# US 10,483,289 B2 · Array substrate and manufacturing method thereof and display device

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- Number: US 10,483,289 B2
- Document ID: US10483289B2
- Status: Granted
- Kind: B2
- Application number: 15/764,974
- Filed: 2018-01-04
- Published: 2019-02-07
- Granted: 2019-11-19
- Earliest claimed: 2018-01-04
- Assignees: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicants: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Inventors: Wenying Li; Xiaodi Liu
- Web page: https://patentgrep.com/patent/US10483289B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10D 86/0229: {characterised by control of the annealing or irradiation parameters}
- H10D 86/40: characterised by multiple TFTs
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/471: {having different architectures, e.g. having both top-gate and bottom-gate TFTs}
- H10D 86/60: wherein the TFTs are in active matrices
- H10K 59/8794: {Arrangements for heating and cooling}
- H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
- H10W 40/10: Arrangements for heating
- G02F 1/133385: {with cooling means, e.g. fans}
- G02F 1/136295: {Materials; Compositions; Manufacture processes}
- G02F 2201/36: Airflow channels, e.g. constructional arrangements facilitating the flow of air
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

An array substrate includes a carrier plate, a first heat dissipation layer, and a function layer sequentially stacked on each other. The function layer is arranged on one side facing a user. The function layer includes a plurality of drive devices, metal wires and connection sections arranged between the plurality of drive devices. The plurality of drive devices are formed with openings. The connection sections each have an end extending through the openings to connect with one of the drive devices and an opposite end extending across the metal wires to connect with an adjacent one of the drive devices. The first heat dissipation layer conducts heat from the metal wires, the plurality of drive devices, and the connection sections through the carrier plate for dissipation. A method for manufacturing the array substrate and a display device are also provided.

## Claims

### Claim 1

An array substrate, comprising a carrier plate, a first heat dissipation layer, and a function layer arranged to stack in sequence on each other, the function layer being arranged on one side adapted to face a user, wherein the function layer comprises a plurality of drive devices and metal wires and connection sections arranged between the plurality of drive devices, the plurality of drive devices being formed therein with openings, the connection sections each having an end extending through the openings to connect to one of the drive devices and an opposite end extending across the metal wires to connect to an adjacent one of the drive devices, the first heat dissipation layer dissipating heat from the metal wires, the plurality of drive devices, and the connection sections through the carrier plate;
wherein a second heat dissipation layer is stacked on the carrier plate and is located on one side of the carrier plate that is opposite to the function layer.

### Claim 2 (depends on 1)

The array substrate according to claim 1, wherein the function layer comprises drive device zones, metal wire zones, and connection section zones, the drive device zones comprising the drive devices arranged therein, the metal wire zones comprising the metal wires arranged therein, the connection section zones comprising the connection sections arranged therein, the first heat dissipation layer having an orthogonal projection on the function layer that falls within the metal wire zones, the drive device zones, and the connection section zones.

### Claim 3 (depends on 2)

The array substrate according to claim 2 further comprising a light-transmitting layer, wherein the light-transmitting layer is filled in the first heat dissipation layer, the light-transmitting layer having a first surface facing the function layer, the first heat dissipation layer having a second surface facing the function layer, the first surface being flush with the second surface.

### Claim 4 (depends on 1)

The array substrate according to claim 1, wherein the function layer further comprises an insulation layer, the insulation layer being arranged on one side of the drive devices and the metal wires that is distant from the carrier plate, the connection sections being arranged on the insulation layer at one side thereof that is distant from the metal lines, the openings extending through the insulation layer to allow the connection sections and the drive devices to connect to each other.

### Claim 5 (depends on 1)

The array substrate according to claim 1, wherein the first heat dissipation layer comprises an insulating substance.

### Claim 6

A method for manufacturing an array substrate, comprising:
forming a first heat dissipation layer on a carrier plate;
forming a plurality of drive devices and a plurality of metal wires on the first heat dissipation layer, wherein the metal wires are arranged between the drive devices;
forming openings in the drive devices; and
forming connection sections on the first heat dissipation layer, such that the connection sections each have an end extending through the openings to connect with one of the drive devices and another end extending across the metal wires to connect with an adjacent one of the drive devices;
wherein the carrier plate is sputtered with a base target, and the base target of the carrier plate is subjected to plasma treatment or high temperature annealing in an oxygen atmosphere to form the first heat dissipation layer.

### Claim 7 (depends on 6)

The method for manufacturing an array substrate according to claim 6, wherein the first heat dissipation layer is formed through sputtering.

### Claim 8

A display device, comprising an array substrate, the array substrate comprising a carrier plate, a first heat dissipation layer, and a function layer arranged to stack in sequence on each other, the function layer being arranged on one side adapted to face a user, wherein the function layer comprises a plurality of drive devices and metal wires and connection sections arranged between the plurality of drive devices, the plurality of drive devices being formed therein with openings, the connection sections each having an end extending through the openings to connect to one of the drive devices and an opposite end extending across the metal wires to connect to an adjacent one of the drive devices, the first heat dissipation layer dissipating heat from the metal wires, the plurality of drive devices, and the connection sections through the carrier plate;
wherein the function layer comprises drive device zones, metal wire zones, and connection section zones, the drive device zones comprising the drive devices arranged therein, the metal wire zones comprising the metal wires arranged therein, the connection section zones comprising the connection sections arranged therein, the first heat dissipation layer having an orthogonal projection on the function layer that falls within the metal wire zones, the drive device zones, and the connection section zones; and
wherein the array substrate further comprises a light-transmitting layer, wherein the light-transmitting layer is filled in the first heat dissipation layer, the light-transmitting layer having a first surface facing the function layer, the first heat dissipation layer having a second surface facing the function layer, the first surface being flush with the second surface.

### Claim 9 (depends on 8)

The display device according to claim 8, wherein the array substrate further comprises a second heat dissipation layer, wherein the second heat dissipation layer is stacked on the carrier plate and is located on one side of the carrier plate that is opposite to the function layer.

### Claim 10 (depends on 8)

The display device according to claim 8, wherein the function layer further comprises an insulation layer, the insulation layer being arranged on one side of the drive devices and the metal wires that is distant from the carrier plate, the connection sections being arranged on the insulation layer at one side thereof that is distant from the metal lines, the openings extending through the insulation layer to allow the connection sections and the drive devices to connect to each other.

### Claim 11 (depends on 8)

The display device according to claim 8, wherein the first heat dissipation layer comprises an insulating substance.