# US 10,483,448 B2 · Flexible thermoelectric devices, methods of preparation thereof, and methods of recovering waste heat therewith > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,448 B2 - Document ID: US10483448B2 - Status: Granted - Kind: B2 - Application number: 15/890,748 - Filed: 2018-02-07 - Published: 2018-07-26 - Granted: 2019-11-19 - Earliest claimed: 2014-04-25 - Assignees: North Carolina State University; University of Virginia Patent Foundation - Applicants: North Carolina State University; University of Virginia Patent Foundation - Inventors: Jesse Jur; Mark Losego; Patrick E. Hopkins - Web page: https://patentgrep.com/patent/US10483448B2 ## CPC - H10N 10/17: characterised by the structure or configuration of the cell or thermocouple forming the device - H10N 10/01: Manufacture or treatment - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract The present disclosure relates to flexible thermoelectric devices. In some embodiments, such devices can comprise a flexible substrate with a first conductive component and a second, different conductive component deposited thereon so as to form a plurality of electrical junctions. The flexible substrate can be a fabric, and the conductive component can be deposited by methods such as stitching of conductive yarns or deposition of conductive inks. The present disclosure further relates to methods of preparing flexible thermoelectric devices and methods of utilizing flexible thermoelectric devices for producing electrical current from waste heat. ## Claims ### Claim 1 A flexible thermoelectric device comprising: a flexible substrate having a surface; a first conductive ink having a Seebeck coefficient; and a second conductive ink having a Seebeck coefficient that is different from the Seebeck coefficient of the first conductive ink; wherein each of the first conductive ink and the second conductive ink independently comprises a carrier and conductive particles; wherein each of the first conductive ink and the second conductive ink independently has a resistance that is no more than two orders of magnitude greater than the resistance of the conductive particles alone; wherein the first conductive ink and the second conductive ink are arranged on the surface of the flexible substrate so as to form a series of thermopile junctions; and wherein the flexible substrate is shaped such that alternating thermopile junctions are positioned so as to be spaced apart from intervening thermopile junctions. ### Claim 2 (depends on 1) The flexible thermoelectric device according to claim 1, wherein the flexible substrate is formed of a fibrous material. ### Claim 3 (depends on 2) The flexible thermoelectric device according to claim 2, wherein the flexible substrate is a woven fabric or a non-woven fabric. ### Claim 4 (depends on 2) The flexible thermoelectric device according to claim 2, wherein the flexible substrate comprises a material selected from the group consisting of polyesters, cotton, polyamides, poly-N-vinylcarbazole, cellulosic materials, polyvinyl alcohol, polypropylene, polyethylene terephthalate, fiberglass, and combinations thereof. ### Claim 5 (depends on 1) The flexible thermoelectric device according to claim 1, wherein the flexible substrate is a pre-molded substrate. ### Claim 6 (depends on 1) The flexible thermoelectric device according to claim 1, wherein the flexible substrate is folded proximate each of the thermopile junctions. ### Claim 7 (depends on 1) The flexible thermoelectric device according to claim 1, wherein the first conductive ink has a positive or negative Seebeck coefficient and the second conductive ink has a Seebeck coefficient of opposing sign. ### Claim 8 (depends on 1) The flexible thermoelectric device according to claim 1, wherein the conductive particles are nano-to-micro sized metallic particles. ### Claim 9 A method of forming a thermoelectric device comprising: providing a flexible substrate having a surface; and applying a first conductive ink and a second conductive ink to the surface of the flexible substrate such the first conductive ink and the second conductive ink are arranged on the surface of the flexible substrate so as to form a series of thermopile junctions, the first conductive having a Seebeck coefficient, and the second conductive ink having a Seebeck coefficient that is different from the Seebeck coefficient of the first conductive ink; wherein after said applying, the flexible substrate is in a shape such that alternating thermopile junctions are positioned so as to be spaced apart from intervening thermopile junctions; wherein each of the first conductive ink and the second conductive ink independently comprises a carrier and conductive particles; and wherein each of the first conductive ink and the second conductive ink independently has a resistance that is no more than two orders of magnitude greater than the resistance of the conductive particles alone. ### Claim 10 (depends on 9) The method according to claim 9, wherein after said applying, the flexible substrate is in a pleated shape. ### Claim 11 (depends on 9) The method according to claim 9, further comprising folding the flexible substrate, before or after said applying, so that the flexible substrate is in a pleated shape. ### Claim 12 (depends on 9) The method according to claim 9, wherein the flexible substrate is formed of a fibrous material. ### Claim 13 (depends on 12) The method according to claim 12, wherein the flexible substrate is a woven fabric or a non-woven fabric. ### Claim 14 (depends on 12) The method according to claim 12, wherein the flexible substrate comprises a material selected from the group consisting of polyesters, cotton, polyamides, poly-N-vinylcarbazole, cellulosic materials, polyvinyl alcohol, polypropylene, polyethylene terephthalate, fiberglass, and combinations thereof. ### Claim 15 (depends on 9) The method according to claim 9, wherein the first conductive ink has a positive or negative Seebeck coefficient and the second conductive ink has a Seebeck coefficient of opposing sign. ### Claim 16 (depends on 9) The method according to claim 9, wherein the conductive particles are nano-to-micro sized metallic particles.