# US 10,483,345 B2 · Electronic component embedded substrate

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- Number: US 10,483,345 B2
- Document ID: US10483345B2
- Status: Granted
- Kind: B2
- Application number: 15/891,637
- Filed: 2018-02-08
- Published: 2018-08-16
- Granted: 2019-11-19
- Earliest claimed: 2017-02-13
- Assignees: TDK Corporation
- Applicants: TDK Corporation
- Inventors: Mitsuhiro Tomikawa; Koichi Tsunoda; Kazuhiro Yoshikawa; Kenichi Yoshida
- Web page: https://patentgrep.com/patent/US10483345B2

## CPC

- H10D 1/692: {Electrodes}
- H01G 4/228: Terminals
- H01G 4/236: leading through the housing, i.e. lead-through
- H01G 4/306: {made by thin film techniques}
- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H01G 4/385: {Single unit multiple capacitors, e.g. dual capacitor in one coil}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/068: wherein the coefficient of thermal expansion is important
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/685: comprising multiple insulating layers
- H10W 72/00: Interconnections or connectors in packages
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

## Claims

### Claim 1

An electronic component embedded substrate comprising:
a substrate configured to include an insulating layer and to have a first principal surface and a second principal surface on the opposite side of the first principal surface; and
an electronic component embedded in the substrate and configured to have a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals,
wherein
the electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer,
an insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals,
the insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other, and
the thermal expansion coefficient of the material of which the insulating member is formed is smaller than that of the material of which the insulating layer is formed, and is greater than that of a material of which the second terminals are formed.

### Claim 2 (depends on 1)

The electronic component embedded substrate according to claim 1, wherein:
the insulating member is provided close to the second principal surface with respect to the second terminals.

### Claim 3 (depends on 2)

The electronic component embedded substrate according to claim 2, wherein:
the substrate further includes a core embedded in the insulating layer;
a through-hole passing from the first principal surface side to the second principal surface side is provided in the core; and
the electronic component is disposed in the through-hole.

### Claim 4 (depends on 1)

The electronic component embedded substrate according to claim 1, wherein:
the substrate further includes a core embedded in the insulating layer;
a through-hole passing from the first principal surface side to the second principal surface side is provided in the core; and
the electronic component is disposed in the through-hole.