# US 10,483,408 B2 · Method for making a cover for an electronic package and electronic package comprising a cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,408 B2 - Document ID: US10483408B2 - Status: Granted - Kind: B2 - Application number: 15/689,976 - Filed: 2017-08-29 - Published: 2018-07-05 - Granted: 2019-11-19 - Earliest claimed: 2017-01-03 - Assignees: STMicroelectronics (Grenoble 2) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS - Inventors: Karine Saxod; Alexandre Mas; Eric Saugier; Gaetan Lobascio; Benoit Besancon - Web page: https://patentgrep.com/patent/US10483408B2 ## CPC - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - B29C 45/14065: {Positioning or centering articles in the mould} - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - H10F 55/00: Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto - H10F 71/129: {Passivating} - H10F 77/407: {indirectly associated with the devices} - H10F 77/413: {directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42)} - H10F 77/93: {Interconnections} - H10H 20/8506: {Containers} - B29C 45/14778: {the article consisting of a material with particular properties, e.g. porous, brittle} - B29K 2995/0026: Transparent - B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements} - H10W 72/884: {Die-attach connectors and bond wires} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate. ## Claims ### Claim 1 A method for manufacturing at least one cover for an electronic package, comprising: placing at least one optical insert, having opposite faces and configured to allow light radiation to pass therethrough, within a cavity of a closed two-part injection mold in a position such that said opposite faces of said at least one optical insert make contact, respectively, with a surface of an upper part and a surface of a lower part of the closed two-part injection mold; injecting a coating material into said cavity of the closed two-part injection mold to surround said at least one optical insert; setting the coating material in order to obtain a substrate that is overmolded around said at least one optical insert; and cutting through the overmolded substrate to produce at least one cover comprising the at least one optical insert and at least a portion of said overmolded substrate. ### Claim 2 (depends on 1) The method according to claim 1, wherein cutting through said overmolded substrate comprises cutting peripherally around and at a distance from said at least one optical insert. ### Claim 3 (depends on 1) The method according to claim 1, forming each of the surfaces of the upper part and lower part of said two-part injection mold with a layer made of a compressible material such that said opposite faces of said at least one optical insert in the closed two-part injection mold are in contact with the layers of compressible material. ### Claim 4 (depends on 1) The method according to claim 1, wherein said surfaces of the upper part and lower part of the two-part injection mold are parallel. ### Claim 5 (depends on 1) The method according to claim 1, wherein one surface of the upper part or lower part of the two-part injection mold comprises at least one zone surrounded by at least one groove, said zone making contact with one of the faces of the at least one optical insert, such that the coating material injected into said cavity of the closed two-part injection mold also fills said groove to produce at least one protruding rib extending from said overmolded substrate at a location corresponding to said groove. ### Claim 6 (depends on 5) The method according to claim 5, wherein cutting through said overmolded substrate further comprises cutting through said protruding rib. ### Claim 7 (depends on 5) The method according to claim 5, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said at least one optical insert is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the protruding rib to a support substrate to which the integrated circuit chip is mounted. ### Claim 8 (depends on 1) The method according claim 1, wherein said at least one optical insert comprises first and second optical inserts, wherein one surface of the upper part or lower part of the two-part injection mold comprises at least two zones surrounded by at least one main protruding groove, said two zones separated by at least one intermediate groove, each zone for making contact with one of the faces of each of said first and second optical inserts, respectively, such that the coating material injected into said cavity of the closed two-part injection mold also fills both the main protruding groove and the intermediate groove to produce at least one peripheral protruding rib extending from said overmolded substrate at a location corresponding to said main protruding groove and at least one intermediate rib extending from said overmolded substrate at a location corresponding to said intermediate groove. ### Claim 9 (depends on 8) The method according to claim 8, wherein cutting through said overmolded substrate further comprises cutting through said peripheral protruding rib. ### Claim 10 (depends on 8) The method according to claim 8, wherein said intermediate groove further includes a shallower part, such that the intermediate rib of said overmolded substrate includes a notch. ### Claim 11 (depends on 8) The method according to claim 8, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said first optical insert is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the peripheral protruding rib to a support substrate to which the integrated circuit chip is mounted. ### Claim 12 (depends on 1) The method according to claim 1, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein said at least one optical insert is in alignment with the optical sensor. ### Claim 13 A method for manufacturing, comprising: placing a first optical insert and a second optical insert, wherein each of the first and second optical inserts has opposite faces and is configured to allow light radiation to pass therethrough, within opposite faces of a cavity of a closed two-part injection mold in a position such that said opposite faces of said first and second optical inserts make contact, respectively, with a surface of an upper part and a surface of a lower part of the closed two-part injection mold; injecting a coating material into said cavity of the closed two-part injection mold to surround said first and second optical inserts; setting the coating material in order to obtain a substrate that is overmolded around said first and second optical inserts. ### Claim 14 (depends on 13) The method according to claim 13, further comprising cutting through said overmolded substrate to define a peripheral edge of a cover for an electronic package. ### Claim 15 (depends on 13) The method according to claim 13, wherein the surfaces of the upper part and lower part of the two-part injection mold are made of a compressible material which bears on the opposite faces of the first and second optical inserts. ### Claim 16 (depends on 13) The method according to claim 13, wherein said surfaces of the upper part and lower part of the two-part injection mold are parallel. ### Claim 17 (depends on 13) The method according to claim 13, wherein one surface of the upper part or lower part of the two-part injection mold comprises a groove positioned between the first and second optical inserts, and wherein the coating material injected into said cavity fills said groove to produce a rib extending from the substrate and positioned between the first and second optical inserts. ### Claim 18 (depends on 13) The method according to claim 13, wherein one surface of the upper part or lower part of the two-part injection mold comprises a groove which extends to surround the first and second optical inserts, and wherein the coating material injected into said cavity fills said groove to produce a rib extending from the substrate and which surrounds the first and second optical inserts. ### Claim 19 (depends on 18) The method according to claim 18, further comprising cutting through said overmolded substrate to define a peripheral edge of a cover for an electronic package, and wherein said cutting divides the rib which surrounds the first and second optical inserts. ### Claim 20 (depends on 19) The method according to claim 19, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein one of said first and second optical inserts is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the rib to a support substrate to which the integrated circuit chip is mounted. ### Claim 21 (depends on 13) The method according to claim 13, wherein one surface of the upper part or lower part of the two-part injection mold comprises a first groove which extends to surround the first and second optical inserts and a second groove positioned between the first and second optical inserts, wherein the coating material injected into said cavity fills said first and second grooves to produce a peripheral rib extending from the substrate and which surrounds the first and second optical inserts and an intermediate rib extending from the substrate and positioned between the first and second optical inserts. ### Claim 22 (depends on 21) The method according to claim 21, further comprising cutting through said overmolded substrate to define a peripheral edge of a cover for an electronic package, and wherein said cutting divides the peripheral rib of the cover which surrounds the first and second optical inserts. ### Claim 23 (depends on 22) The method according to claim 22, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein one of said first and second optical inserts is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the peripheral rib to a support substrate to which the integrated circuit chip is mounted. ### Claim 24 (depends on 21) The method according to claim 21, wherein said second groove further includes a shallower part, such that the intermediate rib includes a notch. ### Claim 25 A method for manufacturing at least one cover for an electronic package, comprising: placing at least one optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between opposite faces of a cavity of a mold in a position such that said opposite faces of said at least one optical insert make contact with said opposite faces of said cavity of the mold, wherein one face of the cavity of the mold comprises at least two zones surrounded by at least one main protruding groove, said two zones separated by at least one intermediate groove, each zone proving a surface for making contact with one of the faces of said at least one optical insert; injecting a coating material into said cavity and around said at least one optical insert such that the coating material injected into said cavity fills both the main protruding groove and the intermediate groove; and setting the coating material in order to obtain a substrate that is overmolded around said at least one optical insert and provided with at least one peripheral protruding rib corresponding to said main protruding groove of the mold and at least one intermediate rib corresponding to said intermediate groove of the mold in or to produce at least one cover comprising the at least one optical insert and at least a portion of said overmolded substrate. ### Claim 26 (depends on 25) The method according to claim 25, further comprising cutting through said overmolded substrate and through said peripheral protruding rib. ### Claim 27 (depends on 25) The method according to claim 25, wherein said intermediate groove further includes a shallower part, such that the intermediate rib of said overmolded substrate includes a notch. ### Claim 28 A method for manufacturing a cover for an electronic package, comprising: placing a first optical insert and a second optical insert, wherein each of the first and second optical inserts has opposite faces and is configured to allow light radiation to pass therethrough, between opposite faces of a cavity of a mold in a position such that said opposite faces of said first and second optical inserts make contact with said opposite faces of said cavity of the mold, wherein one face of the cavity of the mold comprises a first groove which extends to surround the first and second optical inserts and a second groove positioned between the first and second optical inserts; injecting a coating material into said cavity and around said first and second optical inserts and filling said first and second grooves; setting the coating material in order to obtain a substrate that is overmolded around said first and second optical inserts to produce a cover which surrounds the first and second optical inserts and an intermediate rib of the cover positioned between the first and second optical inserts. ### Claim 29 (depends on 28) The method according to claim 28, further comprising cutting through said overmolded substrate to define a peripheral edge of the cover, and wherein said cutting divides the peripheral rib of the cover which surrounds the first and second optical inserts. ### Claim 30 (depends on 28) The method according to claim 28, wherein said second groove further includes a shallower part, such that the intermediate rib includes a notch. ### Claim 31 (depends on 28) The method according to claim 28, further comprising mounting the cover over an integrated circuit chip having an optical sensor, wherein one of said first and second optical inserts is in alignment with the optical sensor, and wherein mounting comprises attaching a bottom edge of the peripheral rib to a support substrate to which the integrated circuit chip is mounted.