# US 10,483,490 B2 · OLED panel, method for manufacturing the same and display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,490 B2 - Document ID: US10483490B2 - Status: Granted - Kind: B2 - Application number: 15/321,477 - Filed: 2016-03-16 - Published: 2018-07-05 - Granted: 2019-11-19 - Earliest claimed: 2015-04-24 - Assignees: Boe Technology Group Co., Ltd. - Applicants: Boe Technology Group Co., Ltd. - Inventors: Chunjan Wang; Huaiting Shih - Web page: https://patentgrep.com/patent/US10483490B2 ## CPC - H10K 59/871: {Self-supporting sealing arrangements} - H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers} - H10K 59/874: {including getter material or desiccant} - H10K 71/70: Testing, e.g. accelerated lifetime tests - H10P 74/27: {Structural arrangements therefor} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure discloses an OLED panel, a method for manufacturing the same and a display device. The OLED panel includes a substrate, a cover plate, an OLED device and an encapsulation structure. The encapsulation structure includes a thin-film encapsulation layer and an encapsulation adhesive, and a hydrochromic material is added in the encapsulation structure. ## Claims ### Claim 1 An organic light emitting diode (OLED) panel, comprising: a substrate; a cover plate, arranged opposite to the substrate; an OLED device, arranged on the substrate; and an encapsulation structure, arranged between the substrate and the cover plate; wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive; a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer; and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive; and wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water; and wherein the encapsulation adhesive comprises a first encapsulation adhesive, a second encapsulation adhesive and a third encapsulation adhesive; and a side of the thin film encapsulation layer, which is away from the substrate, is covered with the first encapsulation adhesive; the second encapsulation adhesive, in which the hydrochromic material is added, surrounds the first encapsulation adhesive; and the third encapsulation adhesive surrounds the second encapsulation adhesive and prevent the second encapsulation adhesive from being in contact with water vapor. ### Claim 2 (depends on 1) The OLED panel according to claim 1, wherein the first encapsulation adhesive has the hydrochromic material added therein. ### Claim 3 (depends on 2) The OLED panel according to claim 2, wherein the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor. ### Claim 4 An organic light emitting diode (OLED) panel, comprising: a substrate; a cover plate, arranged opposite to the substrate; an OLED device, arranged on the substrate; and an encapsulation structure, arranged between the substrate and the cover plate; wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive; a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer; and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive; wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water, and wherein the thin-film encapsulation layer is formed at the side of the OLED device which is away from the substrate, and comprises a multi-layer structure formed by inorganic encapsulation layers and organic encapsulation layers which are alternately arranged in order in a direction away from the OLED device, the total number of the inorganic encapsulation layers and organic encapsulation layers is at least three, and the hydrochromic material is added in at least one organic encapsulation layer; and a side of the thin-film encapsulation layer, which is away from the substrate, is covered with the encapsulation adhesive which prevents the thin-film encapsulation layer from being in contact with water vapor. ### Claim 5 (depends on 4) The OLED panel according to claim 4, wherein the total number of the inorganic and organic encapsulation layers is three. ### Claim 6 A method for manufacturing an organic light emitting diode (OLED) panel, comprising steps of: providing a substrate and a cover plate; forming an OLED device on the substrate; forming an encapsulation structure on the substrate, wherein the encapsulation structure comprises a thin-film encapsulation layer and an encapsulation adhesive, a side of the OLED device, which is away from the substrate, is covered with the thin-film encapsulation layer, and a hydrochromic material is added in the thin-film encapsulation layer and/or the encapsulation adhesive; and aligning the cover plate with the substrate provided with the OLED device and the encapsulation structure, attaching the cover plate on the substrate, and curing the encapsulation adhesive with ultraviolet light, to form the OLED panel, wherein the hydrochromic material is CuSO4 whose color changes when it is in contact with water, and wherein the step of forming the encapsulation structure comprises: forming the thin-film encapsulation layer on the side of the OLED device which is away from the substrate; forming a first encapsulation adhesive on a side of the thin-film encapsulation layer which is away from the OLED device; forming a second encapsulation adhesive which surrounds the first encapsulation adhesive, wherein the hydrochromic material is added in the second encapsulation adhesive; and forming a third encapsulation adhesive which surrounds the second encapsulation adhesive, to prevent the second encapsulation adhesive from being in contact with water vapor. ### Claim 7 (depends on 6) The method for manufacturing the OLED panel according to claim 6, wherein the step of forming the encapsulation structure comprises: on the side of the OLED device which is adding the hydrochromic material in the first encapsulation adhesive. ### Claim 8 (depends on 7) The method for manufacturing the OLED panel according to claim 7, wherein the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor. ### Claim 9 (depends on 6) The method for manufacturing the OLED panel according to claim 6, wherein the step of forming the encapsulation structure further comprises: wherein the thin-film encapsulation layer comprises a multi-layer structure formed by inorganic encapsulation layers and organic encapsulation layer(s) which are alternately arranged in order in a direction away from the OLED device, the total number of the inorganic encapsulation layers and organic encapsulation layer(s) is at least three, and the hydrochromic material is added in at least one organic encapsulation layer; and forming the encapsulation adhesive on the thin-film encapsulation layer to prevent the thin-film encapsulation layer from being in contact with water vapor. ### Claim 10 (depends on 9) The method for manufacturing the OLED panel according to claim 9, wherein the total number of the inorganic and organic encapsulation layers is three. ### Claim 11 (depends on 1) A display device, comprising an organic light emitting diode (OLED) panel of claim 1. ### Claim 12 (depends on 11) The display device according to claim 11, wherein the first encapsulation adhesive has the hydrochromic material added therein. ### Claim 13 (depends on 12) The display device according to claim 12, wherein the second encapsulation adhesive prevents the first encapsulation adhesive from being in contact with water vapor.