# US 10,483,444 B2 · Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier

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- Number: US 10,483,444 B2
- Document ID: US10483444B2
- Status: Granted
- Kind: B2
- Application number: 15/757,141
- Filed: 2016-08-30
- Published: 2018-09-13
- Granted: 2019-11-19
- Earliest claimed: 2015-09-02
- Assignees: OSRAM Opto Semiconductors GmbH
- Applicants: OSRAM Opto Semiconductors GmbH
- Inventors: Harald Jäger; Jürgen Moosburger; Herbert Brunner
- Web page: https://patentgrep.com/patent/US10483444B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8506: {Containers}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/853: characterised by their shape
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H 20/852: Encapsulations
- H10W 72/0198: {batch processes}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier including two metal layers, wherein the metal layers are detachable from one another, securing an optoelectronic semiconductor chip on the first metal layer of the carrier, and mechanically detaching the second metal layer from the first metal layer.

## Claims

### Claim 1

A method of producing an optoelectronic semiconductor component comprising:
providing a carrier comprising two metal layers, wherein the metal layers are detachable from one another,
applying a photoresist on the first metal layer,
patterning the photoresist such that regions composed of the photoresist comprising a predefined cross section are present on the first metal layer,
electrolytically applying a further metal on free regions of the first metal layer not covered by the photoresist, wherein the further metal comprises a greater thickness than the photoresist and partly projects laterally beyond regions of the photoresist,
removing the photoresist, wherein a body composed of the further metal arises, said body comprising a laterally projecting upper edge region,
securing an optoelectronic semiconductor chip on the further metal, and
mechanically detaching the second metal layer from the first metal layer.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the metal layers comprise copper or consist of copper.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the carrier comprises an intermediate layer, optionally a chromium layer, between the two metal layers.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the electrolytically applied metal is copper or nickel.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the electrolytically applied metal comprises a thickness of 20 to 60 μm.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the semiconductor chip is electrically contacted with the first metal layer or the electrolytically applied metal by an electrically conductive connection piece.

### Claim 7 (depends on 1)

The method according to claim 1, wherein an electrically insulating material is additionally applied on the first metal layer.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the first metal layer is patterned such that mutually electrically insulated regions of the first metal layer arise.

### Claim 9

A method of producing an optoelectronic semiconductor component comprising:
providing a carrier comprising two metal layers, wherein the metal layers are detachable from one another,
securing an optoelectronic semiconductor chip on the first metal layer, and mechanically detaching the second metal layer from the first metal layer, wherein
a) producing the carrier comprises:
applying a chromium layer on a metal layer, wherein the metal layer comprises a thickness of 30 to 200 μm,
applying a photoresist on the chromium layer,
patterning the photoresist such that regions composed of photoresist comprising a predefined cross section are configured on the chromium layer,
electrolytically applying a further metal on the chromium layer, wherein the further metal comprises a greater thickness than the photoresist and partly projects beyond the regions composed of photoresist,
removing the photoresist, wherein a body composed of the further metal arises, said body comprising a projecting upper edge region,
b) the method further comprises:
securing an optoelectronic semiconductor chip on the electrolytically applied metal,
applying an electrically insulating material, and
mechanically detaching the metal layer.

### Claim 10 (depends on 9)

The method according to claim 9, wherein the electrolytically applied metal is copper or nickel.

### Claim 11 (depends on 9)

The method according to claim 9, wherein the electrolytically applied metal comprises a thickness of 20 to 60 μm.