# US 10,483,493 B2 · Electronic device having display with thin-film encapsulation

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- Number: US 10,483,493 B2
- Document ID: US10483493B2
- Status: Granted
- Kind: B2
- Application number: 15/864,983
- Filed: 2018-01-08
- Published: 2019-02-07
- Granted: 2019-11-19
- Earliest claimed: 2017-08-01
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Daniel B. Sargent; John Raff; Li Zhang; Victor H. Yin; Wenyong Zhu
- Web page: https://patentgrep.com/patent/US10483493B2

## CPC

- H10D 1/692: {Electrodes}
- G06F 1/1601: {Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays (constructional details related to flat displays integrated in a portable computer, e.g. laptop, handheld computer G06F1/1637; constructional details related to television receivers H04N5/64)}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/1637: {Details related to the display arrangement, including those related to the mounting of the display in the housing}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- H04N 1/00519: {Constructional details not otherwise provided for, e.g. housings, covers}
- H10K 59/123: Connection of the pixel electrodes to the thin film transistors [TFT]
- H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers}
- H10K 77/111: {Flexible substrates}
- H10W 74/43: comprising oxides, nitrides or carbides, e.g. ceramics or glasses
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H10K 59/40: OLEDs integrated with touch screens
- Y02E 10/549: Organic PV cells
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.

## Claims

### Claim 1

Apparatus, comprising:
a glass substrate;
a thin-film encapsulation layer;
a layer of thin-film transistor circuitry including transistors and organic light-emitting diodes that is configured to form a pixel array that displays images, wherein the layer of thin-film transistor circuitry has a first surface that contacts the thin-film encapsulation layer and an opposing second surface that contacts the glass substrate;
a light-blocking layer, wherein the glass substrate layer has a first surface that is contacted by the thin-film transistor circuitry and has a second surface that is contacted by the light-blocking layer; and
a heat spreading layer, wherein the light-blocking layer is interposed between the heat spreading layer and the glass substrate.

### Claim 2 (depends on 1)

The apparatus defined in claim 1 wherein the glass substrate has a thickness of less than 0.3 mm and wherein the apparatus further comprises:
a flexible printed circuit coupled to an edge of the layer of thin-film transistor circuitry; and
a display driver integrated circuit mounted on the flexible printed circuit.

### Claim 3 (depends on 1)

The apparatus defined in claim 1 wherein the glass substrate has a thickness of less than 0.25 mm.

### Claim 4 (depends on 1)

The apparatus defined in claim 1 further comprising:
a two-dimensional touch sensor layer; and
a circular polarizer interposed between the two-dimensional touch sensor layer and the thin-film encapsulation layer.

### Claim 5 (depends on 4)

The apparatus defined in claim 4 further comprising a birefringent compensation layer between the circular polarizer and the thin-film encapsulation layer.

### Claim 6 (depends on 5)

The apparatus defined in claim 5 further comprising a layer of adhesive that attaches the birefringent compensation layer to the circular polarizer.

### Claim 7 (depends on 4)

The apparatus defined in claim 4 further comprising:
a transparent display cover layer, wherein the two-dimensional touch sensor layer is interposed between the transparent display cover layer and the circular polarizer.

### Claim 8 (depends on 1)

The apparatus defined in claim 1 wherein the light-blocking layer comprises a black polymer layer.

### Claim 9 (depends on 8)

The apparatus defined in claim 8 further comprising a layer of graphite on the black polymer layer.

### Claim 10

An electronic device, comprising:
an organic light-emitting diode display having:
a glass substrate that forms an inner encapsulation layer;
a thin-film encapsulation layer that forms an outer encapsulation layer;
a layer of thin-film transistor circuitry interposed between the inner and outer encapsulation layers, wherein the layer of thin-film transistor circuitry includes transistors and organic light-emitting diodes and is configured to form a pixel array that displays images;
a quarter wave plate; and
a birefringent compensation film interposed between the quarter wave plate and the thin-film encapsulation layer;
a housing in which the organic light-emitting diode display is mounted;
display driver circuitry in the housing; and
a flexible path that couples the display driver circuitry to the organic light-emitting diode display.

### Claim 11 (depends on 10)

The electronic device defined in claim 10 wherein the flexible path comprises a flexible printed circuit coupled to traces in the thin-film encapsulation layer.

### Claim 12 (depends on 11)

The electronic device defined in claim 11 wherein the flexible printed circuit is bent and wherein the display driver circuitry comprises an integrated circuit mounted to the flexible printed circuit.

### Claim 13 (depends on 10)

The electronic device defined in claim 10 wherein the glass substrate has a thickness of less than 0.25 mm.

### Claim 14 (depends on 10)

The electronic device defined in claim 10 further comprising:
a display cover layer;
a first layer of adhesive that is attached to the display cover layer;
a touch sensor layer in contact with the first layer of adhesive;
a second layer of adhesive that is in contact with the touch sensor; and
a linear polarizer that is in contact with the second layer of adhesive.

### Claim 15 (depends on 10)

The electronic device defined in claim 10 wherein the thin-film encapsulation layer includes at least one inorganic layer.

### Claim 16 (depends on 15)

The electronic device defined in claim 15 wherein the thin-film encapsulation layer includes a plurality of inorganic layers.

### Claim 17

An electronic device having opposing front and rear faces, comprising:
a housing having a rear wall on the rear face;
an organic light-emitting diode display coupled to the housing on the front face, wherein the organic light-emitting diode display comprises:
a display cover layer that covers the front face;
a glass substrate;
a layer of thin-film transistor circuitry on the glass substrate that includes transistors and organic light-emitting diodes and that is configured to form a pixel array that displays images through the display cover layer; and
a thin-film encapsulation layer, wherein the layer of thin-film transistor circuitry is interposed between the glass substrate and the thin-film encapsulation layer, wherein the thin-film encapsulation layer has a thickness of less than 10 microns.

### Claim 18 (depends on 17)

The electronic device defined in claim 17 wherein the glass substrate has a thickness of less than 0.25 mm, the electronic device further comprising:
a touch sensor interposed between the display cover layer and the thin-film encapsulation layer.
