# US 10,483,438 B2 · Component, substrate module, apparatus, and optical filter

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- Number: US 10,483,438 B2
- Document ID: US10483438B2
- Status: Granted
- Kind: B2
- Application number: 15/752,271
- Filed: 2016-07-22
- Published: 2018-08-23
- Granted: 2019-11-19
- Earliest claimed: 2015-09-04
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Hiizu Ootorii
- Web page: https://patentgrep.com/patent/US10483438B2

## CPC

- H10H 20/8506: {Containers}
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 72/00: Interconnections or connectors in packages
- H10W 72/071: {Connecting or disconnecting}
- H01S 5/0237: by soldering
- H01S 5/02375: Positioning of the laser chips
- H10H 20/0364: {of interconnections}
- H10W 72/01365: {Thermally treating (reflowing H10W72/01357)}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07302: {using an auxiliary member}
- H10W 72/07311: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07334: {Using a reflow oven}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07355: {changes in materials}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/3528: {Intermetallic compounds}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

A component includes a main body, a first layer, and a second layer. The main body includes a bottom surface. The first layer is provided on the bottom surface of the main body and includes a bottom surface. The second layer is bonded to a metal bonding material on a substrate to be provided physically integrally. The second layer has higher wettability with respect to the metal bonding material in a molten state than the first layer, and protrudes from the bottom surface side of the first layer such that at least a part of the bottom surface of the first layer is exposed on an entire outer circumference side of the second layer.

## Claims

### Claim 1

A component, comprising:
a main body including a bottom surface;
a first layer on the bottom surface of the main body, wherein
the first layer includes a bottom surface and an exposed bottom surface area, and
the exposed bottom surface area has a first width; and
a second layer bonded to a metal bonding material, wherein
the metal bonding material is between the second layer and a substrate,
wettability with respect to the metal bonding material in a molten state is higher for the second layer than the first layer,
the second layer protrudes from the bottom surface of the first layer,
at least a part of the bottom surface of the first layer is in contact with an entire outer peripheral side of the second layer, and
in a cross-sectional view of the component along a lamination direction of the first layer and the second layer:
the first width of the exposed bottom surface area of the first layer is larger than a protrusion height of the second layer from the first layer in a protrusion direction.

### Claim 2 (depends on 1)

The component according to claim 1, wherein
the first layer has non-wettability with respect to the metal bonding material.

### Claim 3 (depends on 1)

The component according to claim 1, wherein
the first layer further includes an unexposed bottom surface area covered by the second layer.

### Claim 4 (depends on 3)

The component according to claim 3, wherein
the unexposed bottom surface area has a second width, and
the second width is smaller than the first width.

### Claim 5 (depends on 1)

The component according to claim 1, wherein
the main body includes a semiconductor material as a main constituent material,
the first layer comprises of an insulating material, and
the second layer is an electrode.

### Claim 6 (depends on 5)

The component according to claim 5, wherein
the first layer further includes one of SiO2, SiN, or a poly-based resin.

### Claim 7 (depends on 5)

The component according to claim 5, wherein
at least a bottom surface layer of the second layer comprises Au.

### Claim 8 (depends on 7)

The component according to claim 7, wherein
a volume of the Au that occupies the second layer is one of 3% of a volume of the metal bonding material or less than 3% of the volume of the metal bonding material.

### Claim 9 (depends on 5)

The component according to claim 5, wherein
the second layer includes one of Pt or Ni.

### Claim 10

A substrate module, comprising:
a component;
a substrate including a bonding layer; and
a metal bonding material that connects the component to the bonding layer of the substrate,
the component including
a main body including a bottom surface,
a first layer on the bottom surface of the main body, wherein
the first layer includes a bottom surface and an exposed bottom surface area, and
the exposed bottom surface area has a first width, and
a single second layer that is bonded to a metal bonding material, wherein
the metal bonding material is between the single second layer and a substrate,
wettability with respect to the metal bonding material in a molten state is higher for the single second layer than the first layer,
the single second layer protrudes from the bottom surface of the first layer,
at least a part of the bottom surface of the first layer is in contact with an entire outer peripheral side of the single second layer, and
in a cross-sectional view of the component along a lamination direction of the first layer and the single second layer:
the first width of the exposed bottom surface area of the first layer is larger than a protrusion height of the single second layer from the first layer in a protrusion direction.

### Claim 11 (depends on 10)

The substrate module according to claim 10, wherein
a component projection area is obtained based on projection of the component onto the substrate such that the bonding layer contacts the metal bonding material to form a contact area,
the contact area has an inner side and an outer circumferential edge, and
the component projection area is arranged on the inner side of the contact area.

### Claim 12 (depends on 10)

The substrate module according to claim 10, further comprising
a film that includes an opening opposite to the bonding layer,
an opening shape of the opening includes a plurality of protrusions that protrude radially from a center portion of the metal bonding material,
wherein
the metal bonding material has a planar shape at the opening of the film and the planar shape is substantially same as the opening shape of the opening,
the component is fixed to an area corresponding to the center portion of the metal bonding material,
the plurality of protrusions at the opening of the film are substantially equiangular in at least 3 directions and are rotationally symmetric from the center portion of the metal bonding material,
each of the plurality of protrusions have a shape in which a respective tip end is on an outer peripheral region of the metal bonding material and a thickness of each of the plurality of protrusions decreases towards the respective tip end, and
the metal bonding material present inside the opening of the film is connected to the bonding layer.

### Claim 13 (depends on 10)

The substrate module according to claim 10, wherein
a thickness of the metal bonding material is one of 2 μm or more and half of a width of the single second layer or less than half of the width of the single second layer.

### Claim 14

An apparatus, comprising:
a component;
a substrate including a bonding layer; and
a metal bonding material that connects the component to the bonding layer of the substrate,
the component including
a main body including a bottom surface,
a first layer on the bottom surface of the main body wherein
the first layer includes a bottom surface and an exposed bottom surface area, and
the exposed bottom surface area has a first width, and
a single second layer bonded to a metal bonding material, wherein
the metal bonding material is between the single second layer and a substrate,
wettability with respect to the metal bonding material in a molten state is higher for the single second layer than the first layer,
the single second layer protrudes from the bottom surface of the first layer,
at least a part of the bottom surface of the first layer is in contact with an entire outer peripheral side of the single second layer, and
in a cross-sectional view of the component along a lamination direction of the first layer and the single second layer:
the first width of the exposed bottom surface area of the first layer is larger than a protrusion height of the single second layer from the first layer in a protrusion direction.

### Claim 15

An optical filter, comprising:
a component;
a substrate including a bonding layer; and
a metal bonding material that connects the component to the bonding layer of the substrate,
the component including
a main body including a bottom surface,
a first layer on the bottom surface of the main body, wherein
the first layer includes a bottom surface and an exposed bottom surface area, and
the exposed bottom surface area has a first width, and
a single second layer bonded to a metal bonding material, wherein
the metal bonding material is between the single second layer and a substrate,
wettability with respect to the metal bonding material in a molten state is higher for the single second layer than the first layer,
the single second layer protrudes from the bottom surface of the first layer,
at least a part of the bottom surface of the first layer is in contact with an entire outer peripheral side of the single second layer, and
in a cross-sectional view of the component along a lamination direction of the first layer and the single second layer:
the first width of the exposed bottom surface area of the first layer is larger than a protrusion height of the single second layer from the first layer in a protrusion direction.