# US 10,483,617 B2 · Package structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,617 B2 - Document ID: US10483617B2 - Status: Granted - Kind: B2 - Application number: 15/879,456 - Filed: 2018-01-25 - Published: 2019-04-04 - Granted: 2019-11-19 - Earliest claimed: 2017-09-29 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Nan-Chin Chuang; Chen-Hua Yu; Chung-Shi Liu; Chao-Wen Shih; Shou-Zen Chang - Web page: https://patentgrep.com/patent/US10483617B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/22: by structural association with other equipment or articles - H01Q 1/52: Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure (absorbing means H01Q17/00) - H01Q 1/526: {Electromagnetic shields} - H01Q 19/30: the primary active element being centre-fed and substantially straight, e.g. Yagi antenna - H01Q 21/0087: {Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00)} - H01Q 21/24: Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction {(circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/267: {Patterned shielding planes} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 74/111: {the semiconductor body being completely enclosed} - H01Q 15/14: Reflecting surfaces; Equivalent structures {(electromagnetic shields H01Q1/526)} - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H10W 44/209: {Vertical interconnections, e.g. vias} - H10W 44/248: {for antennas} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/655: Fan-out layouts - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/242: {relative to the surface, e.g. recessed, protruding} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/853: {On the same surface} - H10W 72/874: {On different surfaces} - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/9413: {on encapsulations} - H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/983: {Reinforcing structures, e.g. collars} - H10W 74/117: {the substrate having spherical bumps for external connection} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation. ## Claims ### Claim 1 A package structure, comprising: an insulating encapsulation comprising a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion; at least one semiconductor die encapsulated in the first portion of the insulating encapsulation, wherein the second portion and the third portion are sequentially stacked on the at least one semiconductor die; at least one first antenna electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation; and at least one second antenna electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation. ### Claim 2 (depends on 1) The package structure of claim 1, wherein the at least one first antenna generates an electromagnetic wave propagating along a first direction, and the at least one first antenna comprises a first reflector, a pair of first drivers and at least one first director, wherein the first reflector, the pair of the first drivers and the at least one first director are sequentially arranged along the first direction, and the pair of the first drivers is located between the first reflector and the at least one first director, and wherein the at least one second antenna generates an electromagnetic wave propagating along a second direction, and the at least one second antenna comprises a second reflector, a pair of second drivers and at least one second director, wherein the second reflector, the pair of the second drivers and the at least one second director are sequentially arranged along the second direction, and the pair of the second drivers is located between the second reflector and the at least one second director, and wherein the first direction is different from the second direction. ### Claim 3 (depends on 2) The package structure of claim 2, further comprising: a first isolation layer connecting to the at least one second antenna, wherein the first isolation layer is located between the first portion of the insulating encapsulation and the second portion of the insulating encapsulation; and a second isolation layer connecting to the at least one first antenna, wherein the second isolation layer is located between the second portion of the insulating encapsulation and the third portion of the insulating encapsulation. ### Claim 4 (depends on 3) The package structure of claim 3, further comprising: a redistribution structure electrically connected to the at least one semiconductor die; and through interlayer vias electrically connected to the redistribution structure, wherein the through interlayer vias comprise at least one first through interlayer via encapsulated in the first portion of the insulating encapsulation and at least one second through interlayer via encapsulated in the second portion of the insulating encapsulation, wherein two opposite ends of the at least one first through interlayer via are respectively connected to the first isolation layer and the redistribution structure, and two opposite ends of the at least one second through interlayer via are respectively connected to the first isolation layer and the second isolation layer. ### Claim 5 (depends on 1) The package structure of claim 1, wherein the at least one first antenna comprises: at least one first antenna component generating an electromagnetic wave propagating along a first direction, wherein the at least one first antenna component comprises a first reflector, a pair of first drivers and at least one first director, wherein the first reflector, the pair of the first drivers and the at least one first director are sequentially arranged along the first direction, and the pair of the first drivers is located between the first reflector and the at least one first director; and at least one second antenna component generating an electromagnetic wave propagating along a second direction, wherein the at least one second antenna component comprises a second reflector, a pair of second drivers, at least one second director, wherein the second reflector, the pair of the second drivers and the at least one second director are sequentially arranged along the second direction, and the pair of the second drivers is located between the second reflector and the at least one second director, wherein the at least one second antenna comprises: at least one third antenna component generating an electromagnetic wave propagating along a third direction, wherein the at least one third antenna component comprises a third reflector, a pair of third drivers, and at least one third director, wherein the third reflector, the pair of the third drivers and the at least one third director are sequentially arranged along the third direction, and the pair of the third drivers is located between the third reflector and the at least one third director; at least one fourth antenna component generating an electromagnetic wave propagating along a fourth direction, wherein the at least one fourth antenna component comprises a fourth reflector, a pair of fourth drivers, and at least one fourth director, wherein the fourth reflector, the pair of the fourth drivers and the at least one fourth director are sequentially arranged along the fourth direction, and the pair of the fourth drivers is located between the fourth reflector and the at least one fourth director; and at least one fifth antenna component generating an electromagnetic wave propagating along a fifth direction, wherein the at least one fifth antenna component comprises a fifth reflector, a pair of fifth drivers, and at least one fifth director, wherein the fifth reflector, the pair of the fifth drivers and the at least one fifth director are sequentially arranged along the fifth direction, and the pair of the fifth drivers is located between the fifth reflector and the at least one fifth director, wherein the first direction, the second direction, the third direction, the fourth direction and the fifth direction are different from one another. ### Claim 6 (depends on 5) The package structure of claim 5, wherein the first direction is substantially perpendicular to the second direction, and the fifth direction is substantially perpendicular to the third direction and fourth direction. ### Claim 7 (depends on 5) The package structure of claim 5, further comprising: a first isolation layer connecting to the at least one third antenna component, the at least one fourth antenna component and the at least one fifth antenna component, wherein the first isolation layer is located between the first portion of the insulating encapsulation and the second portion of the insulating encapsulation; and a second isolation layer connecting to the at least one first antenna component and the at least one second antenna component, wherein the second isolation layer is located between the second portion of the insulating encapsulation and the third portion of the insulating encapsulation. ### Claim 8 (depends on 7) The package structure of claim 7, further comprising: a redistribution structure electrically connected to the at least one semiconductor die; and through interlayer vias electrically connected to the redistribution structure, wherein the through interlayer vias comprises at least one first through interlayer via encapsulated in the first portion of the insulating encapsulation and at least one second through interlayer via encapsulated in the second portion of the insulating encapsulation, wherein two ends of the at least one first through interlayer via are respectively connected to the first isolation layer and the redistribution structure, and two ends of the at least one second through interlayer via are respectively connected to the first isolation layer and the second isolation layer. ### Claim 9 A package structure, comprising: an insulating encapsulation comprising a first portion and a second portion stacked on the first portion; at least one semiconductor die encapsulated in the first portion of the insulating encapsulation; first antennas electrically connected to the at least one semiconductor die, wherein a portion of each of the first antennas is encapsulated in the first portion of the insulating encapsulation, and another portion of each of the first antennas is encapsulated in the second portion of the insulating encapsulation; and second antennas electrically connected to the at least one semiconductor die, wherein a portion of each of the second antennas is encapsulated in the first portion of the insulating encapsulation, and another portion of each of the second antennas is encapsulated in the second portion of the insulating encapsulation. ### Claim 10 (depends on 9) The package structure of claim 9, wherein each of the first antennas comprises a first reflector, a pair of first drivers and at least one first director, the portion of the first antennas generates an electromagnetic wave propagating along a first direction, and the another portion of the first antennas generates an electromagnetic wave propagating along an opposite direction of the first direction, wherein for each of the portion of the first antennas, the first reflector, the pair of the first drivers and the at least one first director are sequentially arranged along the first direction, and the pair of the first drivers is located between the first reflector and the at least one first director, and wherein for each of the another portion of the first antennas, the first reflector, the pair of the first drivers and the at least one first director are sequentially arranged along the opposite direction of the first direction, and the pair of the first drivers is located between the first reflector and the at least one first director, and wherein each of the second antennas comprise a second reflector, a pair of second drivers and at least one second director, the portion of the second antennas generate an electromagnetic wave propagating along a second direction, and another portion of the second antennas generate an electromagnetic wave propagating along an opposite direction of the second direction, wherein for each of the portion of the second antennas, the second reflector, the pair of the second drivers and the at least one second director are sequentially arranged along the second direction, and the pair of the second drivers is located between the second reflector and the at least one second director, and wherein for each of the another portion of the second antennas, the second reflector, the pair of the second drivers and the at least one second director are sequentially arranged along the opposite direction of the second direction, and the pair of the second drivers is located between the second reflector and the at least one second director, and wherein the first direction is different from the second direction. ### Claim 11 (depends on 9) The package structure of claim 9, further comprising: an isolation layer connecting to the another portion of the first antennas and the another portion of the second antennas, wherein the isolation layer is located between the first portion of the insulating encapsulation and the second portion of the insulating encapsulation. ### Claim 12 (depends on 11) The package structure of claim 11, further comprising: a redistribution structure electrically connected to the at least one semiconductor die; and at least one through interlayer via electrically connected to the redistribution structure, wherein the at least one through interlayer via is encapsulated in the first portion of the insulating encapsulation, and two ends of the at least one through interlayer via are respectively connected to the isolation layer and the redistribution structure. ### Claim 13 (depends on 9) The package structure of claim 9, further comprising: a first through interlayer via wall encapsulated in the first portion of the insulating encapsulation, wherein the first through interlayer via wall is electrically connected to one of the first antennas through the first reflector and electrically connected to one of the second antennas through the second reflector; and a second through interlayer via wall encapsulated in the second portion of the insulating encapsulation, wherein the second through interlayer via wall is electrically connected to one of the first antennas through the first reflector and electrically connected to one of the second antennas through the second reflector. ### Claim 14 A package structure, comprising: an insulating encapsulation; a first redistribution structure located on the insulating encapsulation; at least one semiconductor die encapsulated in the insulating encapsulation and electrically connected to the first redistribution structure; first antennas electrically connected to the at least one semiconductor die, wherein a first group of the first antennas is encapsulated in the insulating encapsulation and a second group of the first antennas is located in the first redistribution structure; and second antennas electrically connected to the at least one semiconductor die, wherein a first group of the second antennas is encapsulated in the insulating encapsulation and a second group of the second antennas is located in the first redistribution structure. ### Claim 15 (depends on 14) The package structure of claim 14, wherein the first antennas generate an electromagnetic wave propagating along a first direction, and each of the first antennas comprises a first reflector, a pair of first drivers, and at least one first director, wherein the first reflector, the pair of the first drivers, and the at least one first director are sequentially arranged along the first direction, and the pair of the first drivers is located between the first reflector and the at least one first director, and wherein the second antennas generate an electromagnetic wave propagating along a second direction, and each of the second antennas comprises a second reflector, a pair of second drivers, and at least one second director, wherein the second reflector, the pair of the second drivers, and the at least one second director are sequentially arranged along the second direction, and the pair of the second drivers is located between the second reflector and the at least one second director, and wherein the first direction is different from the second direction. ### Claim 16 (depends on 14) The package structure of claim 14, wherein the first redistribution structure further comprises an isolation layer, wherein the isolation layer is connected to the second group of the first antennas through the first reflector and connected to the second group of the second antennas through the second reflector. ### Claim 17 (depends on 16) The package structure of claim 16, further comprising: a second redistribution structure electrically connected to the at least one semiconductor die, wherein the insulating encapsulation is located between the first redistribution structure and the second redistribution structure; and at least one through interlayer via encapsulated in the insulating encapsulation, wherein two ends of the at least one through interlayer via are respectively connected to the isolation layer of the first redistribution structure and the second redistribution structure. ### Claim 18 (depends on 14) The package structure of claim 14, wherein the first group of the first antennas and the first group of the second antennas are vertical polarized antennas, and the second group of the first antennas and the second group of the second antennas are horizontal polarized antennas. ### Claim 19 (depends on 14) The package structure of claim 14, further comprising third antennas above the first redistribution structure, wherein the third antennas are electrically coupled to the isolation layer of the first redistribution structure and arranged in a form of an array, and the first redistribution structure is located between the third antennas and the insulating encapsulation. ### Claim 20 (depends on 19) The package structure of claim 19, further comprising a dielectric layer between the third antennas and the first redistribution structure, and the first redistribution structure is located between the dielectric layer and the insulating encapsulation.