# US 10,483,618 B2 · Semiconductor package and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,618 B2 - Document ID: US10483618B2 - Status: Granted - Kind: B2 - Application number: 15/997,748 - Filed: 2018-06-05 - Published: 2019-05-02 - Granted: 2019-11-19 - Earliest claimed: 2017-11-02 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Seung Wook Park; Tah Joon Park; Jae Hyun Jung; Hwa Sun Lee; Seong Hun Na - Web page: https://patentgrep.com/patent/US10483618B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - H01Q 1/44: using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)} - H01Q 21/0075: {Stripline fed arrays (H01Q21/065 takes precedence)} - H01Q 21/0087: {Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00)} - H01Q 21/065: {Patch antenna array} - H10P 72/74: {using temporarily an auxiliary support} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H01Q 1/40: Radiating elements coated with or embedded in protective material - H01Q 21/30: Combinations of separate antenna units operating in different wavebands and connected to a common feeder system - H10P 72/7424: {used as a support during the manufacture of self-supporting substrates} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10W 44/248: {for antennas} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 72/0198: {batch processes} - H10W 74/014: {using batch processing} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space. ## Claims ### Claim 1 A semiconductor package comprising: a lower package comprising one or more electronic devices; and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package; a radiating portion comprising one or more radiators disposed to be spaced apart from the ground portion; and a support portion separating the radiating portion and the ground portion, wherein at least a portion between the radiating portion and the ground portion is empty space. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the support portion comprises: a first support portion supporting a feed line for the radiating portion; and a second support portion supporting a radiator of the radiating portion. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the lower package includes a substrate and a sealing portion sealing the electronic device mounted on the substrate, and the antenna unit is disposed on the sealing portion. ### Claim 4 (depends on 3) The semiconductor package of claim 3, further comprising: a connection portion disposed on a side surface of the sealing portion and electrically connecting the antenna unit and the substrate. ### Claim 5 (depends on 4) The semiconductor package of claim 4, wherein the connection portion comprises: a first connection portion connecting the ground portion and a ground pad of the substrate; and a second connection portion connecting the radiating portion and a signal pad of the substrate. ### Claim 6 (depends on 5) The semiconductor package of claim 5, wherein the signal pad and the ground pad are exposed outside of the sealing portion. ### Claim 7 (depends on 3) The semiconductor package of claim 3, further comprising: a connecting conductor electrically connecting the antenna unit and the substrate through the sealing portion. ### Claim 8 (depends on 1) The semiconductor package of claim 1, wherein the lower package includes a core substrate accommodating the electronic device and rewiring layers disposed on opposing surfaces of the core substrate, and the ground portion is disposed on the rewiring layer disposed on an upper surface of the core substrate. ### Claim 9 (depends on 8) The semiconductor package of claim 8, further comprising: a connecting conductor electrically connecting the radiating portion and the lower package through the support portion. ### Claim 10 (depends on 1) The semiconductor package of claim 1, wherein the radiating portion comprises: a metal layer disposed on the support portion; and a plating layer disposed on the metal layer. ### Claim 11 (depends on 1) The semiconductor package of claim 1, further comprising: an insulating plate comprising the radiating portion coupled to a lower surface of the insulating plate. ### Claim 12 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package transmits and receives radio signals in an ultra high frequency band. ### Claim 13 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor package transmits and receives radio signals in a millimeter wavelength band. ### Claim 14 A semiconductor package comprising: a lower package comprising one or more electronic devices disposed on a substrate and a sealing portion sealing the electronic device; and an antenna unit disposed on an upper surface of the sealing portion, wherein the antenna unit comprises: a ground portion disposed on an upper surface of the lower package; a radiating portion disposed spaced apart from the ground portion; and a connection portion disposed on a side surface of the sealing portion and electrically connecting the antenna unit and the substrate.