the side wall is connected to a coupling trace located on a second face of the substrate, the second face opposite to the first face of the substrate, and the side wall and the coupling trace being configured to act as a capacitive coupling between at least the first radiating surface, the second radiating surface and the ground plane, and wherein the coupling trace is configured to form a coupling capacitor whose value is εS/e where ε is the dielectric constant of the dielectric material constituting the substrate. S is the surface of the coupling trace and e is the thickness between the coupling trace located on the second face of the substrate and the ground plane located on the first face of the substrate, wherein the second face of the substrate is a top surface of the substrate and the first surface of the substrate is a surface of the substrate below the second face.