# US 10,483,386 B2 · Semiconductor device, transistor having doped seed layer and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,386 B2 - Document ID: US10483386B2 - Status: Granted - Kind: B2 - Application number: 14/158,157 - Filed: 2014-01-17 - Published: 2015-07-23 - Granted: 2019-11-19 - Earliest claimed: 2014-01-17 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Chi-Ming Chen; Po-Chun Liu; Chung-Yi Yu; Chia-Shiung Tsai; Ru-Liang Lee - Web page: https://patentgrep.com/patent/US10483386B2 ## CPC - H10D 30/4755: {having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs} - H10D 30/015: {of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT} - H10D 62/8503: {Nitride Group III-V materials, e.g. AlN or GaN} - H10P 14/24: using chemical vapour deposition [CVD] - H10P 14/3216: {Nitrides} - H10P 14/3254: {Graded layers} - H10P 14/3416: {Nitrides} - H10P 14/3444: {P-type} - H10P 30/206: {into Group III-V semiconductors} - H10P 30/21: {of electrically active species} - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device includes a substrate, and a seed layer over the substrate, wherein the seed layer comprises carbon dopants. The semiconductor device further includes a channel layer over the seed layer, and an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer. A method of making a transistor includes forming a seed layer over a substrate, and doping the seed layer, wherein doping the seed layer comprises introducing carbon dopants into the seed layer. The method further includes forming a channel layer over the seed layer, and forming an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer. ## Claims ### Claim 1 A semiconductor device comprising: a single layer substrate having a substrate lattice structure, wherein the substrate comprises p-type dopants; an AlN seed layer above and in direct contact with the substrate, the AlN seed layer comprising an AlN first seed sublayer having a first lattice structure and an AlN second seed sublayer having a second lattice structure, the second lattice structure being different than the first lattice structure, wherein a portion of the AlN seed layer closest to the substrate comprises carbon dopants and has a different lattice structure from the substrate lattice structure, and wherein the second seed sublayer is formed at a temperature ranging from about 1000° C. to about 1300° C.; a channel layer over the AlN seed layer; an active layer over the channel layer, wherein the active layer has a band gap discontinuity with the channel layer; and a graded layer in direct contact with the AlN seed layer with the channel layer comprising a single material layer in direct contact with the graded layer, wherein the graded layer comprises: a first graded sublayer including AlxGa1-xN, where x ranges from 0.7 to 0.9; a second graded sublayer on the first graded sublayer, the second graded sublayer including AlxGa1-yN, where y ranges from 0.4 to 0.6; and a third graded sublayer on the second graded sublayer, the third graded sublayer including AlzGa1-zN, where z ranges from 0.15 to 0.3. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein a concentration of the carbon dopants ranges from about 2×1017 atoms/cm3 to about 1×1020 atoms/cm3. ### Claim 3 (depends on 1) The semiconductor device of claim 1, wherein a thickness of the first graded sublayer ranges from about 50 nanometers (nm) to about 200 nm. ### Claim 4 (depends on 1) The semiconductor device of claim 1, wherein a thickness of the second graded sublayer ranges from about 150 nm to about 250 nm. ### Claim 5 (depends on 1) The semiconductor device of claim 1, wherein a thickness of the third graded sublayer ranges from about 350 nm to about 600 nm. ### Claim 6 (depends on 1) The semiconductor device of claim 1, wherein the channel layer is undoped. ### Claim 7 (depends on 1) The semiconductor device of claim 1, further comprising: a first electrode in direct contact with the channel layer; a second electrode in direct contact with the channel layer; and a gate between the first electrode and the second electrode, wherein the gate is configured to control a conductivity of a two-dimensional electron gas (2-DEG) between the first electrode and the second electrode. ### Claim 8 (depends on 7) The semiconductor device of claim 7, wherein the gate is in direct contact with the active layer, and further wherein the semiconductor device is configured to be normally conductive. ### Claim 9 (depends on 7) The semiconductor device of claim 7, further comprising a semiconductor material in direct contact with the active layer between the first electrode and the second electrode, wherein the gate is in direct contact with the semiconductor material and further wherein the semiconductor device is configured to be normally non-conductive. ### Claim 10 (depends on 7) The semiconductor device of claim 7, further comprising a dielectric layer in direct contact with the active layer between the first electrode and the second electrode, wherein the gate is in direct contact with the dielectric layer, and further wherein the semiconductor device is configured to be normally conductive. ### Claim 11 (depends on 7) The semiconductor device of claim 7, further comprising a dielectric layer having a first portion in direct contact with an upper surface of the active layer, a second portion in direct contact with an upper surface region of the channel layer, and a third portion in direct contact with a sidewall of the active layer adjacent the upper surface region of the channel layer, wherein the gate directly contacts the second and third portions of the dielectric layer, and further wherein the semiconductor device is configured to be normally non-conductive, and the semiconductor device is free of an inversion current during operation. ### Claim 12 (depends on 1) The semiconductor device of claim 1, wherein: the first lattice structure has a lattice structure between the substrate lattice structure and the second lattice structure. ### Claim 13 (depends on 1) The semiconductor device of claim 1, wherein the first seed sublayer has a thickness ranging from about 20 nm to about 80 nm, and the second seed sublayer has a thickness ranging from about 50 nm to about 200 nm. ### Claim 14 A transistor comprising: a single layer silicon substrate, wherein the silicon substrate comprises p-type dopants; a seed layer above and in direct contact with the silicon substrate, wherein the seed layer consists of carbon-doped AlN having a substantially constant carbon dopant concentration ranging from about 2×1017 atoms/cm3 to about 1×1020 atoms/cm3, wherein the seed layer comprises a first seed sublayer having a first lattice structure and a first carbon dopant concentration and a second seed sublayer having a second lattice structure having a second carbon dopant concentration, the second lattice structure being different than the first lattice structure, the first carbon dopant concentration and the second carbon dopant concentration are substantially equal, the first seed sublayer having a thickness ranging from about 20 nm to about 80 nm, and the second seed sublayer having a thickness ranging from about 50 nm to about 200 nm; a graded layer above and in direct contact with the seed layer, wherein the graded layer is doped with p-type dopants and comprises; a first graded sublayer including AlxGa1-xN, where x ranges from 0.7 to 0.9, a second graded sublayer on the first graded sublayer, the second graded sublayer including AlyGa1-yN, where y ranges from 0.4 to 0.6, and a third graded sublayer on the second graded sublayer, the third graded sublayer including AlzGa1-zN, where z ranges from 0.15 to 0.3; a channel layer directly over the graded layer; and an active layer in direct contact with the channel layer, wherein the active layer has a band gap discontinuity with the channel layer. ### Claim 15 A method of making a transistor, the method comprising: providing a silicon substrate comprising p-type dopants; forming an AlN seed layer above and in direct contact with the silicon substrate, wherein a first sublayer is formed on the silicon substrate at a first temperature and a second sublayer formed on the first sublayer at a second temperature, the second temperature being higher than the first temperature, wherein the second temperature ranges from about 1000° C. to about 1300° C.; doping the AlN seed layer, wherein doping the AlN seed layer comprises introducing carbon dopants into a portion of the AlN seed layer closest to the silicon substrate; forming a channel layer over the AlN seed layer; forming an active layer in direct contact with the channel layer, wherein the active layer has a band gap discontinuity with the channel layer; and forming a graded layer in direct contact with the AlN seed layer with the channel layer comprising a single material layer in direct contact with the graded layer, wherein the graded layer comprises: a first graded sublayer including AlxGa1-xN, where x ranges from 0.7 to 0.9; a second graded sublayer on the first graded sublayer, the second graded sublayer including AlyGa1-yN, where y ranges from 0.4 to 0.6; and a third graded sublayer on the second graded sublayer, the third graded sublayer including AlzGa1-zN, where z ranges from 0.15 to 0.3. ### Claim 16 (depends on 15) The method of claim 15, wherein doping the AlN seed layer comprises doping the AlN seed layer using ion implantation. ### Claim 17 (depends on 16) The method of claim 16, wherein the ion implantation process comprises introducing a hydrocarbon. ### Claim 18 (depends on 15) The method of claim 15, wherein doping the AlN seed layer comprises doping the AlN seed layer using an in-situ process during formation of the AlN seed layer. ### Claim 19 (depends on 18) The method of claim 18, wherein the in-situ process comprises forming the AlN seed layer using at least one of molecular oriented chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), atomic layer deposition (ALD) or physical vapor deposition (PVD), and introducing carbon dopants from a carbon source comprising at least one of CBr4 or CC14. ### Claim 20 (depends on 15) The method of claim 15, wherein forming the AlN seed layer comprises: forming the first sublayer having a thickness ranging from about 20 nm to about 80 nm; and forming the second sublayer having a thickness ranging from about 50 nm to about 200 nm.