# US 10,483,229 B2 · Sintering device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,483,229 B2 - Document ID: US10483229B2 - Status: Granted - Kind: B2 - Application number: 15/514,548 - Filed: 2015-09-09 - Published: 2017-08-10 - Granted: 2019-11-19 - Earliest claimed: 2014-09-29 - Assignees: Danfoss Silicon Power GmbH - Applicants: Danfoss Silicon Power GmbH - Inventors: Frank Osterwald; Ronald Eisele; Martin Becker; Lars Paulsen; Jacek Rudzki; Holger Ulrich - Web page: https://patentgrep.com/patent/US10483229B2 ## CPC - B22F 5/00: Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product - H10W 72/073: {of die-attach connectors} - B22F 3/14: simultaneously - B22F 2998/10: Processes characterised by the sequence of their steps - H10W 72/0711: {Apparatus therefor} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts} - H10W 72/07178: {Means for aligning} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die. ## Claims ### Claim 1 A sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die, wherein the lower die forms a support for the assembly to be sintered and the upper die comprises a receptacle which receives a pressure pad for exerting pressure directed towards the lower die and which comprises a delimitation wall which laterally surrounds the pressure pad, and wherein the delimitation wall has an outer delimitation wall and an inner delimitation wall which is surrounded in an adjacent manner by the outer delimitation wall, and wherein the inner delimitation wall is mounted so as to be slidable towards the outer delimitation wall and, when pressure in the direction of the upper die is exerted on the pressure pad, is mounted so as to be slid in the direction of the lower die, whereby, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die. ### Claim 2 (depends on 1) The sintering device according to claim 1, wherein the pressure pad, in the event of movement of the inner delimitation wall in the direction of the upper die, is adapted as a counter bearing for the inner delimitation wall. ### Claim 3 (depends on 1) The sintering device according to claim 1, wherein the inner delimitation wall protrudes in the direction of the lower die, beyond the outer delimitation wall. ### Claim 4 (depends on 1) The sintering device according to claim 1, wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material. ### Claim 5 (depends on 1) The sintering device according to claim 1, wherein the outer and the inner delimitation walls are configured so as to be annular. ### Claim 6 (depends on 1) The sintering device according to claim 1, wherein the pressure pad is a silicone pad or a rubber pad. ### Claim 7 (depends on 1) The sintering device according to claim 1, wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies. ### Claim 8 (depends on 1) The sintering device according to claim 1, wherein a protective film is disposed between the assembly and the upper die. ### Claim 9 (depends on 2) The sintering device according to claim 2, wherein the inner delimitation wall protrudes in the direction of the lower die, beyond the outer delimitation wall. ### Claim 10 (depends on 2) The sintering device according to claim 2, wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material. ### Claim 11 (depends on 3) The sintering device according to claim 3, wherein the inner delimitation wall is formed from an oxidic, polymer or metallic material. ### Claim 12 (depends on 2) The sintering device according to claim 2, wherein the outer and the inner delimitation walls are configured so as to be annular. ### Claim 13 (depends on 3) The sintering device according to claim 3, wherein the outer and the inner delimitation walls are configured so as to be annular. ### Claim 14 (depends on 4) The sintering device according to claim 4, wherein the outer and the inner delimitation walls are configured so as to be annular. ### Claim 15 (depends on 2) The sintering device according to claim 2, wherein the pressure pad is a silicone pad or a rubber pad. ### Claim 16 (depends on 3) The sintering device according to claim 3, wherein the pressure pad is a silicone pad or a rubber pad. ### Claim 17 (depends on 4) The sintering device according to claim 4, wherein the pressure pad is a silicone pad or a rubber pad. ### Claim 18 (depends on 5) The sintering device according to claim 5, wherein the pressure pad is a silicone pad or a rubber pad. ### Claim 19 (depends on 2) The sintering device according to claim 2, wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies. ### Claim 20 (depends on 3) The sintering device according to claim 3, wherein the lower die comprises a depression for receiving the assembly to be sintered or a workpiece carrier for a plurality of assemblies.