# US 10,483,434 B2 · Display devices and methods for forming display devices

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,483,434 B2
- Document ID: US10483434B2
- Status: Granted
- Kind: B2
- Application number: 15/659,947
- Filed: 2017-07-26
- Published: 2018-07-05
- Granted: 2019-11-19
- Earliest claimed: 2017-01-03
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Tung-Kai Liu; Tsau-Hua Hsieh; Hui-Chieh Wang; Shu-Ming Kuo; Ming-I Chao; Shun-Yuan Hu
- Web page: https://patentgrep.com/patent/US10483434B2

## CPC

- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/034: {of coatings}
- H10H 20/0364: {of interconnections}
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≤T−d.

## Claims

### Claim 1

A display device, comprising:
a thin-film transistor substrate;
a conductive pad disposed on the thin-film transistor substrate;
an adhesion film disposed on the conductive pad, the adhesion film comprising a plurality of conductive particles;
a light-emitting component disposed on the adhesion film, the light-emitting component comprising a first connection feature and a second connection feature; and
a protection layer partially surrounding the light-emitting component, wherein each of the first connection feature and the second connection feature has a lower portion not surrounded by the protection layer and the protection layer between the first connection feature and the second connection feature comprises an organic sub-layer and an inorganic sub-layer, and
wherein the adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0<t≤T−d.

### Claim 2 (depends on 1)

The display device as claimed in claim 1, wherein the connection feature comprises a first bump and a second bump, a distance G is between the first bump and the second bump, and d≤G/2.

### Claim 3 (depends on 2)

The display device as claimed in claim 2, wherein the protection layer fills a gap between the first bump and the second bump.

### Claim 4 (depends on 1)

The display device as claimed in claim 1, wherein d≤T≤3d.

### Claim 5 (depends on 1)

The display device as claimed in claim 1, wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Ni, Pd, Cr, Al, Ti, or a combination thereof.

### Claim 6 (depends on 1)

The display device as claimed in claim 1, wherein the lower portion of the connection feature comprises a first metal, the conductive pad comprises a second metal, the plurality of conductive particles comprises a third metal, and wherein the first metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, the second metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, Ni, Pd, Cr, Al, Ti, or a combination thereof, and the third metal comprises Sn, Ag, In, Cu, Au, Zn, Bi, Sb, or a combination thereof.

### Claim 7 (depends on 1)

The display device as claimed in claim 1, wherein the protection layer comprises an organic sub-layer and an inorganic sub-layer surrounding the organic sub-layer.

### Claim 8 (depends on 7)

The display device as claimed in claim 7, wherein outermost sidewalls of the organic sub-layer is between outermost sidewalls of the light-emitting component.

### Claim 9 (depends on 8)

The display device as claimed in claim 8, wherein outermost sidewalls of the inorganic sub-layer is between outermost sidewalls of the light-emitting component.

### Claim 10 (depends on 7)

The display device as claimed in claim 7, wherein the protection layer further comprises another inorganic sub-layer, and the organic sub-layer is interposed between the inorganic sub-layer and the another inorganic sub-layer.

### Claim 11

A light-emitting structure, comprising:
a light-emitting component comprising a first connection feature and a second connection feature; and
a protection layer partially surrounding the light-emitting component and filling a gap between the first connection feature and the second connection feature of the light-emitting component, wherein the protection layer between the first connection feature and the second connection feature comprises an organic sub-layer and an inorganic sub-layer.

### Claim 12 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein the inorganic sub-layer is the outermost layer of the protection layer.

### Claim 13 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein outermost sidewalls of the organic sub-layer is between outermost sidewalls of the light-emitting component.

### Claim 14 (depends on 13)

The light-emitting structure as claimed in claim 13, wherein outermost sidewalls of the inorganic sub-layer is between outermost sidewalls of the light-emitting component.

### Claim 15 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein the protection layer further comprises another inorganic sub-layer, and the organic sub-layer is interposed between the inorganic sub-layer and the another inorganic sub-layer.

### Claim 16 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein a thickness of the organic sub-layer is 0.1 μm to 10 μm.

### Claim 17 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein a thickness of the inorganic sub-layer is 0.1 μm to 10 μm.

### Claim 18 (depends on 11)

The light-emitting structure as claimed in claim 11, wherein a thickness of the organic sub-layer is different from a thickness of the inorganic sub-layer.