# US 10,483,230 B2 · Bonding package components through plating

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- Number: US 10,483,230 B2
- Document ID: US10483230B2
- Status: Granted
- Kind: B2
- Application number: 15/632,686
- Filed: 2017-06-26
- Published: 2017-10-12
- Granted: 2019-11-19
- Earliest claimed: 2012-06-19
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Zheng-Yi Lim; Yi-Wen Wu; Tzong-Hann Yang; Ming-Che Ho; Chung-Shi Liu
- Web page: https://patentgrep.com/patent/US10483230B2

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/50: Bond wires
- H10W 74/01: Manufacture or treatment
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/01212: {at a different location than on the final device, e.g. forming solder preforms}
- H10W 72/01215: {forming coatings}
- H10W 72/016: {of strap connectors}
- H10W 72/072: {of bump connectors}
- H10W 72/07221: {Aligning}
- H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07255: {changes in materials}
- H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
- H10W 72/223: {characterised by the structure of the outermost layers, e.g. multilayered coatings}
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/251: {Materials}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/2528: {Intermetallic compounds}
- H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/90: Bond pads, in general
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/721: {of bump connectors}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/731: {of die-attach connectors}
- H10W 90/732: {between stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

## Claims

### Claim 1

A package comprising:
a first package component comprising a first electrical connector, wherein the first electrical connector comprises a first sidewall surface;
a second package component comprising a second electrical connector, wherein the second electrical connector comprises a second sidewall surface; and
a metal layer formed of a non-solder metallic material, the metal layer comprising:
a first portion on the first sidewall surface;
a second portion on the second sidewall surface, wherein the first portion is continuously connected to the second portion, and the first electrical connector and the second electrical connector are physically separated from each other; and
a third portion completely separating the first electrical connector and the second electrical connector from each other, wherein the first portion, the second portion, and the third portion form a single continuous layer.

### Claim 2 (depends on 1)

The package of claim 1, wherein the third portion has opposite surfaces in physical contact with a first surface of the first electrical connector and a second surface of the second electrical connector, respectively, and the opposite surfaces of the third portion of the metal layer are parallel to each other.

### Claim 3 (depends on 2)

The package of claim 2, wherein the third portion of the metal layer has a substantially uniform thickness.

### Claim 4 (depends on 1)

The package of claim 1, wherein the metal layer is formed of a non-solder material.

### Claim 5 (depends on 1)

The package of claim 1, wherein the first portion and the second portion of the metal layer are parts of a continuous layer, with no distinguishable interface between the first portion and the second portion.

### Claim 6 (depends on 1)

The package of claim 1, wherein the metal layer comprises an additional metal layer forming a ring encircling the metal layer and the first and the second electrical connectors, wherein the metal layer and the additional metal layer are formed of different materials.

### Claim 7 (depends on 6)

The package of claim 6, wherein the additional metal layer is free from portions between the first electrical connector and the second electrical connector.

### Claim 8

A package comprising:
a first package component comprising:
a package substrate;
a device die bonded to a top surface of the package substrate;
an encapsulating material encapsulating the device die therein;
a first electrical connector with a first portion in the encapsulating material, and a second portion protruding out of the first electrical connector;
a second package component over the first package component, the second package component comprising a second electrical connector; and
an integral metal layer formed of a non-solder metallic material, the integral metal layer being a single continuous layer that comprises:
a first portion on a first sidewall surface of the first electrical connector, wherein at least a portion of the first portion of the integral metal layer is encapsulated in the encapsulating material;
a second portion on a second sidewall surface of the second electrical connector; and
a third portion completely separating the first electrical connector and the second electrical connector from each other, wherein the first portion, the second portion, and the third portion form a single continuous layer.

### Claim 9 (depends on 8)

The package of claim 8, wherein the second portion of the integral metal layer is outside of the encapsulating material.

### Claim 10 (depends on 8)

The package of claim 8, wherein the device die has a top surface substantially coplanar with a top surface of the encapsulating material.

### Claim 11 (depends on 8)

The package of claim 8, wherein the first package component further comprises a third electrical connector, and the device die further comprises a fourth electrical connector, and wherein the package further comprises:
an additional integral metal layer on sidewalls of the third electrical connector and the fourth electrical connector, wherein the additional integral metal layer and the integral metal layer are formed of a same metallic material.

### Claim 12 (depends on 8)

The package of claim 8, wherein the first portion, the second portion, and the third portion are formed of a same homogenous material.

### Claim 13 (depends on 8)

The package of claim 8, wherein the first electrical connector and the second electrical connector are spaced apart from each other, and the integral metal layer separates the first electrical connector from the second electrical connector.

### Claim 14 (depends on 8)

The package of claim 8 further comprising an additional metal layer formed of a second conductive material different from a first conductive material of the integral metal layer, wherein the additional metal layer comprises portions on opposite sides of the integral metal layer and the first and the second electrical connectors.

### Claim 15 (depends on 8)

The package of claim 8, wherein the first and the second portions of the integral metal layer have straight outer sidewalls parallel to respective sidewall portions of the first electrical connector and the second electrical connector, respectively.

### Claim 16

A package comprising:
a first package component comprising a first electrical connector, wherein the first electrical connector comprises a first surface and first sidewall surfaces;
a second package component comprising a second electrical connector, wherein the second electrical connector comprises a second surface and second sidewall surfaces;
and a first metal layer formed of a non-solder metallic material comprising:
a first portion contacting the first sidewall surfaces;
a second portion contacting the second sidewall surfaces; and
a third portion, wherein entireties of the first surface of the first electrical connector and the second surface of the second electrical connector are in contact with the third portion of the first metal layer, wherein the first portion, the second portion, and the third portion are formed of a same material, and are connected as a continuous region, and the third portion of the first metal layer fully separates the first electrical connector from the second electrical connector.

### Claim 17 (depends on 16)

The package of claim 16, wherein the first surface and the second surface are parallel to each other, and are separated from each other by the third portion of the first metal layer.

### Claim 18 (depends on 16)

The package of claim 16 further comprising a second metal layer contacting the first portion and the second portion of the first metal layer, wherein the first metal layer and the second metal layer are formed of different non-solder metallic materials.

### Claim 19 (depends on 16)

The package of claim 16, wherein the first portion and the second portion of the first metal layer have a same thickness.