# US 10,483,442 B2 · Addition curable type silicone resin composition, process for producing composition, and optical semiconductor apparatus

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- Number: US 10,483,442 B2
- Document ID: US10483442B2
- Status: Granted
- Kind: B2
- Application number: 15/770,505
- Filed: 2016-10-28
- Published: 2018-11-01
- Granted: 2019-11-19
- Earliest claimed: 2015-11-13
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Kazuyasu Sato; Toshiyuki Ozai; Eiichi Tabei
- Web page: https://patentgrep.com/patent/US10483442B2

## CPC

- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08L 83/04: Polysiloxanes
- C08L 83/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C08L83/10 takes precedence)
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10K 85/40: Organosilicon compounds, e.g. TIPS pentacene
- H10W 74/10: characterised by their shape or disposition
- H10W 74/40: characterised by their materials
- C08G 77/58: Metal-containing linkages
- C08L 2201/10: Transparent films; Clear coatings; Transparent materials
- C08L 2203/206: use in coating or encapsulating of electronic parts
- C08L 2205/02: containing two or more polymers of the same C08L -group
- C08L 2314/08: prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst
- H10H 20/0362: {of encapsulations}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s, (c) an organohydrogen polysiloxane represented by R4aHbSiO(4-a-b)/2, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si—O—Ce bond, and an Si—O—Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

## Claims

### Claim 1

An addition curable type silicone resin composition which comprises:
(a) an organopolysiloxane having two or more alkenyl groups bonded to a silicon atom(s) in one molecule, and having a viscosity at 25° C. of 50 to 100,000 mPa·s,
(b) an organopolysiloxane represented by the following average composition formula (1), and is a liquid having a viscosity at 25° C. of 1,000 mPa·s or more or a solid: an amount of the component (b) being more than 0 part by mass and less than 80 parts by mass based on 100 parts by mass of a total of the component (a) and the component (b),
(R1R22SiO1/2)m(R1R2SiO2/2)n(R22SiO2/2)p(R1SiO3/2)q(R2(OR3)SiO2/2)r(SiO4/2)s (1)
wherein, R1 represents a monovalent hydrocarbon group which may contain an alkenyl group; R2 represents a monovalent hydrocarbon group which does not contain an alkenyl group, and 80% or more of the whole R2 is a methyl group; R1 represents a hydrogen atom or an alkyl group; “m”, “n”, “p”, “q”, “r”, and “s” are numbers satisfying m≥0, n≥0, p≥0, q≥0, r≥0, s≥0, and are numbers satisfying m+n>0, q+r+s>0, m+n+p+q+r+s=1,
(c) an organohydrogen polysiloxane represented by the following average composition formula (2), having two or more SiH bonds in one molecule, and having a viscosity at 25° C. of 1,000 mPa·s or less: in an amount that a number of the SiH bonds of the component (c) being 0.5 to 5.0-fold based on a total of a number of the alkenyl groups of the component (a) and the component (b),
R4aHbSiO(4-a-b)/2 (2)
wherein, R4 represents a monovalent hydrocarbon group which does not contain an alkenyl group, and 50% or more of the whole R4 is a methyl group; and “a” and “b” are numbers satisfying 0.7≤a≤2.1, 0.001≤b≤1.0, and 0.8≤a+b≤3.0,
(d) a platinum group metal catalyst: in an amount of 1 to 500 ppm in terms of a mass of metal atoms based on a total of the components (a) to (c), and
(e) a polyorganometallosiloxane containing an Si—O—Ce bond, and an Si—O—Ti bond, a Ce content of which is 50 to 5,000 ppm, a Ti content of which is 50 to 5,000 ppm, and having a viscosity at 25° C. of 10 to 10,000 mPa·s: in an amount of 0.01 to 5 parts by mass based on 100 parts by mass of a total of the components (a) to (d),
which cures by heating,
wherein a total light transmittance of a sheet having a thickness of 2 mm of a cured product of the composition at a wavelength of 400 nm of 80% or more, and a weight reduction ratio of the cured product after storage at 250° C. for 500 hours of within 10%.

### Claim 2 (depends on 1)

A process for producing the addition curable type silicone resin composition according to claim 1 by mixing the components (a) to (e), wherein the component (e) is
a polyorganometallosiloxane obtained by subjecting a mixture comprising:
(i) an organopolysiloxane having a viscosity at 25° C. of 10 to 10,000 mPa·s: 100 parts by mass,
(ii) a rare earth carboxylate containing a cerium carboxylate represented by the following general formula (e-1): with an amount that a mass of cerium is 0.05 to 5 parts by mass based on 100 parts by mass of the component (i),
(R5COO)xCe (e-1)
wherein, each of R5s represents the same or different kind of monovalent hydrocarbon group; and “x” is 3 or 4, and
(iii) a titanium compound represented by the following general formula (e-2) and/or or its partial hydrolyzed condensate: with an amount that a mass of titanium is 0.05 to 5 parts by mass based on 100 parts by mass of the component (i),
(R6O)4Ti (e-2)
wherein, each of R6s represents the same or different kind of monovalent hydrocarbon group,
to heat treatment at a temperature of 150° C. or higher.

### Claim 3 (depends on 1)

An optical semiconductor apparatus which comprises a light emitting diode sealed by the addition curable type silicone resin composition according to claim 1.

### Claim 4 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein component (a) is selected from the group consisting of ViR2SiO(SiR2O)dSiR2Vi, ViR2SiO(SiRViO)c(SiR2O)dSiR2Vi, Vi2RSiO(SiR2O)dSiRVi2, Vi3SiO(SiR2O)dSiVi3, Vi2RSiO(SiRViO)c(SiR2O)dSiRVi2, Vi3SiO(SiRViO)c(SiR2O)dSiVi3, and R3SiO(SiRViO)c(SiR2O)dSiR3,
wherein Vi represents a vinyl group; R represents a monovalent hydrocarbon group containing neither an aliphatic unsaturated group nor an aryl group; c is an integer of 0 to 5; and d is an integer of 0 to 200.

### Claim 5 (depends on 4)

The addition curable type silicone resin composition according to claim 4, wherein component (a) is selected from the group consisting of ViMe2SiO(Me2SiO)20SiMe2Vi, ViMe2SiO(Me2SiO)90SiMe2Vi, ViMe2SiO(MeViSiO)1(Me2SiO)19SiMe2Vi, and Me3SiO(MeViSiO)2(Me2SiO)18SiMe3.

### Claim 6 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein the viscosity of component (a) is 1,000 to 50,000 mPa·s.

### Claim 7 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein the viscosity of component (a) is 1,000 to 10,000 mPa·s.

### Claim 8 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein the amount of component (b) is more than 0 part by mass and less than 50 parts by mass based on 100 parts by mass of a total of the component (a) and the component (b).

### Claim 9 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein the amount of component (b) is 50 part by mass or more and less than 80 parts by mass based on 100 parts by mass of a total of the component (a) and the component (b).

### Claim 10 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein component (c) is at least one of Me3SiO(MeHSiO)eSiMe3, Me3SiO(MeHSiO)e(Me2SiO)fSiMe3, wherein each of e and f represents an integer of 2 to 100, or

### Claim 11 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein component (e) is present in an amount of in an amount of 0.1 to 3 parts by mass based on 100 parts by mass of a total of the components (a) to (d).

### Claim 12 (depends on 1)

The addition curable type silicone resin composition according to claim 1, wherein component (e) is present in an amount of in an amount of 0.5 to 3 parts by mass based on 100 parts by mass of a total of the components (a) to (d).