# US 10,483,425 B2 · Optical semiconductor component package and optical semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,425 B2 - Document ID: US10483425B2 - Status: Granted - Kind: B2 - Application number: 15/760,947 - Filed: 2016-10-25 - Published: 2018-09-13 - Granted: 2019-11-19 - Earliest claimed: 2015-10-30 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Masahiko Taniguchi; Hidenobu Egashira - Web page: https://patentgrep.com/patent/US10483425B2 ## CPC - H10F 55/255: formed in, or on, a common substrate - H01S 3/06704: {Housings; Packages} - H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings - H01S 5/0239: Combinations of electrical or optical elements - H01S 5/0601: {comprising an absorbing region (H01S5/0604, H01S5/0607, H01S5/0615 and H01S5/065 take precedence; bistable laser devices in general G02F3/026)} - H01S 5/0609: {acting on an absorbing region, e.g. wavelength convertors} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10F 77/60: Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations - H10F 77/933: {for devices having potential barriers} - H10H 20/8506: {Containers} - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8584: {electrically controlled, e.g. Peltier elements} - H01S 5/02251: using optical fibres - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H01S 5/02345: Wire-bonding - H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element} - H10H 20/85: Packages - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract An optical semiconductor component package includes a base, a frame, a lid, and a light absorbing member located on an inner surface of the lid. The base is plate-like and has a first surface including a mount area in which an optical semiconductor component is mountable. The frame is located on the first surface and surrounds the mount area. The lid is plate-like and is bonded to the frame and covers the mount area. The light absorbing member is located on a second surface of the lid facing the mount area, and has a plurality of recesses on its surface. ## Claims ### Claim 1 An optical semiconductor component package, comprising: a plate-like base having a first surface including a mount area in which an optical semiconductor component is mountable; a frame located on the first surface and surrounding the mount area; a plate-like lid bonded to the frame and covering the mount area; and a light absorbing member located on a second surface of the lid facing the mount area, the light absorbing member having a plurality of recesses on a surface thereof. ### Claim 2 (depends on 1) The optical semiconductor component package according to claim 1, wherein the light absorbing member contains glass and a black inorganic pigment dispersed in the glass. ### Claim 3 (depends on 2) The optical semiconductor component package according to claim 2, wherein the plurality of recesses each have a circular opening. ### Claim 4 (depends on 2) The optical semiconductor component package according to claim 2, wherein the plurality of recesses are arranged in a rectangular grid or a rhombic grid. ### Claim 5 (depends on 2) The optical semiconductor component package according to claim 2, wherein the lid has a plurality of lid surface recesses on a surface thereof facing the mount area. ### Claim 6 (depends on 1) The optical semiconductor component package according to claim 1, wherein the plurality of recesses each have a circular opening. ### Claim 7 (depends on 6) The optical semiconductor component package according to claim 6, wherein the plurality of recesses are arranged in a rectangular grid or a rhombic grid. ### Claim 8 (depends on 1) The optical semiconductor component package according to claim 1, wherein the plurality of recesses are arranged in a rectangular grid or a rhombic grid. ### Claim 9 (depends on 8) The optical semiconductor component package according to claim 8, wherein the lid has a plurality of lid surface recesses on a surface thereof facing the mount area. ### Claim 10 (depends on 1) The optical semiconductor component package according to claim 1, wherein the lid has a plurality of lid surface recesses on a surface thereof facing the mount area. ### Claim 11 (depends on 10) The optical semiconductor component package according to claim 10, wherein when the lid is viewed from a position perpendicular to the second surface, the plurality of recesses on the light absorbing member and the plurality of lid surface recesses on the lid are located in correspondence with each other. ### Claim 12 (depends on 1) An optical semiconductor device, comprising: the optical semiconductor component package according to claim 1; and an optical semiconductor component mounted in the mount area.