# US 10,483,238 B2 · Ink printed wire bonding

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- Number: US 10,483,238 B2
- Document ID: US10483238B2
- Status: Granted
- Kind: B2
- Application number: 15/842,650
- Filed: 2017-12-14
- Published: 2018-04-26
- Granted: 2019-11-19
- Earliest claimed: 2016-10-26
- Assignees: STMicroelectronics S.r.l.
- Applicants: Stmicroelectronics S.R.L.
- Inventors: Federico Giovanni Ziglioli
- Web page: https://patentgrep.com/patent/US10483238B2

## CPC

- H10W 90/00: Package configurations
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/015: {of bond wires}
- H10W 72/90: Bond pads, in general
- H10W 74/016: {using moulds}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 72/075: {of bond wires}
- H10W 72/07531: {Techniques}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/354: {comprising polymers}
- H10W 72/531: {Shapes of wire connectors}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/5524: {comprising aluminium [Al]}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/553: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/823: {Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/20: Configurations of stacked chips
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/732: {between stacked chips}
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

## Claims

### Claim 1

A device, comprising:
a package substrate;
a plurality of contact pads on the package substrate;
a first die coupled to the package substrate;
a first plurality of pillars on the first die; and
a first plurality of ink printed wires, each of the first plurality of ink printed wires electrically coupled between at least one of the plurality of contact pads on the package substrate and at least a corresponding one of the first plurality of pillars on the first die, at least one of the first plurality of ink printed wires having a first width adjacent to the first die and a second width adjacent to the respective at least one of the plurality of contact pads, the first width being different than the second width, wherein the at least one of the first plurality of ink printed wires contacts a top surface and a side surface of one of the first plurality of pillars.

### Claim 2 (depends on 1)

The device of claim 1 wherein the first width is smaller than the second width.

### Claim 3 (depends on 1)

The device of claim 1, further comprising a second die on the first die and a second plurality of ink printed wires coupled between the second die and the plurality of contact pads.

### Claim 4 (depends on 3)

The device of claim 3 wherein molding compound surrounds the first and second plurality of ink printed wires.

### Claim 5 (depends on 3)

The device of claim 3 wherein the second die further comprises a second plurality of pillars on the second die, at least one of the first plurality of ink printed wires printed between and contacting at least one pillar of the first plurality of pillars and at least one pillar of the second plurality of pillars.

### Claim 6 (depends on 1)

The device of claim 1 wherein a first one of the first plurality of ink printed wires has a first material composition and a second one of the first plurality of ink printed wires has a second material composition different from the first material composition.

### Claim 7 (depends on 1)

The device of claim 1 wherein each of the first plurality of ink printed wires has a substantially rectangular cross-section.

### Claim 8 (depends on 1)

The device of claim 1 wherein at least one of the first plurality of ink printed wires is printed between and contacts at least two of the first plurality of pillars and at least one of the plurality of contact pads on the package substrate.

### Claim 9

A system, comprising:
a substrate;
a first die on the substrate, the first die including a first plurality of pillars; and
a first plurality of ink printed wires, each wire having a first surface facing the die and a second surface opposite the first surface, at least a first one of the first plurality of ink printed wires being coupled to a first one of the first plurality of pillars and the substrate and printed along and in contact with a top surface and a side surface of the first one of the first plurality of pillars, at least a second one of the first plurality of ink printed wires printed between and in contact with a second one and a third one of the first plurality of pillars.

### Claim 10 (depends on 9)

The system of claim 9 wherein at least one of the first plurality of ink printed wires has a first dimension and a second dimension, the first dimension being closer to the first die, the first dimension being different than the second dimension.

### Claim 11 (depends on 10)

The system of claim 10 where in the second dimension is smaller than the first dimension.

### Claim 12 (depends on 9)

The system of claim 9 further comprising an encapsulant that is between the first plurality of ink printed wires and the substrate.

### Claim 13 (depends on 9)

The system of claim 9, further comprising a second die on the first die and a second plurality of ink printed wires coupled between the second die and the substrate.

### Claim 14 (depends on 13)

The device of claim 13 further comprising:
a third plurality of ink printed wires coupled between the first die and the second die.

### Claim 15

A device, comprising:
a substrate;
a first die on the substrate;
a first pillar, a second pillar, and a third pillar on the first die, the first pillar having a first surface and a second surface transverse to the first surface;
a first ink printed wire having a rectangular cross-section coupled between the first pillar and the substrate, the first ink printed wire having a first width adjacent to the first die and a second width adjacent to the substrate, the first width being different than the second width, the first ink printed wire in contact with the first surface and the second surface of the first pillar; and
a second ink printed wire coupled between only the second pillar and the third pillar on the first die.

### Claim 16 (depends on 15)

The device of claim 15, further comprising a third wire having a rectangular cross-section coupled between the first die and the substrate, the third wire having a first width adjacent to the first die and a second width adjacent to the substrate, the first width being different than the second width.

### Claim 17 (depends on 15)

The device of claim 15 wherein the second wire contacts a top surface of each of the second pillar and the third pillar.

### Claim 18 (depends on 15)

The device of claim 15 further comprising:
a fourth pillar on the first die;
a second die on the first die, the second die having fifth and sixth pillars;
a fourth ink printed wire coupling the fifth pillar on the second die to the substrate; and
a fifth ink printed wire coupling the sixth pillar on the second die to the fourth pillar on the first die.

### Claim 19 (depends on 15)

The device of claim 15 wherein a height of the first pillar is less than a height of the second and third pillars.

### Claim 20 (depends on 15)

The device of claim 15 further comprising:
a fourth pillar on the first die; and
a secondary wire coupled between the fourth pillar on the first die and the substrate, the secondary wire having a circular cross-section and a composition that is different than a composition of the first ink printed wire and a composition of the second ink printed wire.