# US 10,483,231 B2 · Bonding method of fixing an object to a rough surface

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- Number: US 10,483,231 B2
- Document ID: US10483231B2
- Status: Granted
- Kind: B2
- Application number: 16/143,508
- Filed: 2018-09-27
- Published: 2019-07-04
- Granted: 2019-11-19
- Earliest claimed: 2017-12-28
- Assignees: Tsinghua University; Hon Hai Precision Industry Co., Ltd.
- Applicants: Tsinghua University; Hon Hai Precision Industry Co., Ltd.
- Inventors: Xiang Jin; Zi-Peng Wu; Wen-Tao Miao; Kai-Li Jiang; Shou-Shan Fan
- Web page: https://patentgrep.com/patent/US10483231B2

## CPC

- C01B 32/158: Carbon nanotubes
- C01B 32/162: characterised by catalysts
- C01B 32/168: After-treatment
- H10W 72/071: {Connecting or disconnecting}
- H10W 72/90: Bond pads, in general
- C01B 2202/08: Aligned nanotubes
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/013: {of die-attach connectors}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/01365: {Thermally treating (reflowing H10W72/01357)}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07311: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/853: {On the same surface}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 90/00: Package configurations
- H10W 90/732: {between stacked chips}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.

## Claims

### Claim 1

A bonding method comprising:
placing a sheet structure on a substrate surface of a substrate, wherein a surface roughness of the substrate surface is larger than 1.0 micrometer; the sheet structure comprises a first surface and a second surface opposite to the first surface, the first surface is in direct contact with the substrate surface, and a surface roughness of the second surface is less than or equal to 1.0 micrometer;
laying a carbon nanotube structure on the second surface, wherein the carbon nanotube structure comprises a first portion, a second portion, and a third portion, the first portion and the second portion are connected together by the third portion, the first portion and the second portion extend out of the second surface and are in direct contact with the substrate surface, the third portion is in direct contact with the sheet structure; the carbon nanotube structure comprises a super-aligned carbon nanotube film, the super-aligned carbon nanotube film comprises a plurality of carbon nanotubes, the plurality of carbon nanotubes extends substantially along a same direction, and an extending direction of the plurality of carbon nanotubes is substantially parallel to the second surface;
adding an organic solvent to the first portion and the second portion, to fix the sheet structure on the substrate surface only by the carbon nanotube structure;
laying an object on and in direct contact with the third portion, wherein the carbon nanotube structure is located between the sheet structure and the object, and a surface of the object being in direct contact with the third portion has a surface roughness less than or equal to 1.0 micrometer; and
applying a pressure to the object to make the object bonded to the substrate surface and forming a structure comprising the substrate, the sheet structure, the carbon nanotube structure and the object.

### Claim 2 (depends on 1)

The bonding method of claim 1, further comprising cooling the structure in an environment of about −196° C.˜−100° C.

### Claim 3 (depends on 1)

The bonding method of claim 1, further comprising heating the structure in an environment of about 800° C.˜1000° C.

### Claim 4 (depends on 1)

The bonding method of claim 1, wherein the bonding method is performed in an environment of about −196° C. to about 1000° C.

### Claim 5 (depends on 4)

The bonding method of claim 4, wherein the bonding method is performed in an environment of about −196° C. to about −100° C.

### Claim 6 (depends on 4)

The bonding method of claim 4, wherein the bonding method is performed in an environment of about 800° C. to about 1000° C.

### Claim 7 (depends on 1)

The bonding method of claim 1, wherein the laying a carbon nanotube structure on and in direct contact with the second surface comprises:
providing a super-aligned carbon nanotube array;
drawing the super-aligned carbon nanotube film from the super-aligned carbon nanotube array; and
directly laying the super-aligned carbon nanotube film on the second surface.

### Claim 8 (depends on 7)

The bonding method of claim 7, wherein the laying the carbon nanotube structure on and in direct contact with the first surface further comprises:
stretching the super-aligned carbon nanotube film along the extend direction of the plurality of carbon nanotubes of the super-aligned carbon nanotube film after drawing the super-aligned carbon nanotube film from the super-aligned carbon nanotube array and before directly laying the super-aligned carbon nanotube film on the second surface.

### Claim 9 (depends on 8)

The bonding method of claim 8, wherein a percentage of a stretch length and a length of the super-aligned carbon nanotube film before stretching ranges from about 0.574% to about 1.724%.

### Claim 10 (depends on 1)

The bonding method of claim 1, wherein the laying the carbon nanotube structure on and in direct contact with the second surface comprises:
drawing at least one super-aligned carbon nanotube film from a super-aligned carbon nanotube array;
laying the at least one super-aligned carbon nanotube film on a support structure, to form the carbon nanotube structure; and
transferring the carbon nanotube structure from the support structure to the second surface.

### Claim 11 (depends on 10)

The bonding method of claim 10, wherein the support structure is a frame structure, the carbon nanotube structure is partially suspended to form a suspended portion; and the transferring the carbon nanotube structure from the support structure to the second surface comprises directly placing the suspended portion on the second surface; and then removing the frame structure.

### Claim 12 (depends on 1)

The bonding method of claim 1, wherein an amount of the pressure ranges from about 3N/cm2 to about 5N/cm2.

### Claim 13 (depends on 1)

The bonding method of claim 1, wherein the plurality of carbon nanotubes are pure carbon nanotubes.

### Claim 14 (depends on 1)

The bonding method of claim 1, wherein the carbon nanotube structure comprises 10˜15 layers of the super-aligned carbon nanotube films overlapped and paralleled with each other.

### Claim 15 (depends on 1)

The bonding method of claim 1, wherein the carbon nanotube structure consists of at least one super-aligned carbon nanotube film and the super-aligned carbon nanotube film consists of a plurality of carbon nanotubes.

### Claim 16

A bonding method of fixing an object on a substrate comprising:
placing a sheet structure on a substrate surface of the substrate, the sheet structure comprises a first surface and a second surface opposite to the first surface, the first surface is in direct contact with the substrate surface, and a surface roughness of the second surface is less than or equal to 1.0 micrometer;
laying a carbon nanotube structure on the second surface, wherein the carbon nanotube structure comprises a first portion, a second portion, and a third portion, the first portion and the second portion are connected together by the third portion, the first portion and the second portion extend out of the second surface and are in direct contact with the substrate surface, the third portion is in direct contact with the sheet structure; the carbon nanotube structure comprises a super-aligned carbon nanotube film, the super-aligned carbon nanotube film comprises a plurality of carbon nanotubes, the plurality of carbon nanotubes extends substantially along a same direction, and an extending direction of the plurality of carbon nanotubes is substantially parallel to the second surface;
fixing the first portion and the second portion on the substrate surface, and thus to fix the sheet structure on the substrate surface;
laying the object on and in direct contact with the third portion, wherein the carbon nanotube structure is located between the sheet structure and the object, and a surface of the object being in direct contact with the third portion has a surface roughness less than or equal to 1.0 micrometer; and
applying a pressure to the object to make the object bonded to the substrate surface and forming a structure comprising the substrate, the sheet structure, the carbon nanotube structure and the object.

### Claim 17 (depends on 16)

The bonding method of claim 16, further comprising cooling the structure in an environment of about −196° C.˜−100° C.

### Claim 18 (depends on 16)

The bonding method of claim 16, further comprising heating the structure in an environment of about 800° C.˜1000° C.

### Claim 19 (depends on 16)

The bonding method of claim 16, wherein the bonding method is performed in an environment of about −196° C. to about −100° C.

### Claim 20 (depends on 16)

The bonding method of claim 16, wherein the bonding method is performed in an environment of about 800° C. to about 1000° C.